公开(公告)号：US20120285550A1

公开(公告)日：2012-11-15

申请号：US13557157

申请日：2012-07-24

申请人： Ashish Pattekar ,  Eugene M. Chow ,  Eric Peeters

发明人： Ashish Pattekar ,  Eugene M. Chow ,  Eric Peeters

IPC分类号： F17D1/16

CPC分类号： F16K99/0001 ,  B01L3/502738 ,  B01L2200/12 ,  B01L2300/0819 ,  B01L2300/0887 ,  B01L2400/0655 ,  F16K99/0026 ,  Y10T137/0318 ,  Y10T137/0391 ,  Y10T137/87249

摘要： A method of controlling a main fluid in a conduit using a microvalve is described. The microvalve includes a corresponding actuation aperture in an actuation aperture layer. A control fluid flows through the actuation aperture in response to an electric field applied via a charge distribution near an actuation aperture layer. In one embodiment, the electric field may adjust the opening and closing of the actuation aperture thereby controlling the flow of the control fluid. In a second embodiment, the control fluid is an electrorheological fluid where the electric field controls the viscosity of the ER fluid, thereby controlling fluid flow through the actuation aperture. In both embodiments the flow of the control fluid controls stretching of a flexible membrane into and out of the conduit, thereby controlling the flow of the main fluid by opening or closing the conduit.

摘要翻译： 描述了使用微型阀控制导管中的主流体的方法。 微型阀包括致动孔层中相应的致动孔。 响应于通过致动孔层附近的电荷分布施加的电场，控制流体流过致动孔。 在一个实施例中，电场可以调节致动孔的打开和关闭，从而控制控制流体的流动。 在第二实施例中，控制流体是电流变流体，其中电场控制ER流体的粘度，由此控制通过致动孔的流体流动。 在两个实施例中，控制流体的流动控制柔性膜进出导管的伸展，从而通过打开或关闭导管来控制主流体的流动。

公开(公告)号：US08272392B2

公开(公告)日：2012-09-25

申请号：US12818788

申请日：2010-06-18

申请人： Ashish Pattekar ,  Eugene M. Chow ,  Eric Peeters

发明人： Ashish Pattekar ,  Eugene M. Chow ,  Eric Peeters

IPC分类号： F16K31/126 ,  F16K7/02

CPC分类号： F16K99/0001 ,  B01L3/502738 ,  B01L2200/12 ,  B01L2300/0819 ,  B01L2300/0887 ,  B01L2400/0655 ,  F16K99/0026 ,  Y10T137/0318 ,  Y10T137/0391 ,  Y10T137/87249

摘要： A method of controlling a main fluid in a conduit using a microvalve is described. The microvalve includes a corresponding actuation aperture in an actuation aperture layer. A control fluid flows through the actuation aperture in response to an electric field applied via a charge distribution near an actuation aperture layer. In one embodiment, the electric field may adjust the opening and closing of the actuation aperture thereby controlling the flow of the control fluid. In a second embodiment, the control fluid is an electrorheological fluid where the electric field controls the viscosity of the ER fluid, thereby controlling fluid flow through the actuation aperture. In both embodiments the flow of the control fluid controls stretching of a flexible membrane into and out of the conduit, thereby controlling the flow of the main fluid by opening or closing the conduit.

摘要翻译： 描述了使用微型阀控制导管中的主流体的方法。 微型阀包括致动孔层中相应的致动孔。 响应于通过致动孔层附近的电荷分布施加的电场，控制流体流过致动孔。 在一个实施例中，电场可以调节致动孔的打开和关闭，从而控制控制流体的流动。 在第二实施例中，控制流体是电流变流体，其中电场控制ER流体的粘度，由此控制通过致动孔的流体流动。 在两个实施例中，控制流体的流动控制柔性膜进出导管的伸展，从而通过打开或关闭导管来控制主流体的流动。

公开(公告)号：US20100252117A1

公开(公告)日：2010-10-07

申请号：US12818788

申请日：2010-06-18

申请人： Ashish Pattekar ,  Eugene M. Chow ,  Eric Peeters

发明人： Ashish Pattekar ,  Eugene M. Chow ,  Eric Peeters

IPC分类号： F15D1/00

CPC分类号： F16K99/0001 ,  B01L3/502738 ,  B01L2200/12 ,  B01L2300/0819 ,  B01L2300/0887 ,  B01L2400/0655 ,  F16K99/0026 ,  Y10T137/0318 ,  Y10T137/0391 ,  Y10T137/87249

摘要： A method of controlling a main fluid in a conduit using a microvalve is described. The microvalve includes a corresponding actuation aperture in an actuation aperture layer. A control fluid flows through the actuation aperture in response to an electric field applied via a charge distribution near an actuation aperture layer. In one embodiment, the electric field may adjust the opening and closing of the actuation aperture thereby controlling the flow of the control fluid. In a second embodiment, the control fluid is an electrorheological fluid where the electric field controls the viscosity of the ER fluid, thereby controlling fluid flow through the actuation aperture. In both embodiments the flow of the control fluid controls stretching of a flexible membrane into and out of the conduit, thereby controlling the flow of the main fluid by opening or closing the conduit.

摘要翻译： 描述了使用微型阀控制导管中的主流体的方法。 微型阀包括致动孔层中相应的致动孔。 响应于通过致动孔层附近的电荷分布施加的电场，控制流体流过致动孔。 在一个实施例中，电场可以调节致动孔的打开和关闭，从而控制控制流体的流动。 在第二实施例中，控制流体是电流变流体，其中电场控制ER流体的粘度，由此控制通过致动孔的流体流动。 在两个实施例中，控制流体的流动控制柔性膜进出导管的伸展，从而通过打开或关闭导管来控制主流体的流动。

公开(公告)号：US08646471B2

公开(公告)日：2014-02-11

申请号：US13557157

申请日：2012-07-24

申请人： Ashish Pattekar ,  Eugene M. Chow ,  Eric Peeters

发明人： Ashish Pattekar ,  Eugene M. Chow ,  Eric Peeters

IPC分类号： F16K11/20 ,  F16K31/126

CPC分类号： F16K99/0001 ,  B01L3/502738 ,  B01L2200/12 ,  B01L2300/0819 ,  B01L2300/0887 ,  B01L2400/0655 ,  F16K99/0026 ,  Y10T137/0318 ,  Y10T137/0391 ,  Y10T137/87249

摘要： A method of controlling a main fluid in a conduit using a microvalve is described. The microvalve includes a corresponding actuation aperture in an actuation aperture layer. A control fluid flows through the actuation aperture in response to an electric field applied via a charge distribution near an actuation aperture layer. In one embodiment, the electric field may adjust the opening and closing of the actuation aperture thereby controlling the flow of the control fluid. In a second embodiment, the control fluid is an electrorheological fluid where the electric field controls the viscosity of the ER fluid, thereby controlling fluid flow through the actuation aperture. In both embodiments the flow of the control fluid controls stretching of a flexible membrane into and out of the conduit, thereby controlling the flow of the main fluid by opening or closing the conduit.

摘要翻译： 描述了使用微型阀控制导管中的主流体的方法。 微型阀包括致动孔层中相应的致动孔。 响应于通过致动孔层附近的电荷分布施加的电场，控制流体流过致动孔。 在一个实施例中，电场可以调节致动孔的打开和关闭，从而控制控制流体的流动。 在第二实施例中，控制流体是电流变流体，其中电场控制ER流体的粘度，由此控制通过致动孔的流体流动。 在两个实施例中，控制流体的流动控制柔性膜进出导管的伸展，从而通过打开或关闭导管来控制主流体的流动。

公开(公告)号：US20110318880A1

公开(公告)日：2011-12-29

申请号：US13162473

申请日：2011-06-16

申请人： Eugene M. Chow ,  Christopher L. Chua ,  Eric Peeters

发明人： Eugene M. Chow ,  Christopher L. Chua ,  Eric Peeters

IPC分类号： H01L21/56

CPC分类号： H01L24/11 ,  G01R1/06727 ,  G01R1/06761 ,  G01R3/00 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49811 ,  H01L24/12 ,  H01L24/742 ,  H01L24/81 ,  H01L2221/68368 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01054 ,  H01L2924/01082 ,  H01L2924/14

摘要： A contact spring applicator is provided which includes an applicator substrate, a removable encapsulating layer and a plurality of contact springs embedded in the removable encapsulating layer. The contact springs are positioned such that a bond pad on each contact spring is adjacent to an upper surface of the removable encapsulating layer. The contact spring applicator may also include an applicator substrate, a release layer, a plurality of unreleased contact springs on the release layer and a bond pad at an anchor end of each contact spring. The contact spring applicators apply contact springs to an integrated circuit chip, die or package or to a probe card by aligning the bond pads with bond pad landings on the receiving device. The bond pads are adhered to the bond pad landings. The encapsulating or release layer is then removed to separate the contact springs from the contact spring applicator substrate.

摘要翻译： 提供接触弹簧施加器，其包括施加器基板，可移除的封装层和嵌入在可移除封装层中的多个接触弹簧。 接触弹簧被定位成使得每个接触弹簧上的接合焊盘与可移除的封装层的上表面相邻。 接触弹簧施加器还可以包括施加器基板，释放层，释放层上的多个未释放的接触弹簧和每个接触弹簧的锚固端处的接合垫。 接触弹簧施加器通过将接合垫与接收装置上的接合垫平台对准，将接触弹簧施加到集成电路芯片，管芯或封装或探针卡。 接合焊盘粘附到接合焊盘平台上。 然后去除包封或释放层以将接触弹簧与接触弹簧施加器基板分离。

公开(公告)号：US08040364B2

公开(公告)日：2011-10-18

申请号：US12502949

申请日：2009-07-14

申请人： Timothy D. Stowe ,  Eugene M. Chow ,  Ashish V. Pattekar ,  Eric Peeters

发明人： Timothy D. Stowe ,  Eugene M. Chow ,  Ashish V. Pattekar ,  Eric Peeters

IPC分类号： B41J2/385

CPC分类号： B41J2/0057

摘要： An imaging system including an image receiving structure including a tunable-resistivity material; and an energy source to emit an energy beam at the image receiving structure to pattern-wise program the tunable-resistivity material. A resistivity can be pattern-wise changed. Marking material can be pattern-wise adhered in response to the pattern-wise changed resistivity.

摘要翻译： 一种成像系统，包括包括可调谐电阻率材料的图像接收结构; 以及在所述图像接收结构处发射能量束以对所述可调谐电阻率材料进行图案化编程的能量源。 电阻率可以以图案方式改变。 响应于图案形式的电阻率，标记材料可以以图案方式粘附。

公开(公告)号：US20100085585A1

公开(公告)日：2010-04-08

申请号：US12245578

申请日：2008-10-03

申请人： Timothy D. Stowe ,  Eugene M. Chow ,  Ashish V. Pattekar ,  Eric Peeters

发明人： Timothy D. Stowe ,  Eugene M. Chow ,  Ashish V. Pattekar ,  Eric Peeters

IPC分类号： G06K15/00

CPC分类号： B41J2/475 ,  B41M1/00 ,  G03G15/228

摘要： An imaging system including an image receiving structure including a material layer having a tunable energy transfer characteristic; and an energy source to emit an energy beam at the material having the tunable energy transfer characteristic such that marking material is pattern-wise transferred to the image receiving structure.An imaging system includes an image receiving structure disposed to be in direct contact with marking material; and an energy source to emit a pattern-wise modulated energy beam at a region of the image receiving structure contacting the marking material to pattern-wise transfer marking material to the image receiving structure.

摘要翻译： 一种成像系统，包括：图像接收结构，包括具有可调能量转移特性的材料层; 以及在具有可调能量转移特性的材料上发射能量束的能量源，使得标记材料被图案化地转印到图像接收结构。 成像系统包括设置成与标记材料直接接触的图像接收结构; 以及能量源，以在图像接收结构的接触标记材料的区域处发射图案调制能量束，以将图案转印标记材料传送到图像接收结构。

公开(公告)号：US08487970B2

公开(公告)日：2013-07-16

申请号：US12245578

申请日：2008-10-03

申请人： Timothy D. Stowe ,  Eugene M. Chow ,  Ashish V. Pattekar ,  Eric Peeters

发明人： Timothy D. Stowe ,  Eugene M. Chow ,  Ashish V. Pattekar ,  Eric Peeters

IPC分类号： B41J2/315

CPC分类号： B41J2/475 ,  B41M1/00 ,  G03G15/228

摘要： An imaging system including an image receiving structure including a material layer having a tunable energy transfer characteristic; and an energy source to emit an energy beam at the material having the tunable energy transfer characteristic such that marking material is pattern-wise transferred to the image receiving structure.An imaging system includes an image receiving structure disposed to be in direct contact with marking material; and an energy source to emit a pattern-wise modulated energy beam at a region of the image receiving structure contacting the marking material to pattern-wise transfer marking material to the image receiving structure.

摘要翻译： 一种成像系统，包括：图像接收结构，包括具有可调能量转移特性的材料层; 以及在具有可调能量转移特性的材料上发射能量束的能量源，使得标记材料被图案化地转印到图像接收结构。 成像系统包括设置成与标记材料直接接触的图像接收结构; 以及能量源，以在图像接收结构的接触标记材料的区域处发射图案调制能量束，以将图案转印标记材料传送到图像接收结构。

公开(公告)号：US20120068331A1

公开(公告)日：2012-03-22

申请号：US12887775

申请日：2010-09-22

申请人： Eugene M. Chow ,  Eric Peeters

发明人： Eugene M. Chow ,  Eric Peeters

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H05K3/32 ,  G01R1/06727 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/3157 ,  H01L23/48 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L2221/68331 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/1161 ,  H01L2224/1182 ,  H01L2224/1191 ,  H01L2224/13008 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13026 ,  H01L2224/131 ,  H01L2224/1355 ,  H01L2224/13564 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/819 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01093 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49147 ,  H01L2224/13099 ,  H01L2924/00

摘要： At least one microspring has applied thereover a laminate structure to provide: mechanical protection during handling and wafer processing, a spring spacer layer, strengthening of the anchor between spring and substrate, provision of a gap stop during spring deflection, and moisture and contaminant protection. A fully-formed laminate structure may be applied over the microspring structure or a partly-formed laminate structure may be applied over the microspring structure then cured or hardened. The tip portion of the microspring may protrude through the laminate structure and be exposed for contact or may be buried within the contact structure. The laminate structure may remain in place in the final microspring structure or be removed in whole or in part. The laminate structure may be photolithographically patternable material, patterned and etched to remove some or all of the structure, forming for example additional structural elements such as a gap stop for the microspring.

摘要翻译： 至少一个微小弹簧已经施加在层压结构之上，以提供：在处理和晶片加工期间的机械保护，弹簧间隔层，弹簧和基底之间的锚固件的加强，在弹簧偏转期间提供间隙止挡，以及水分和污染物保护。 可以将完全成型的层压结构施加在微小弹簧结构上，或者可以将部分形成的层压结构施加到微弹体结构上，然后固化或硬化。 微小弹簧的尖端部分可以突出穿过层压结构并暴露以进行接触或者可以埋在接触结构内。 层压结构可以保留在最终微型结构中的适当位置或全部或部分去除。 层压结构可以是光刻图案化的材料，图案化和蚀刻以除去部分或全部结构，形成例如附加的结构元件，例如用于微弹簧的间隙止动件。

公开(公告)号：US08519534B2

公开(公告)日：2013-08-27

申请号：US12887775

申请日：2010-09-22

申请人： Eugene M. Chow ,  Eric Peeters

发明人： Eugene M. Chow ,  Eric Peeters

IPC分类号： H01L23/48

CPC分类号： H05K3/32 ,  G01R1/06727 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/3157 ,  H01L23/48 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L2221/68331 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/1161 ,  H01L2224/1182 ,  H01L2224/1191 ,  H01L2224/13008 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13026 ,  H01L2224/131 ,  H01L2224/1355 ,  H01L2224/13564 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/819 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01093 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49147 ,  H01L2224/13099 ,  H01L2924/00

摘要： At least one microspring has applied thereover a laminate structure to provide: mechanical protection during handling and wafer processing, a spring spacer layer, strengthening of the anchor between spring and substrate, provision of a gap stop during spring deflection, and moisture and contaminant protection. A fully-formed laminate structure may be applied over the microspring structure or a partly-formed laminate structure may be applied over the microspring structure then cured or hardened. The tip portion of the microspring may protrude through the laminate structure and be exposed for contact or may be buried within the contact structure. The laminate structure may remain in place in the final microspring structure or be removed in whole or in part. The laminate structure may be photolithographically patternable material, patterned and etched to remove some or all of the structure, forming for example additional structural elements such as a gap stop for the microspring.

摘要翻译： 至少一个微小弹簧已经施加在层压结构之上，以提供：在处理和晶片加工期间的机械保护，弹簧间隔层，弹簧和基底之间的锚固件的加强，在弹簧偏转期间提供间隙止挡，以及水分和污染物保护。 可以将完全成型的层压结构施加在微小弹簧结构上，或者可以将部分形成的层压结构施加到微弹体结构上，然后固化或硬化。 微小弹簧的尖端部分可以突出穿过层压结构并暴露以进行接触或者可以埋在接触结构内。 层压结构可以保留在最终微型结构中的适当位置或全部或部分去除。 层压结构可以是光刻图案化的材料，图案化和蚀刻以除去部分或全部结构，形成例如附加的结构元件，例如用于微弹簧的间隙止动件。