InxGa1-xAsYP1-Y quaternary etch stop for improved chemical resistivity of gallium arsenide field effect transistors
    9.
    发明授权
    InxGa1-xAsYP1-Y quaternary etch stop for improved chemical resistivity of gallium arsenide field effect transistors 有权
    InxGa1-xAsYP1-Y四次蚀刻停止,用于提高砷化镓场效应晶体管的化学电阻率

    公开(公告)号:US08288253B1

    公开(公告)日:2012-10-16

    申请号:US13173006

    申请日:2011-06-30

    IPC分类号: H01L21/20 H01L21/36

    摘要: A process for fabricating a semiconductor device. The process including (a) growing a channel layer on a buffer layer, (b) growing a barrier layer on the channel layer, (c) epitaxially growing a quaternary etch-stop layer on the barrier layer, (d) growing a first contact layer on the quaternary etch-stop layer, (e) growing a second contact layer on the first contact layer, (f) etching portions of the second contact layer to reveal a first recess surface, and (g) etching portions of the first contact layer to reveal a second recess surface. The second contact layer may be a highly doped contact layer. The second recess surface generally forms a gate region. The first and the second contact layers have a first etch rate and the quaternary etch-stop layer has a second etch rate in a chosen first etch chemistry.

    摘要翻译: 一种制造半导体器件的工艺。 该方法包括(a)在缓冲层上生长通道层,(b)在沟道层上生长阻挡层,(c)在阻挡层上外延生长四分之一蚀刻停止层,(d)生长第一接触 (e)在第一接触层上生长第二接触层,(f)蚀刻第二接触层的部分以露出第一凹部表面,以及(g)蚀刻第一接触部分 层以露出第二凹槽表面。 第二接触层可以是高度掺杂的接触层。 第二凹面通常形成栅极区域。 第一和第二接触层具有第一蚀刻速率,并且四次蚀刻停止层在所选择的第一蚀刻化学中具有第二蚀刻速率。

    Process for selective recess etching of epitaxial field effect
transistors with a novel etch-stop layer
    10.
    发明授权
    Process for selective recess etching of epitaxial field effect transistors with a novel etch-stop layer 失效
    用新颖的蚀刻停止层对外延场效应晶体管进行选择性凹陷蚀刻的工艺

    公开(公告)号:US6060402A

    公开(公告)日:2000-05-09

    申请号:US121160

    申请日:1998-07-23

    申请人: Allen W. Hanson

    发明人: Allen W. Hanson

    CPC分类号: H01L29/66462 H01L21/30612

    摘要: A process for selective recess etching of GaAs field-effect transistors. A selected etch stop layer (In.sub.x Ga.sub.1-x P) maintains what is commonly referred to as lattice-match with the GaAs substrate material. By using this etch stop, a significant reduction in access resistances is realized with respect to devices containing other etch stop materials while an improvement in the uniformity of device characteristics across the wafer and from wafer to wafer is realized.

    摘要翻译: 用于选择性凹陷蚀刻GaAs场效应晶体管的工艺。 所选择的蚀刻停止层(In x Ga 1-x P)保持通常称为与GaAs衬底材料的晶格匹配。 通过使用该蚀刻停止件,相对于含有其它蚀刻停止材料的器件实现了访问电阻的显着降低,同时实现了跨晶片和从晶片到晶片的器件特性的均匀性的改善。