公开(公告)号：US20210394540A1

公开(公告)日：2021-12-23

申请号：US16909947

申请日：2020-06-23

申请人： Applied Materials, Inc.

发明人： Shantanu Rajiv Gadgil ,  Sumit Subhash Patankar ,  Nathan Arron Davis ,  Allen L. D`Ambra

IPC分类号： B41J29/17 ,  B41J11/36

摘要： In a chemical mechanical polishing system, a platen shield cleaning assembly is installed on a rotatable platen in a gap between the rotatable platen and a platen shield. The assembly includes a sponge holder attached to the platen and a sponge. The sponge is held by the sponge holder such that an outer surface of the sponge is pressed against an inner surface of the platen shield.

公开(公告)号：US20240208006A1

公开(公告)日：2024-06-27

申请号：US18597077

申请日：2024-03-06

申请人： Applied Materials, Inc.

发明人： Roy C. Nangoy ,  Shantanu Rajiv Gadgil ,  Nathan Arron Davis ,  Allen L. D`Ambra ,  Michael J. Coughlin ,  Sumit Subhash Patankar

IPC分类号： B24B57/02 ,  B24B37/34 ,  B24B53/017

CPC分类号： B24B57/02 ,  B24B37/34 ,  B24B53/017

摘要： A polishing liquid delivery arm cleaning tool includes a body configured to be removably secured to a polishing liquid delivery arm of a chemical mechanical polishing system, and an insert removably secured to the body. The insert has an arm-facing surface shaped to direct a cleaning fluid from the polishing liquid delivery arm back to an inner surface of an enclosure of the polishing liquid delivery arm.

公开(公告)号：US20230278165A1

公开(公告)日：2023-09-07

申请号：US18316190

申请日：2023-05-11

申请人： Applied Materials, Inc.

发明人： Shantanu Rajiv Gadgil ,  Sumit Subhash Patankar ,  Nathan Arron Davis ,  Michael J. Coughlin ,  Allen L. D`Ambra

IPC分类号： B24B53/017

CPC分类号： B24B53/017

摘要： A method of cleaning a conditioner head includes bringing two clamps of a cleaning tool inward toward a disk-shaped pad conditioner head to press a sponge against an outer surface of the disk-shaped pad conditioner head, and creating relative motion between the cleaning tool and the pad conditioner head to wipe the sponge against the pad conditioner head.

公开(公告)号：US11648645B2

公开(公告)日：2023-05-16

申请号：US17849576

申请日：2022-06-24

申请人： Applied Materials, Inc.

发明人： Shantanu Rajiv Gadgil ,  Sumit Subhash Patankar ,  Nathan Arron Davis ,  Michael J. Coughlin ,  Allen L. D'Ambra

IPC分类号： B24B53/017

CPC分类号： B24B53/017

摘要： A method of cleaning a conditioner head includes bringing two clamps of a cleaning tool inward toward a disk-shaped pad conditioner head to press a sponge against an outer surface of the disk-shaped pad conditioner head, and creating relative motion between the cleaning tool and the pad conditioner head to wipe the sponge against the pad conditioner head.

公开(公告)号：US20210402565A1

公开(公告)日：2021-12-30

申请号：US17344617

申请日：2021-06-10

申请人： Applied Materials, Inc.

发明人： Roy C. Nangoy ,  Shantanu Rajiv Gadgil ,  Nathan Arron Davis ,  Allen L. D`Ambra ,  Michael J. Coughlin ,  Sumit Subhash Patankar

IPC分类号： B24B57/02 ,  B24B53/017 ,  B24B37/34

摘要： A polishing assembly includes a rotatable platen to support a polishing pad, a polishing liquid delivery arm having an enclosure open at a bottom thereof and one or more ports to deliver a polishing liquid and a cleaning fluid downwardly through an interior space of the enclosure onto the polishing pad, and a delivery arm cleaning tool removably attached to the polishing liquid delivery arm, the cleaning tool extending below the delivery arm and having a delivery arm-facing surface shaped such that the cleaning tool directs the cleaning fluid from the polishing liquid delivery arm on to a surface of the enclosure of the polishing liquid delivery arm.

公开(公告)号：US11986925B2

公开(公告)日：2024-05-21

申请号：US17977794

申请日：2022-10-31

申请人： Applied Materials, Inc.

发明人： Shantanu Rajiv Gadgil ,  Sumit Subhash Patankar ,  Nathan Arron Davis ,  Michael J. Coughlin ,  Allen L. D'Ambra

IPC分类号： B24B53/017 ,  B05C17/00 ,  B24B37/34 ,  B65D47/42 ,  B65D81/32 ,  C09D5/00 ,  B05D1/28 ,  B05D5/08

CPC分类号： B24B53/017 ,  B05C17/00 ,  B24B37/34 ,  B65D81/3266 ,  C09D5/00 ,  B05D1/28 ,  B05D5/08 ,  B65D47/42

摘要： Chemically impregnated applicators used to provide hydrophobic surfaces on chemical mechanical polishing system components and related application methods are shown. A method of forming a hydrophobic coating on a surface of a polishing system component includes cleaning the surface of the polishing system component to remove a polishing fluid residue therefrom and applying a hydrophobicity causing chemical solution to the surface of the polishing system component.

公开(公告)号：US20230146929A1

公开(公告)日：2023-05-11

申请号：US18091309

申请日：2022-12-29

申请人： Applied Materials, Inc.

发明人： Shantanu Rajiv Gadgil ,  Sumit Subhash Patankar ,  Nathan Arron Davis ,  Allen L. D`Ambra

IPC分类号： H01L21/67 ,  B24B37/27 ,  B08B3/00 ,  B08B1/04 ,  B24B37/34

CPC分类号： H01L21/6704 ,  B24B37/27 ,  B08B3/003 ,  B08B1/04 ,  B24B37/34 ,  B24B37/12

摘要： In a chemical mechanical polishing system, a platen shield cleaning assembly is installed on a rotatable platen in a gap between the rotatable platen and a platen shield. The assembly includes a sponge holder attached to the platen and a sponge. The sponge is held by the sponge holder such that an outer surface of the sponge is pressed against an inner surface of the platen shield.

公开(公告)号：US20220314397A1

公开(公告)日：2022-10-06

申请号：US17849576

申请日：2022-06-24

申请人： Applied Materials, Inc.

发明人： Shantanu Rajiv Gadgil ,  Sumit Subhash Patankar ,  Nathan Arron Davis ,  Michael J. Coughlin ,  Allen L. D`Ambra

IPC分类号： B24B53/017

摘要： A method of cleaning a conditioner head includes bringing two clamps of a cleaning tool inward toward a disk-shaped pad conditioner head to press a sponge against an outer surface of the disk-shaped pad conditioner head, and creating relative motion between the cleaning tool and the pad conditioner head to wipe the sponge against the pad conditioner head.

公开(公告)号：US11756804B2

公开(公告)日：2023-09-12

申请号：US18091309

申请日：2022-12-29

申请人： Applied Materials, Inc.

发明人： Shantanu Rajiv Gadgil ,  Sumit Subhash Patankar ,  Nathan Arron Davis ,  Allen L. D'Ambra

IPC分类号： B08B1/04 ,  B24B37/34 ,  H01L21/67 ,  B24B37/27 ,  B08B3/00 ,  B24B37/12 ,  B24B57/00 ,  H01L21/306 ,  B24B55/04 ,  H01L21/304

CPC分类号： B08B1/04 ,  B08B3/003 ,  B24B37/27 ,  B24B37/34 ,  H01L21/6704 ,  B24B37/12 ,  B24B55/04 ,  B24B57/00 ,  H01L21/304 ,  H01L21/30625

摘要： In a chemical mechanical polishing system, a platen shield cleaning assembly is installed on a rotatable platen in a gap between the rotatable platen and a platen shield. The assembly includes a sponge holder attached to the platen and a sponge. The sponge is held by the sponge holder such that an outer surface of the sponge is pressed against an inner surface of the platen shield.

公开(公告)号：US11545371B2

公开(公告)日：2023-01-03

申请号：US16909947

申请日：2020-06-23

申请人： Applied Materials, Inc.

发明人： Shantanu Rajiv Gadgil ,  Sumit Subhash Patankar ,  Nathan Arron Davis ,  Allen L. D'Ambra

IPC分类号： H01L21/67 ,  B24B37/27 ,  B08B3/00 ,  B08B1/04 ,  B24B37/34 ,  B24B37/12 ,  B24B57/00 ,  H01L21/306 ,  B24B55/04 ,  H01L21/304

摘要： In a chemical mechanical polishing system, a platen shield cleaning assembly is installed on a rotatable platen in a gap between the rotatable platen and a platen shield. The assembly includes a sponge holder attached to the platen and a sponge. The sponge is held by the sponge holder such that an outer surface of the sponge is pressed against an inner surface of the platen shield.