公开(公告)号：US12176256B2

公开(公告)日：2024-12-24

申请号：US18196513

申请日：2023-05-12

Applicant: Amkor Technology Singapore Holding Pte. Ltd.

Inventor： Wang Gu Lee ,  Gam Han Yong ,  Ju Hong Shin ,  Ji Hun Yi

IPC: H01L23/16 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: In one example, a semiconductor device includes a substrate comprising a conductive structure including internal terminals over a substrate first side and external terminals over a substrate second side coupled to the internal terminals. An electronic component includes an electronic component first side, an electronic component second side opposite to the electronic component first side, and an electronic component lateral side connecting the electronic component first side to the electronic component second side. The electronic component second side is coupled to one or more of the internal terminals. A guide structure is over the substrate first side and can include an inner portion that is laterally inward from the electronic component lateral side and an outer portion that is laterally outward from the electronic component lateral side. An underfill is interposed between the electronic component second side and the substrate first side and is over the guide structure.

公开(公告)号：US20240250035A1

公开(公告)日：2024-07-25

申请号：US18098806

申请日：2023-01-19

Applicant: Amkor Technology Singapore Holding Pte. Ltd.

Inventor： Se Hwan Hong ,  Min Su Jeong ,  Gam Han Yong ,  Won Chul Do ,  Ji Hun Lee ,  Jae Yoon Kim ,  Jin Hyuk Chang ,  Ji Yeon Ryu ,  Dong Hoon Han

IPC: H01L23/538 ,  H01L21/56 ,  H01L21/60 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/522 ,  H01L23/544

CPC classification number: H01L23/5385 ,  H01L21/56 ,  H01L21/60 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/5226 ,  H01L23/5386 ,  H01L23/544 ,  H01L24/08 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L2021/60075 ,  H01L2021/6009 ,  H01L2224/08113 ,  H01L2224/16112 ,  H01L2224/16235 ,  H01L2224/1703 ,  H01L2224/17055 ,  H01L2224/32059 ,  H01L2224/32225 ,  H01L2224/3303 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48225 ,  H01L2924/1016 ,  H01L2924/1811 ,  H01L2924/182

Abstract: In one example, an electronic device includes a lower substrate comprising a lower substrate upper side and a lower substrate lower side, and an upper substrate comprising an upper substrate upper side and an upper substrate lower side. The electronic device also includes a first electronic component and a second electronic component coupled to the upper substrate upper side. A first device interconnect and a second device interconnect couple the lower substrate upper side to the upper substrate lower side. The electronic device also includes a connect die coupled to the lower substrate upper side that electrically couples the first electronic component to the second electronic component. Other examples and related methods are also disclosed herein.

公开(公告)号：US11688657B2

公开(公告)日：2023-06-27

申请号：US17172210

申请日：2021-02-10

Applicant: Amkor Technology Singapore Holding Pte. Ltd.

Inventor： Wang Gu Lee ,  Gam Han Yong ,  Ju Hong Shin ,  Ji Hun Yi

IPC: H01L23/16 ,  H01L23/31 ,  H01L23/498 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/16 ,  H01L21/486 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/16 ,  H01L2221/68372 ,  H01L2224/16227 ,  H01L2924/18161

Abstract: In one example, a semiconductor device includes a substrate having a substrate first side, a substrate second side opposite to the substrate first side, and a conductive structure including internal terminals over the substrate first side; and external terminals over the substrate second side and coupled to the internal terminals. An electronic component includes an electronic component first side, an electronic component second side opposite to the electronic component first side, and an electronic component lateral side connecting the electronic component first side to the electronic component second side. The electronic component second side is coupled to one or more of the internal terminals. A guide structure is over the substrate first side and can include an inner portion that is laterally inward from the electronic component lateral side and an outer portion that is laterally outward from the electronic component lateral side. An underfill is interposed between the electronic component second side and the substrate first side and is over the guide structure. Other examples and related methods are also disclosed herein.

公开(公告)号：US20230154893A1

公开(公告)日：2023-05-18

申请号：US18098782

申请日：2023-01-19

Applicant: Amkor Technology Singapore Holding Pte. Ltd.

Inventor： David Hiner ,  Michael Kelly ,  Ronald Huemoeller ,  In Su Mok ,  Sang Hyoun Lee ,  Won Chul Do ,  Jin Young Khim ,  Gam Han Yong ,  Min Su Jeong ,  Ji Hun Lee

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/538 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L21/683

CPC classification number: H01L25/0655 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3185 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/14 ,  H01L24/16 ,  H01L24/73 ,  H01L24/97 ,  H01L25/50 ,  H01L23/49816 ,  H01L2224/18 ,  H01L2224/97 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/95001

Abstract: A semiconductor package structure and a method for making a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a connect die that routes electrical signals between a plurality of other semiconductor die.