Printed dopant layers
    1.
    发明授权
    Printed dopant layers 有权
    印刷掺杂剂层

    公开(公告)号:US08304780B2

    公开(公告)日:2012-11-06

    申请号:US12797274

    申请日:2010-06-09

    摘要: A method for making an electronic device, such as a MOS transistor, including the steps of forming a plurality of semiconductor islands on an electrically functional substrate, printing a first dielectric layer on or over a first subset of the semiconductor islands and optionally a second dielectric layer on or over a second subset of the semiconductor islands, and annealing. The first dielectric layer contains a first dopant, and the (optional) second dielectric layer contains a second dopant different from the first dopant. The dielectric layer(s), semiconductor islands and substrate are annealed sufficiently to diffuse the first dopant into the first subset of semiconductor islands and, when present, the second dopant into the second subset of semiconductor islands.

    摘要翻译: 一种用于制造诸如MOS晶体管的电子器件的方法,包括以下步骤:在电功能衬底上形成多个半导体岛,在第一半导体岛子集上或第二子体上印刷第一介电层, 在半导体岛的第二子集上或之上,以及退火。 第一介电层包含第一掺杂剂,并且(任选的)第二介电层包含不同于第一掺杂剂的第二掺杂剂。 电介质层,半导体岛和衬底被充分退火以将第一掺杂剂扩散到半导体岛的第一子集中,并且当存在时将第二掺杂剂扩散到半导体岛的第二子集中。

    Printed dopant layers
    2.
    发明授权
    Printed dopant layers 有权
    印刷掺杂剂层

    公开(公告)号:US07767520B2

    公开(公告)日:2010-08-03

    申请号:US11888949

    申请日:2007-08-03

    IPC分类号: H01L21/8242

    摘要: A method for making an electronic device, such as a MOS transistor, including the steps of forming a plurality of semiconductor islands on an electrically functional substrate, printing a first dielectric layer on or over a first subset of the semiconductor islands and optionally a second dielectric layer on or over a second subset of the semiconductor islands, and annealing. The first dielectric layer contains a first dopant, and the (optional) second dielectric layer contains a second dopant different from the first dopant. The dielectric layer(s), semiconductor islands and substrate are annealed sufficiently to diffuse the first dopant into the first subset of semiconductor islands and, when present, the second dopant into the second subset of semiconductor islands.

    摘要翻译: 一种用于制造诸如MOS晶体管的电子器件的方法,包括以下步骤:在电功能衬底上形成多个半导体岛,在第一半导体岛子集上或第二子体上印刷第一介电层, 在半导体岛的第二子集上或之上,以及退火。 第一介电层包含第一掺杂剂,并且(任选的)第二介电层包含不同于第一掺杂剂的第二掺杂剂。 电介质层,半导体岛和衬底被充分退火以将第一掺杂剂扩散到半导体岛的第一子集中,并且当存在时将第二掺杂剂扩散到半导体岛的第二子集中。

    Printed Dopant Layers
    3.
    发明申请
    Printed Dopant Layers 有权
    印刷掺杂层

    公开(公告)号:US20140094004A1

    公开(公告)日:2014-04-03

    申请号:US13633816

    申请日:2012-10-02

    IPC分类号: H01L21/336

    CPC分类号: H01L27/1292 H01L29/66757

    摘要: A method for making an electronic device, such as a MOS transistor, including the steps of forming a plurality of semiconductor islands on an electrically functional substrate, printing a first dielectric layer on or over a first subset of the semiconductor islands and optionally a second dielectric layer on or over a second subset of the semiconductor islands, and annealing. The first dielectric layer contains a first dopant, and the (optional) second dielectric layer contains a second dopant different from the first dopant. The dielectric layer(s), semiconductor islands and substrate are annealed sufficiently to diffuse the first dopant into the first subset of semiconductor islands and, when present, the second dopant into the second subset of semiconductor islands.

    摘要翻译: 一种用于制造诸如MOS晶体管的电子器件的方法,包括以下步骤:在电功能衬底上形成多个半导体岛,在第一半导体岛子集上或第二子体上印刷第一介电层, 在半导体岛的第二子集上或之上,以及退火。 第一介电层包含第一掺杂剂,并且(任选的)第二介电层包含不同于第一掺杂剂的第二掺杂剂。 电介质层,半导体岛和衬底被充分退火以将第一掺杂剂扩散到半导体岛的第一子集中,并且当存在时将第二掺杂剂扩散到半导体岛的第二子集中。

    Printed dopant layers
    4.
    发明授权
    Printed dopant layers 有权
    印刷掺杂剂层

    公开(公告)号:US07701011B2

    公开(公告)日:2010-04-20

    申请号:US11888942

    申请日:2007-08-03

    IPC分类号: H01L21/00 H01L21/84

    摘要: An electronic device, including a substrate, a plurality of first semiconductor islands on the substrate, a plurality of second semiconductor islands on the substrate, a first dielectric film on the first subset of the semiconductor islands, second dielectric film on the second semiconductor islands, and a metal layer in electrical contact with the first and second semiconductor islands. The first semiconductor islands and the first dielectric film contain a first diffusible dopant, and the second semiconductor islands and the second dielectric layer film contain a second diffusible dopant different from the first diffusible dopant. The present electronic device can be manufactured using printing technologies, thereby enabling high-throughput, low-cost manufacturing of electrical circuits on a wide variety of substrates.

    摘要翻译: 一种电子器件,包括衬底,衬底上的多个第一半导体岛,衬底上的多个第二半导体岛,半导体岛的第一子集上的第一电介质膜,第二半导体岛上的第二电介质膜, 以及与第一和第二半导体岛电接触的金属层。 第一半导体岛和第一介电膜包含第一可扩散掺杂剂,第二半导体岛和第二介电层膜含有不同于第一可扩散掺杂剂的第二可扩散掺杂物。 本电子装置可以使用印刷技术制造,从而能够在各种基板上实现高通量,低成本的电路制造。

    Printed Dopant Layers
    5.
    发明申请
    Printed Dopant Layers 有权
    印刷掺杂层

    公开(公告)号:US20100244133A1

    公开(公告)日:2010-09-30

    申请号:US12797274

    申请日:2010-06-09

    IPC分类号: H01L29/786 H01L21/336

    摘要: A method for making an electronic device, such as a MOS transistor, including the steps of forming a plurality of semiconductor islands on an electrically functional substrate, printing a first dielectric layer on or over a first subset of the semiconductor islands and optionally a second dielectric layer on or over a second subset of the semiconductor islands, and annealing. The first dielectric layer contains a first dopant, and the (optional) second dielectric layer contains a second dopant different from the first dopant. The dielectric layer(s), semiconductor islands and substrate are annealed sufficiently to diffuse the first dopant into the first subset of semiconductor islands and, when present, the second dopant into the second subset of semiconductor islands.

    摘要翻译: 一种用于制造诸如MOS晶体管的电子器件的方法,包括以下步骤:在电功能衬底上形成多个半导体岛,在第一半导体岛子集上或第二子体上印刷第一电介质层, 在半导体岛的第二子集上或之上,以及退火。 第一介电层包含第一掺杂剂,并且(任选的)第二介电层包含不同于第一掺杂剂的第二掺杂剂。 电介质层,半导体岛和衬底被充分退火以将第一掺杂剂扩散到半导体岛的第一子集中,并且当存在时将第二掺杂剂扩散到半导体岛的第二子集中。

    Printed dopant layers
    6.
    发明申请
    Printed dopant layers 有权
    印刷掺杂剂层

    公开(公告)号:US20080042212A1

    公开(公告)日:2008-02-21

    申请号:US11888942

    申请日:2007-08-03

    IPC分类号: H01L27/092

    摘要: An electronic device, including a substrate, a plurality of first semiconductor islands on the substrate, a plurality of second semiconductor islands on the substrate, a first dielectric film on the first subset of the semiconductor islands, second dielectric film on the second semiconductor islands, and a metal layer in electrical contact with the first and second semiconductor islands. The first semiconductor islands and the first dielectric film contain a first diffusible dopant, and the second semiconductor islands and the second dielectric layer film contain a second diffusible dopant different from the first diffusible dopant. The present electronic device can be manufactured using printing technologies, thereby enabling high-throughput, low-cost manufacturing of electrical circuits on a wide variety of substrates.

    摘要翻译: 一种电子器件,包括衬底,衬底上的多个第一半导体岛,衬底上的多个第二半导体岛,半导体岛的第一子集上的第一电介质膜,第二半导体岛上的第二电介质膜, 以及与第一和第二半导体岛电接触的金属层。 第一半导体岛和第一介电膜包含第一可扩散掺杂剂,第二半导体岛和第二介电层膜含有不同于第一可扩散掺杂剂的第二可扩散掺杂物。 本电子装置可以使用印刷技术制造,从而能够在各种基板上实现高通量,低成本的电路制造。

    Methods of forming a doped semiconductor thin film, doped semiconductor thin film structures, doped silane compositions, and methods of making such compositions
    9.
    发明授权
    Methods of forming a doped semiconductor thin film, doped semiconductor thin film structures, doped silane compositions, and methods of making such compositions 有权
    形成掺杂半导体薄膜,掺杂半导体薄膜结构,掺杂硅烷组合物的方法和制备这种组合物的方法

    公开(公告)号:US07314513B1

    公开(公告)日:2008-01-01

    申请号:US10949013

    申请日:2004-09-24

    IPC分类号: C09D183/16

    摘要: Methods for forming doped silane and/or semiconductor thin films, doped liquid phase silane compositions useful in such methods, and doped semiconductor thin films and structures. The composition is generally liquid at ambient temperatures and includes a Group IVA atom source and a dopant source. By irradiating a doped liquid silane during at least part of its deposition, a thin, substantially uniform doped oligomerized/polymerized silane film may be formed on a substrate. Such irradiation is believed to convert the doped silane film into a relatively high-molecular weight species with relatively high viscosity and relatively low volatility, typically by cross-linking, isomerization, oligomerization and/or polymerization. A film formed by the irradiation of doped liquid silanes can later be converted (generally by heating and annealing/recrystallization) into a doped, hydrogenated, amorphous silicon film or a doped, at least partially polycrystalline silicon film suitable for electronic devices. Thus, the present invention enables use of high throughput, low cost equipment and techniques for making doped semiconductor films of commercial quality and quantity from doped “liquid silicon.”

    摘要翻译: 用于形成掺杂的硅烷和/或半导体薄膜的方法,用于这种方法的掺杂的液相硅烷组合物,以及掺杂的半导体薄膜和结构。 组合物在环境温度下通常是液体,并且包括IVA族原子源和掺杂剂源。 通过在其沉积的至少一部分期间照射掺杂的液体硅烷,可以在衬底上形成薄的,基本上均匀的掺杂的低聚/聚合的硅烷膜。 据信这种照射将掺杂的硅烷膜转化成相对高分子量的物质,具有相对较高的粘度和较低挥发性,通常通过交联,异构化,低聚和/或聚合。 通过掺杂的液体硅烷的照射形成的膜可以随后通过加热和退火/重结晶转化成掺杂的,氢化的非晶硅膜或适用于电子器件的掺杂的至少部分多晶的硅膜。 因此,本发明能够使用高通量,低成本的设备和技术来制造掺杂的“液态硅”具有商业质量和数量的掺杂半导体膜。