公开(公告)号：US10431382B2

公开(公告)日：2019-10-01

申请号：US14841387

申请日：2015-08-31

Applicant: Apple Inc.

Inventor： Gemin Li ,  Paul Martinez ,  Benjamin A. Bard ,  Connor R. Duke ,  Zhong-Qing Gong ,  Kevin R. Richardson ,  Curtis C. Mead ,  Kieran Poulain ,  Sung Woo Yoo ,  Nelson J. Kottke

IPC: H05K7/00 ,  H01G4/30 ,  H01G4/224 ,  H05K3/28 ,  H01G2/06 ,  H05K1/18 ,  H05K1/14

Abstract: A printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.

公开(公告)号：US09805867B2

公开(公告)日：2017-10-31

申请号：US13957342

申请日：2013-08-01

Applicant: Apple Inc.

Inventor： Shawn X. Arnold ,  Jeffrey M. Thoma ,  Connor R. Duke ,  Yanchu Xu ,  Nelson J. Kottke

IPC: H01G4/005 ,  H01G4/01 ,  H05K1/18 ,  H05K13/04 ,  B23K26/22 ,  H05K3/34 ,  H01G4/40 ,  H01G2/06 ,  H01G2/10 ,  H01G4/224 ,  H01G4/228

CPC classification number: H01G4/01 ,  B23K26/22 ,  H01G2/06 ,  H01G2/10 ,  H01G4/224 ,  H01G4/228 ,  H01G4/40 ,  H05K1/181 ,  H05K3/3442 ,  H05K13/0465 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10962 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: The described embodiments relate generally to printed circuit boards (PCBs) including a capacitor and more specifically to designs for mechanically isolating the capacitor from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Conductive features can be mechanically and electrically coupled to electrodes located on two ends of the capacitor. The conductive features can be placed in corners where the amplitude of vibrations created by the piezoelectric forces is relatively small. The conductive features can then be soldered to a land pattern on the PCB to form a mechanical and electrical connection while reducing an amount of vibrational energy transferred from the capacitor to the PCB.

公开(公告)号：US20170064811A1

公开(公告)日：2017-03-02

申请号：US14841387

申请日：2015-08-31

Applicant: Apple Inc.

Inventor： Gemin Li ,  Paul Martinez ,  Benjamin A. Bard ,  Connor R. Duke ,  Zhong-Qing Gong ,  Kevin R. Richardson ,  Curtis C. Mead ,  Kieran Poulain ,  Sung Woo Yoo ,  Nelson J. Kottke

IPC: H05K1/02 ,  H05K1/11 ,  H01G4/30 ,  H05K3/40 ,  H01G4/224 ,  H05K1/18 ,  H05K3/30

CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/224 ,  H05K1/141 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/049 ,  H05K2201/10015 ,  H05K2201/2045 ,  H05K2203/1316 ,  H05K2203/1322

Abstract: A printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.

Abstract translation: 公开了一种印刷电路板（PCB）组件，其具有安装在PCB上的几个电子部件和覆盖电子部件的阻尼层。 PCB组件的实施例包括将阻尼层限制在PCB上的包覆模制层。 PCB组件的实施例包括在电子部件的电容器和PCB之间的插入器。 还描述和要求保护其他实施例。