SYSTEM AND METHOD TO DETECT SUBSTRATE AND/OR SUBSTRATE SUPPORT MISALIGNMENT USING IMAGING
    2.
    发明申请
    SYSTEM AND METHOD TO DETECT SUBSTRATE AND/OR SUBSTRATE SUPPORT MISALIGNMENT USING IMAGING 有权
    使用成像检测基板和/或底层支持误差的系统和方法

    公开(公告)号:US20160125589A1

    公开(公告)日:2016-05-05

    申请号:US14882122

    申请日:2015-10-13

    摘要: A method and apparatus for detecting substrate misalignment (i.e., position displacement error) and/or substrate support misalignment. According to certain aspects, a method for detecting a misalignment of an object in a processing system is provided. The method generally includes obtaining a first image of the object, determining first values associated with pixels in at least one region of the first image, calculating at least one of a center of gravity value of the pixels in the at least one region or an average weight of the pixels in the at least one region, and detecting a misalignment of the object based on at least one of the calculated center of gravity or average weight of the pixels in the at least one region.

    摘要翻译: 用于检测基板未对准(即,位置偏移误差)和/或基板支撑未对准的方法和装置。 根据某些方面,提供了一种用于检测处理系统中的对象的未对准的方法。 该方法通常包括获得对象的第一图像,确定与第一图像的至少一个区域中的像素相关联的第一值,计算至少一个区域中的像素的重心值或平均值 基于至少一个区域中的像素的计算重心或平均重量中的至少一个来检测对象的未对准。

    AMBIENT CONTROLLED TRANSFER MODULE AND PROCESS SYSTEM

    公开(公告)号:US20190295872A1

    公开(公告)日:2019-09-26

    申请号:US16431239

    申请日:2019-06-04

    IPC分类号: H01L21/67

    摘要: Methods and apparatus for processing a substrate are provided herein. In one implementation, the apparatus includes a load lock chamber coupled to a transfer chamber. The transfer chamber is coupled to a thermal process chamber and a substrate is transferred between each of the load lock chamber, the transfer chamber, and the thermal process chamber. In other implementations, a process platform having a load lock chamber, a transfer chamber, and a thermal process chamber is disclosed. Methods of measuring oxygen concentration in a load lock chamber via evacuation of a transfer chamber are also described herein.

    AUTOMATED APPARATUS TO TEMPORARILY ATTACH SUBSTRATES TO CARRIERS WITHOUT ADHESIVES FOR PROCESSING

    公开(公告)号:US20190237352A1

    公开(公告)日:2019-08-01

    申请号:US15885120

    申请日:2018-01-31

    IPC分类号: H01L21/683 H01L21/67

    摘要: Embodiments include a method for processing thin substrates. Embodiments may include electrostatically bonding a substrate to a first electrostatic carrier (ESC), with a backside of the substrate is facing away from the first ESC. Thereafter, the substrate may be thinned to form a thinned substrate. The thinned substrate may then be transferred to a second ESC with a front side of the thinned substrate facing away from the second ESC. Embodiments may include cleaning the front side surface of the thinned substrate and transferring the thinned substrate to a third ESC. In an embodiment, a backside of the thinned substrate is facing away from the third ESC. Embodiments may also include processing the backside surface of the thinned substrate, and transferring the thinned substrate to a tape frame.