METHODS OF MAKING LOW-REFRACTIVE INDEX AND/OR LOW-K ORGANOSILICATE COATINGS
    4.
    发明申请
    METHODS OF MAKING LOW-REFRACTIVE INDEX AND/OR LOW-K ORGANOSILICATE COATINGS 审中-公开
    制造低折射率和/或低K有机硅涂层的方法

    公开(公告)号:US20090026924A1

    公开(公告)日:2009-01-29

    申请号:US11931088

    申请日:2007-10-31

    摘要: A method for forming a substantially transparent nanoporous organosilicate film on a substantially transparent substrate, for use in optical lighting devices such as organic light emitting diodes (OLEDs). The method includes first preparing a composition comprising a silicon containing pre-polymer, a porogen, and a catalyst. The composition is coated onto a substrate which is substantially transparent to visible light, forming a film thereon. The film is then gelled by crosslinking and cured by heating, such that the resulting cured film is substantially transparent to visible light. It is preferred that both the substrate and the nanoporous film are at least 98% transparent to visible light. Optical devices which include the resulting structures of this invention exhibit improved light extraction and illuminance where the nanoporous organosilicate film has a low refractive index in the range of 1.05 to 1.4, serving as an impedance matching layer in such devices.

    摘要翻译: 一种在基本上透明的基底上形成基本透明的纳米多孔有机硅酸盐膜的方法,用于诸如有机发光二极管(OLED)的光学照明装置中。 该方法包括首先制备包含含硅预聚物,致孔剂和催化剂的组合物。 将组合物涂布在对可见光基本透明的基底上,在其上形成膜。 然后通过交联使膜凝胶化并通过加热固化,使得所得固化膜对可见光基本上是透明的。 优选的是,衬底和纳米多孔膜对可见光透明至少98%。 包括本发明所得结构的光学器件表现出改进的光提取和照度,其中纳米多孔有机硅酸盐膜具有在1.05至1.4范围内的低折射率,用作这种器件中的阻抗匹配层。

    Method for silicide stringer removal in the fabrication of semiconductor
integrated circuits
    5.
    发明授权
    Method for silicide stringer removal in the fabrication of semiconductor integrated circuits 失效
    半导体集成电路制造中硅化物桁架去除的方法

    公开(公告)号:US6004878A

    公开(公告)日:1999-12-21

    申请号:US22597

    申请日:1998-02-12

    IPC分类号: H01L21/336 H01L21/44

    CPC分类号: H01L29/66575 H01L29/665

    摘要: Sidewall spacers, adjacent a gate electrode and source/drain regions of a MOS transistor are formed of a dielectric material that can be etched selectively to the material selected as the isolation dielectric. A layer of silicide forming metal is deposited overlying the MOS transistor and heated, wherein silicide regions are formed where the metal makes contact with silicon, for example, in the gate electrode and source/drain regions. At least a portion of the sidewall spacers are etched-away and silicide stringers, if formed on the spacers, are removed.

    摘要翻译: 与MOS晶体管的栅电极和源极/漏极区相邻的侧壁间隔物由可以选择性地选择为被选择为隔离电介质的材料的电介质材料形成。 一层形成硅化物的金属沉积在MOS晶体管的上方并被加热,其中形成硅化物区域,其中金属与硅接触,例如在栅电极和源/漏区。 侧壁间隔物的至少一部分被蚀刻掉,并且如果形成在间隔物上,则去除硅化物桁条。