NON-FLAMMABLE SOLVENTS FOR SEMICONDUCTOR APPLICATIONS
    7.
    发明申请
    NON-FLAMMABLE SOLVENTS FOR SEMICONDUCTOR APPLICATIONS 审中-公开
    用于半导体应用的非易燃溶剂

    公开(公告)号:US20090020140A1

    公开(公告)日:2009-01-22

    申请号:US12135699

    申请日:2008-06-09

    IPC分类号: B08B3/10 B08B3/08

    摘要: Methods and compositions for purging and cleaning a semiconductor fabrication system are disclosed herein. In general, the disclosed methods utilize solvents comprising hydrofluoroethers. Hydrofluoroethers are non-toxic and have low moisture content, preventing heat generation from organometallic precursor hydrolysis. In an embodiment, a method of cleaning a semiconductor fabrication system comprises dissolving at least one chemical precursor used in semiconductor fabrication in at least one delivery line with a solvent to clean the at least one delivery line. The solvent generally comprises a hydrofluoroether. The methods and compositions may be used in a variety of semiconductor film deposition processes.

    摘要翻译: 本文公开了用于清洗和清洁半导体制造系统的方法和组合物。 通常,所公开的方法使用包含氢氟醚的溶剂。 氢氟醚无毒,水分含量低,防止有机金属前体水解产生热量。 在一个实施方案中,清洁半导体制造系统的方法包括将至少一种用于半导体制造的化学前体溶解在至少一个输送管线中的溶剂中以清洁至少一个输送管线。 溶剂通常包含氢氟醚。 该方法和组合物可用于各种半导体膜沉积工艺中。

    MANUFACTURING OF ADDUCT FREE ALKALINE-EARTH METAL Cp COMPLEXES
    8.
    发明申请
    MANUFACTURING OF ADDUCT FREE ALKALINE-EARTH METAL Cp COMPLEXES 审中-公开
    添加免费碱性金属 - 金属Cp复合物的制造

    公开(公告)号:US20100189898A1

    公开(公告)日:2010-07-29

    申请号:US12691981

    申请日:2010-01-22

    IPC分类号: C23C16/18 C07F17/00 C23C16/44

    CPC分类号: C23C16/18 C07F17/00

    摘要: Methods and compositions for the deposition of a metal containing film on a substrate. The film is deposited with a substantially adduct free precursor which is prepared by a process to remove the adduct from an adducted starting material.

    摘要翻译: 用于在基材上沉积含金属膜的方法和组合物。 该膜沉积有基本上无加合物的前体,其通过从加合起始材料中除去加合物的方法制备。