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公开(公告)号：US11682598B2
公开(公告)日：2023-06-20
申请号：US17527767
申请日：2021-11-16
发明人： Ji Young Chung , Dong Joo Park , Jin Seong Kim , Jae Sung Park , Se Hwan Hong
IPC分类号： H01L23/15 , H01L23/00 , G06V40/13 , H01L23/498 , H01L23/495 , H01L23/31 , H01L21/56
CPC分类号： H01L23/15 , G06V40/1329 , H01L24/48 , H01L21/561 , H01L23/3121 , H01L23/4952 , H01L23/49805 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/73 , H01L2224/02166 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/2919 , H01L2224/32225 , H01L2224/33181 , H01L2224/48091 , H01L2224/48105 , H01L2224/48165 , H01L2224/48227 , H01L2224/48992 , H01L2224/48997 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/15313 , H01L2924/181 , H01L2224/97 , H01L2224/83 , H01L2224/97 , H01L2224/85 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2224/45099 , H01L2224/05647 , H01L2924/00015 , H01L2224/05624 , H01L2924/00015 , H01L2224/05639 , H01L2924/00015 , H01L2224/05644 , H01L2924/00015 , H01L2224/05655 , H01L2924/00015 , H01L2224/73265 , H01L2224/32225 , H01L2224/48227 , H01L2924/00012 , H01L2224/92247 , H01L2224/73265 , H01L2224/32225 , H01L2224/48227 , H01L2924/00012 , H01L2224/2919 , H01L2924/00014 , H01L2224/48091 , H01L2924/00014
摘要： A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.
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公开(公告)号：US20200381395A1
公开(公告)日：2020-12-03
申请号：US16429553
申请日：2019-06-03
发明人： Gyu Wan Han , Won Bae Bang , Ju Hyung Lee , Min Hwa Chang , Dong Joo Park , Jin Young Khim , Jae Yun Kim , Se Hwan Hong , Seung Jae Yu , Shaun Bowers , Gi Tae Lim , Byoung Woo Cho , Myung Jea Choi , Seul Bee Lee
IPC分类号： H01L25/065 , H01L25/00
摘要： In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The second internal interconnect can be coupled to the second electronic device and the first electronic device. The encapsulant can cover the substrate inner sidewall and the device stack, and can fill the cavity. Other examples and related methods are disclosed herein.
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公开(公告)号：US12002725B2
公开(公告)日：2024-06-04
申请号：US18199215
申请日：2023-05-18
发明人： Ji Young Chung , Dong Joo Park , Jin Seong Kim , Jae Sung Park , Se Hwan Hong
IPC分类号： H01L23/15 , G06V40/13 , H01L23/00 , H01L21/56 , H01L23/31 , H01L23/495 , H01L23/498
CPC分类号： H01L23/15 , G06V40/1329 , H01L24/48 , H01L21/561 , H01L23/3121 , H01L23/4952 , H01L23/49805 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/73 , H01L2224/02166 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/2919 , H01L2224/32225 , H01L2224/33181 , H01L2224/48091 , H01L2224/48105 , H01L2224/48165 , H01L2224/48227 , H01L2224/48992 , H01L2224/48997 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/15313 , H01L2924/181 , H01L2224/97 , H01L2224/83 , H01L2224/97 , H01L2224/85 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2224/45099 , H01L2224/05647 , H01L2924/00015 , H01L2224/05624 , H01L2924/00015 , H01L2224/05639 , H01L2924/00015 , H01L2224/05644 , H01L2924/00015 , H01L2224/05655 , H01L2924/00015 , H01L2224/73265 , H01L2224/32225 , H01L2224/48227 , H01L2924/00012 , H01L2224/92247 , H01L2224/73265 , H01L2224/32225 , H01L2224/48227 , H01L2924/00012 , H01L2224/2919 , H01L2924/00014 , H01L2224/48091 , H01L2924/00014
摘要： A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.
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公开(公告)号：US20230290699A1
公开(公告)日：2023-09-14
申请号：US18199215
申请日：2023-05-18
发明人： Ji Young Chung , Dong Joo Park , Jin Seong Kim , Jae Sung Park , Se Hwan Hong
CPC分类号： H01L23/15 , H01L24/48 , G06V40/1329 , H01L23/49805
摘要： A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.
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公开(公告)号：US11495505B2
公开(公告)日：2022-11-08
申请号：US17018434
申请日：2020-09-11
发明人： Gyu Wan Han , Won Bae Bang , Ju Hyung Lee , Min Hwa Chang , Dong Joo Park , Jin Young Khim , Jae Yun Kim , Se Hwan Hong , Seung Jae Yu , Shaun Bowers , Gi Tae Lim , Byoung Woo Cho , Myung Jea Choi , Seul Bee Lee , Sang Goo Kang , Kyung Rok Park
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/13 , H01L21/56 , H01L23/00 , H01L25/065 , H01L23/31 , H01L25/18 , H01L23/498
摘要： In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
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公开(公告)号：US20240321658A1
公开(公告)日：2024-09-26
申请号：US18680167
申请日：2024-05-31
发明人： Ji Young Chung , Dong Joo Park , Jin Seong Kim , Jae Sung Park , Se Hwan Hong
IPC分类号： H01L23/15 , G06V40/13 , H01L21/56 , H01L23/00 , H01L23/31 , H01L23/495 , H01L23/498
CPC分类号： H01L23/15 , G06V40/1329 , H01L24/48 , H01L21/561 , H01L23/3121 , H01L23/4952 , H01L23/49805 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/73 , H01L2224/02166 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/2919 , H01L2224/32225 , H01L2224/33181 , H01L2224/48091 , H01L2224/48105 , H01L2224/48165 , H01L2224/48227 , H01L2224/48992 , H01L2224/48997 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/15313 , H01L2924/181
摘要： A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.
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公开(公告)号：US20240258182A1
公开(公告)日：2024-08-01
申请号：US18633941
申请日：2024-04-12
发明人： Gyu Wan Han , Won Bae Bang , Ju Hyung Lee , Min Hwa Chang , Dong Joo Park , Jin Young Khim , Jae Yun Kim , Se Hwan Hong , Seung Jae Yu , Shaun Bowers , Gi Tae Lim , Byoung Woo Cho , Myung Jea Choi , Seul Bee Lee , Sang Goo Kang , Kyung Rok Park
IPC分类号： H01L23/13 , H01L21/56 , H01L23/00 , H01L23/31 , H01L23/498 , H01L25/065 , H01L25/18
CPC分类号： H01L23/13 , H01L21/568 , H01L23/3185 , H01L23/49816 , H01L24/48 , H01L24/85 , H01L25/0657 , H01L25/18 , H01L2224/48145 , H01L2224/48157 , H01L2224/85005 , H01L2225/06506 , H01L2225/0651 , H01L2225/06562
摘要： In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
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公开(公告)号：US11961775B2
公开(公告)日：2024-04-16
申请号：US17982713
申请日：2022-11-08
发明人： Gyu Wan Han , Won Bae Bang , Ju Hyung Lee , Min Hwa Chang , Dong Joo Park , Jin Young Khim , Jae Yun Kim , Se Hwan Hong , Seung Jae Yu , Shaun Bowers , Gi Tae Lim , Byoung Woo Cho , Myung Jea Choi , Seul Bee Lee , Sang Goo Kang , Kyung Rok Park
IPC分类号： H01L23/48 , H01L21/56 , H01L23/00 , H01L23/13 , H01L23/31 , H01L23/498 , H01L23/52 , H01L25/065 , H01L25/18 , H01L29/40
CPC分类号： H01L23/13 , H01L21/568 , H01L23/3185 , H01L23/49816 , H01L24/48 , H01L24/85 , H01L25/0657 , H01L25/18 , H01L2224/48145 , H01L2224/48157 , H01L2224/85005 , H01L2225/06506 , H01L2225/0651 , H01L2225/06562
摘要： In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
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公开(公告)号：US20240250035A1
公开(公告)日：2024-07-25
申请号：US18098806
申请日：2023-01-19
发明人： Se Hwan Hong , Min Su Jeong , Gam Han Yong , Won Chul Do , Ji Hun Lee , Jae Yoon Kim , Jin Hyuk Chang , Ji Yeon Ryu , Dong Hoon Han
IPC分类号： H01L23/538 , H01L21/56 , H01L21/60 , H01L23/00 , H01L23/31 , H01L23/498 , H01L23/522 , H01L23/544
CPC分类号： H01L23/5385 , H01L21/56 , H01L21/60 , H01L23/3128 , H01L23/3135 , H01L23/49816 , H01L23/5226 , H01L23/5386 , H01L23/544 , H01L24/08 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/32 , H01L24/33 , H01L24/48 , H01L2021/60075 , H01L2021/6009 , H01L2224/08113 , H01L2224/16112 , H01L2224/16235 , H01L2224/1703 , H01L2224/17055 , H01L2224/32059 , H01L2224/32225 , H01L2224/3303 , H01L2224/48091 , H01L2224/48105 , H01L2224/48225 , H01L2924/1016 , H01L2924/1811 , H01L2924/182
摘要： In one example, an electronic device includes a lower substrate comprising a lower substrate upper side and a lower substrate lower side, and an upper substrate comprising an upper substrate upper side and an upper substrate lower side. The electronic device also includes a first electronic component and a second electronic component coupled to the upper substrate upper side. A first device interconnect and a second device interconnect couple the lower substrate upper side to the upper substrate lower side. The electronic device also includes a connect die coupled to the lower substrate upper side that electrically couples the first electronic component to the second electronic component. Other examples and related methods are also disclosed herein.
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公开(公告)号：US20230070922A1
公开(公告)日：2023-03-09
申请号：US17982713
申请日：2022-11-08
发明人： Gyu Wan Han , Won Bae Bang , Ju Hyung Lee , Min Hwa Chang , Dong Joo Park , Jin Young Khim , Jae Yun Kim , Se Hwan Hong , Seung Jae Yu , Shaun Bowers , Gi Tae Lim , Byoung Woo Cho , Myung Jea Choi , Seul Bee Lee , Sang Goo Kang , Kyung Rok Park
IPC分类号： H01L23/13 , H01L21/56 , H01L23/00 , H01L25/065 , H01L23/31 , H01L25/18 , H01L23/498
摘要： In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
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