SEMICONDUCTOR DEVICE-BASED SENSORS AND METHODS ASSOCIATED WITH THE SAME
    8.
    发明申请
    SEMICONDUCTOR DEVICE-BASED SENSORS AND METHODS ASSOCIATED WITH THE SAME 审中-公开
    基于半导体器件的传感器和与之相关的方法

    公开(公告)号:US20080185616A1

    公开(公告)日:2008-08-07

    申请号:US12023500

    申请日:2008-01-31

    IPC分类号: H01L29/78

    摘要: Semiconductor device-based chemical sensors and methods associated with the same are provided. The sensors include regions that can interact with chemical species being detected. The chemical species may, for example, be a component of a fluid (e.g., gas or liquid). The interaction between the chemical species and a region of the sensor causes a change in a measurable property (e.g., an electrical property) of the device. These changes may be related to the concentration of the chemical species in the medium being characterized.

    摘要翻译: 提供了基于半导体器件的化学传感器和与其相关联的方法。 这些传感器包括可以与被检测的化学物质相互作用的区域。 化学物质可以例如是流体(例如气体或液体)的组分。 化学物质和传感器的区域之间的相互作用导致装置的可测量性质(例如,电气性能)的改变。 这些变化可能与所述介质中化学物质的浓度有关。

    Indium gallium nitride channel high electron mobility transistors, and method of making the same
    9.
    发明授权
    Indium gallium nitride channel high electron mobility transistors, and method of making the same 有权
    氮化铟镓沟道高电子迁移率晶体管及其制造方法

    公开(公告)号:US06727531B1

    公开(公告)日:2004-04-27

    申请号:US09633598

    申请日:2000-08-07

    IPC分类号: H01L313028

    CPC分类号: H01L29/7783 H01L29/2003

    摘要: A gallium nitride-based HEMT device, comprising a channel layer formed of an InGaN alloy. Such device may comprise an AlGaN/InGaN heterostructure, e.g., in a structure including a GaN layer, an InGaN layer over the GaN layer, and a (doped or undoped) AlGaN layer over the InGaN layer. Alternatively, the HEMT device of the invention may be fabricated as a device which does not comprise any aluminum-containing layer, e.g., a GaN/InGaN HEMT device or an InGaN/InGaN HEMT device.

    摘要翻译: 一种基于氮化镓的HEMT器件,包括由InGaN合金形成的沟道层。 这样的器件可以包括AlGaN / InGaN异质结构,例如在包括GaN层,GaN层上的InGaN层和InGaN层上的(掺杂或未掺杂的)AlGaN层的结构中。 或者,本发明的HEMT器件可以制造为不包含任何含铝层的器件,例如GaN / InGaN HEMT器件或InGaN / InGaN HEMT器件。

    Gallium nitride materials and methods associated with the same
    10.
    发明授权
    Gallium nitride materials and methods associated with the same 有权
    氮化镓材料和方法相关

    公开(公告)号:US08748298B2

    公开(公告)日:2014-06-10

    申请号:US12023451

    申请日:2008-01-31

    IPC分类号: H01L21/20 H01L21/36

    摘要: Semiconductor materials including a gallium nitride material region and methods associated with such structures are provided. The semiconductor structures include a strain-absorbing layer formed within the structure. The strain-absorbing layer may be formed between the substrate (e.g., a silicon substrate) and an overlying layer. It may be preferable for the strain-absorbing layer to be very thin, have an amorphous structure and be formed of a silicon nitride-based material. The strain-absorbing layer may reduce the number of misfit dislocations formed in the overlying layer (e.g., a nitride-based material layer) which limits formation of other types of defects in other overlying layers (e.g., gallium nitride material region), amongst other advantages. Thus, the presence of the strain-absorbing layer may improve the quality of the gallium nitride material region which can lead to improved device performance.

    摘要翻译: 提供了包括氮化镓材料区域的半导体材料和与这种结构相关联的方法。 半导体结构包括在该结构内形成的应变吸收层。 应变吸收层可以形成在衬底(例如,硅衬底)和上覆层之间。 应变吸收层非常薄,具有非晶结构并且由氮化硅基材料形成可能是优选的。 应变吸收层可以减少在上层(例如,氮化物基材料层)中形成的失配位错的数量,其限制在其它覆盖层(例如,氮化镓材料区域)中形成其他类型的缺陷,其他 优点。 因此,应变吸收层的存在可以提高氮化镓材料区域的质量,这可以导致改进的器件性能。