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    METHODS OF MAKING LOW-REFRACTIVE INDEX AND/OR LOW-K ORGANOSILICATE COATINGS
    1.
    发明申请
    METHODS OF MAKING LOW-REFRACTIVE INDEX AND/OR LOW-K ORGANOSILICATE COATINGS 审中-公开
    制造低折射率和/或低K有机硅涂层的方法

    公开(公告)号：US20090026924A1

    公开(公告)日：2009-01-29

    申请号：US11931088

    申请日：2007-10-31

    申请人： Roger Y. Leung ,  De-Ling Zhou ,  Wenya Fan ,  Peter A. Smith ,  Paul G. Apen ,  Brian J. Daniels ,  Ananth Naman ,  Teresa A. Ramos ,  Robert R. Roth

    发明人： Roger Y. Leung ,  De-Ling Zhou ,  Wenya Fan ,  Peter A. Smith ,  Paul G. Apen ,  Brian J. Daniels ,  Ananth Naman ,  Teresa A. Ramos ,  Robert R. Roth

    IPC分类号： H01L51/54 ,  H01L33/00 ,  B32B3/26 ,  B05D5/06 ,  H01L27/15

    CPC分类号： C09D183/02 ,  H01L51/5262 ,  Y10T428/249953

    摘要： A method for forming a substantially transparent nanoporous organosilicate film on a substantially transparent substrate, for use in optical lighting devices such as organic light emitting diodes (OLEDs). The method includes first preparing a composition comprising a silicon containing pre-polymer, a porogen, and a catalyst. The composition is coated onto a substrate which is substantially transparent to visible light, forming a film thereon. The film is then gelled by crosslinking and cured by heating, such that the resulting cured film is substantially transparent to visible light. It is preferred that both the substrate and the nanoporous film are at least 98% transparent to visible light. Optical devices which include the resulting structures of this invention exhibit improved light extraction and illuminance where the nanoporous organosilicate film has a low refractive index in the range of 1.05 to 1.4, serving as an impedance matching layer in such devices.

    摘要翻译： 一种在基本上透明的基底上形成基本透明的纳米多孔有机硅酸盐膜的方法，用于诸如有机发光二极管（OLED）的光学照明装置中。 该方法包括首先制备包含含硅预聚物，致孔剂和催化剂的组合物。 将组合物涂布在对可见光基本透明的基底上，在其上形成膜。 然后通过交联使膜凝胶化并通过加热固化，使得所得固化膜对可见光基本上是透明的。 优选的是，衬底和纳米多孔膜对可见光透明至少98％。 包括本发明所得结构的光学器件表现出改进的光提取和照度，其中纳米多孔有机硅酸盐膜具有在1.05至1.4范围内的低折射率，用作这种器件中的阻抗匹配层。

    Organic compositions
    4.
    发明授权
    Organic compositions 有权

    公开(公告)号：US07049005B2

    公开(公告)日：2006-05-23

    申请号：US10160773

    申请日：2002-05-30

    申请人： Paul G. Apen ,  William B. Bedwell ,  Nancy Iwamoto ,  Boris A. Korolev ,  Kreisler S. Lau ,  Bo Li ,  Ananth Naman

    发明人： Paul G. Apen ,  William B. Bedwell ,  Nancy Iwamoto ,  Boris A. Korolev ,  Kreisler S. Lau ,  Bo Li ,  Ananth Naman

    IPC分类号： B32B9/04

    CPC分类号： H01L21/02118 ,  C08G61/02 ,  C08L65/00 ,  H01L21/02126 ,  H01L21/02282 ,  H01L21/312 ,  H01L21/31695 ,  H05K1/0313 ,  Y10T428/31663

    摘要： The present invention provides a composition comprising: (a) thermosetting component comprising (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II set forth below where E is a cage compound (defined below); each Q is the same or different and selected from aryl, branched aryl, and substituted aryl wherein the substituents include hydrogen, halogen, alkyl, aryl, substituted aryl, heteroaryl, aryl ether, alkenyl, alkynyl, alkoxyl, hydroxyalkyl, hydroxyaryl, hydroxyalkenyl, hydroxyalkynyl, hydroxyl, or carboxyl; G is aryl or substituted aryl where substituents include halogen and alkyl; h is from 0 to 10; i is from 0 to 10; j is from 0 to 10; and w is 0 or 1; (b) adhesion promoter comprising compound having at least bifunctionality wherein the bifunctionality may be the same or different and the first functionality is capable of interacting with the thermosetting component (a) and the second functionality is capable of interacting with a substrate when the composition is applied to the substrate. The present compositions may be used as a dielectric substrate material, etch stop, hardmask, or air bridge in microchips, multichip modules, laminated circuit boards, or printed wiring boards. The present composition may also be used as a passive coating for enveloping a completed wafer.

    Organic compositions
    6.
    发明授权
    Organic compositions 失效
    有机成分

    公开(公告)号：US07060204B2

    公开(公告)日：2006-06-13

    申请号：US10404047

    申请日：2003-04-02

    申请人： Bo Li ,  Nancy Iwamoto ,  Boris Korolev ,  Paul G. Apen ,  Kreisler Lau ,  John G. Sikonia ,  Ananth Naman ,  Amauel Gebrebrhan ,  Nassrin Sleiman ,  Ruslan Zherebin

    发明人： Bo Li ,  Nancy Iwamoto ,  Boris Korolev ,  Paul G. Apen ,  Kreisler Lau ,  John G. Sikonia ,  Ananth Naman ,  Amauel Gebrebrhan ,  Nassrin Sleiman ,  Ruslan Zherebin

    IPC分类号： H01B1/12 ,  C08J9/38 ,  C08J9/00

    CPC分类号： H01L21/02126 ,  C08G61/02 ,  C08L65/00 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/31695 ,  H05K1/0313

    摘要： The present invention provides a composition comprising: (a) dielectric material; and (b) porogen comprising at least two fused aromatic rings wherein each of the fused aromatic rings has at least one alkyl substituent thereon and a bond exists between at least two of the alkyl substituents on adjacent aromatic rings. Preferably, the dielectric material is a composition comprising (a) thermosetting component comprising (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where Q, G, h, I, I, and w are as set forth below and (b) porogen. Preferably, the porogen is selected from the group consisting of unfunctionalized polyacenaphthylene homopolymer, functionalized polyacenaphthylene homopolymer, polyacenaphthylene copolymer, polynorbornene, polycaprolactone, poly(2-vinylnaphthalene), vinyl anthracene, polystyrene, polystyrene derivatives, polysiloxane, polyester, polyether, polyacrylate, aliphatic polycarbonate, polysulfone, polylactide, and blends thereof. The present compositions are particularly useful as dielectric substrate material in microchips, multichip modules, laminated circuit boards, and printed wiring boards.

    摘要翻译： 本发明提供一种组合物，其包含：（a）电介质材料; 和（b）包含至少两个稠合芳环的致孔剂，其中每个稠合芳环在其上具有至少一个烷基取代基，并且在相邻芳环上的至少两个烷基取代基之间存在键。 优选地，电介质材料是包含（a）热固性组分的组合物，其包含（1）如下所述的任选的式I的单体和（2）至少一种如下所述的式II的低聚物或聚合物，其中Q，G，h ，I，I和w如下所述，（b）致孔剂。 优选地，致孔剂选自非官能化聚苊烯均聚物，官能化聚苊烯均聚物，聚苊烯共聚物，聚降冰片烯，聚己内酯，聚（2-乙烯基萘），乙烯基蒽，聚苯乙烯，聚苯乙烯衍生物，聚硅氧烷，聚酯，聚醚，聚丙烯酸酯，脂族 聚碳酸酯，聚砜，聚丙交酯及其共混物。 本发明的组合物特别可用作微芯片，多芯片模块，层叠电路板和印刷线路板中的介电基板材料。

    Organic compositions
    7.
    发明授权
    Organic compositions 失效
    有机成分

    公开(公告)号：US06998178B2

    公开(公告)日：2006-02-14

    申请号：US10404644

    申请日：2003-04-02

    申请人： Paul G. Apen ,  William B. Bedwell ,  Nancy Iwamoto ,  Boris A. Korolev ,  Kreisler S. Lau ,  Bo Li ,  Ananth Naman

    发明人： Paul G. Apen ,  William B. Bedwell ,  Nancy Iwamoto ,  Boris A. Korolev ,  Kreisler S. Lau ,  Bo Li ,  Ananth Naman

    IPC分类号： B32B9/04

    CPC分类号： C08G61/02 ,  H01L21/02118 ,  H01L21/02126 ,  H01L21/02282 ,  H01L21/312 ,  Y10T428/31663

    摘要： The present invention provides a composition comprising: (a) thermosetling component comprising (1) optionally at least one monomer of Formula I as sel forth below and (2) at least one oligomer or polymer of Formula II set forth below where E is a cage compound (defined below); each Q is the same or different and selected from hydrogen, aryl, branched aryl, and substituted aryl wherein the substituents include hydrogen, halogen, alkyl, aryl, substituted aryl, heteroaryl, aryl ether, alkenyl, alkynyl, alkoxyl, hydroxyalkyl, hydroxyaryl, hydroxyalkenyl, hydroxyalkynyl, hydroxyl, or carboxyl; Gw is aryl or substituted aryl where substituents include halogen and alkyl; h is from 0 to 10; i is from 0 to 10; j is from 0 to 10; and w is 0 or 1; adhesion promoter comprising compound having least bifunctionality wherein the bifunctionality may be the same or different and the first functionality is capable of interacting with the thermosetting component (a) and the second functionality is capable of interacting with a substrate when the composition is applied to the substrate. The present compositions may be used as a dielectric substrate material, etch stop, hardmask, or air bridge in microchips, multichip modules, laminated circuit boards, or printed wiring boards. The present composition may also be used as a passive coating for enveloping a completed wafer.

    摘要翻译： 本发明提供一种组合物

    Low temperature curable materials for optical applications
    9.
    发明授权
    Low temperature curable materials for optical applications 有权
    用于光学应用的低温可固化材料

    公开(公告)号：US07015061B2

    公开(公告)日：2006-03-21

    申请号：US10910673

    申请日：2004-08-03

    申请人： Victor Lu ,  Lei Jin ,  Arlene J. Suedmeyer ,  Paul G. Apen

    发明人： Victor Lu ,  Lei Jin ,  Arlene J. Suedmeyer ,  Paul G. Apen

    IPC分类号： H01L21/00

    CPC分类号： C09D183/04 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/3122 ,  H01L21/3127 ,  H01L21/316 ,  H01L27/1292

    摘要： The invention relates to low temperature curable spin-on glass materials which are useful for electronic applications, such as optical devices. A substantially crack-free and substantially void-free silicon polymer film is produced by (a) preparing a composition comprising at least one silicon containing pre-polymer having at least one organic group, a catalyst, and optionally water; (b) coating a substrate with the composition to form a film on the substrate, (c) crosslinking the composition by heating the composition at a temperature of about 250° C. or less for about 30 minutes or less, to produce a substantially crack-free and substantially void-free silicon polymer film, which silicon polymer has a weight ratio of organic groups to SiO groups of about 0.15:1 or more, and which silicon containing polymer film has a field breakdown voltage of about 2.5 MV/cm or more and a transparency to light in the range of about 400 nm to about 700 nm of about 95% or more.

    摘要翻译： 本发明涉及可用于电子应用的低温可固化旋涂玻璃材料，例如光学器件。 通过（a）制备包含至少一种具有至少一个有机基团的含硅预聚物，催化剂和任选的水的组合物来制备基本上无裂纹且基本上无空隙的硅聚合物膜; （b）用该组合物涂覆基材以在基材上形成膜，（c）通过在约250℃或更低的温度下加热该组合物约30分钟或更短时间来交联该组合物，以产生基本上裂纹 该硅聚合物的有机基团与SiO基的重量比为约0.15:1或更高，并且含硅聚合物膜的场击穿电压为约2.5MV / cm，或者 在约400nm至约700nm的范围内的光的透明度为约95％或更高。