摘要:
A process which enables storage of more than two logic states in a memory cell. In one embodiment, a via is used to couple a diode between a word read line and a data read line. The via has a resistance which is set to one of a plurality of values at the time of manufacture. When the word read line is asserted, the voltage drop sustained across the via is indicative of the stored logic state. An analog-to-digital (A/D) converter is coupled to the data read line so as to sense the voltage drop and determine the state represented. Since the additional logic states may be used to represent additional information bits, this memory circuit increases the number of bits that may be stored per memory cell, thereby increasing the storage density and reducing the cost per bit.
摘要:
A system and process which enables storage of more than two logic states in a memory cell. In one embodiment, a programmable resistor is coupled in series with a transistor between a supply voltage and a data read line. When an access signal is asserted, the transistor provides a conductive path, and a voltage drop is sustained by the programmable resistor. The programmable resistor has a resistance which is set during a programming step to one of a plurality of values by passing a heating current through the programmable resistor for one of a corresponding plurality of predetermined lengths of time. When the access signal is asserted, the voltage drop sustained across the programmable resistor is indicative of the stored logic state. An analog-to-digital (A/D) converter is coupled to the data read line so as to sense the voltage drop and determine the state represented. Since the additional logic states may be used to represent additional information bits, this memory circuit increases the number of bits that may be stored per memory cell, thereby increasing the storage density and reducing the cost per bit.
摘要:
A circuit and method which enables storage of more than two logic states in a memory cell by selectively setting threshold voltages of transistors in a memory array according to the present invention. In one embodiment, a memory circuit includes an array of storage transistors. Each storage transistor has a gate connected to an associated read line. When a read line is asserted, the current which flows through a selected storage transistor is indicative of the stored logic state. The current through each transistor is individually selected by setting the threshold voltage of each storage transistor during manufacture. Different transistors in the array are configured with differing threshold voltages to thereby represent different storage states. An analog-to-digital (A/D) converter is coupled to the selected storage transistor so as to sense the current and determine the state represented. Since each cell may represent one of more than two storage states, the memory circuit may advantageously allow an increased number of bits to be stored in each memory cell, thereby increasing the storage density and reducing the cost per bit.
摘要:
A memory circuit which enables storage of more than two logic states in a memory cell. Since the additional logic states may be used to represent additional information bits, this memory circuit increases the number of bits that may be stored per memory cell, thereby increasing the storage density and reducing the cost per bit. The disclosed memory circuit comprises an analog-to-digital converter coupled to detect a current through a transistor in a memory cell. The current is determined by a charge stored on the transistor's gate. By enabling the current to be detected in discrete increments, it becomes possible to represent more than one bit of information with the charge stored in the memory cell. Usage of additional increments necessitates more precise storage and detection circuitry. In one embodiment, the storage circuitry uses feedback to obtain a greater logic state retrieval accuracy.
摘要:
A memory circuit which enables storage of three logic states in a memory cell. Since the additional logic states may be used to represent additional information bits, this memory circuit increases the number of bits that may be stored per memory cell, thereby increasing the storage density and reducing the cost per bit. The disclosed memory circuit comprises an analog-to-digital converter coupled to detect a current through a transistor in a memory cell. The current is determined by the state of a tri-state flip-flop. By enabling the current to be detected as positive, negative, or zero, it becomes possible to represent more than one bit of information with the state of the flip-flop.
摘要:
A DRAM memory array including a temperature sensor for adjusting a refresh rate depending upon temperature. The DRAM memory array includes a plurality of memory cells, each configured to allow storage and retrieval of more than two discrete memory states. A refresh circuit is coupled to the memory array for periodically refreshing the discrete storage state of each memory cell. The temperature sensor is situated on the same semiconductor die upon which the memory array is fabricated, and generates a signal indicative of the temperature of the semiconductor die. A control circuit receives the signal from the temperature sensor and responsively generates a refresh rate signal which is provided to control the refresh rate of the refresh circuit. In one specific implementation, a ROM look-up table is coupled to the control circuit and includes a plurality of entries which indicate the desired refresh rates for particular temperatures. By controlling the refresh rate dependent upon the temperature of the semiconductor die, proper state retention is ensured within each of the memory cells while allowing performance to be optimized.
摘要:
A test method for a memory device wherein failures that may only occur under specified worst-case conditions are converted to hard functional failures. These locations are subsequently detected and remapped by built-in self test (BIST) and built-in self-repair (BISR) circuitry. First, a test suite is performed on a memory array which includes redundant row and column locations. Typically, this test suite is performed under conditions which are most likely to induce failure. Row and column locations that are determined to be malfunctioning are scanned out of the memory device, along with the number of available redundant rows and columns. If there are sufficient redundant locations, the failing rows and columns are permanently disabled by blowing each of the corresponding fuse links. When power is subsequently applied to the memory device, BIST will detect rows and columns, including those permanently disabled, with hard functional failures. Accesses to these locations may then be redirected by BISR circuitry. The test suite may then be re-executed, and the device deemed defective if additional errors are found. Rows and columns in the memory array that are prone to failure are thus never enabled. Additionally, the BIST and BISR circuitry provides the ability to verify basic memory functionality and remap failing addresses on each application of power to the device. Test coverage of the memory array is advantageously increased.
摘要:
A memory circuit which uses multiple storage mechanisms in each of its memory cells. In one embodiment, the memory circuit includes an array of cells in which each cell has multiple storage elements. At least one of the storage elements performs its function in a different way than the rest of the storage elements. This use of multiple storage mechanisms allows for a greater freedom in memory cell design and allows for the simultaneous storage of multiple states in a single memory cell. Broadly speaking, the present invention contemplates a memory core comprising an address decoder, an array of cells, and a sense amplifier. The address decoder is configured to receive an address and responsively assert a selected word line. The array of cells includes a selected cell coupled to the selected word line, and each cell in the array of cells includes at least two storage elements. A first storage element is configured with a first state which is one of a first plurality of states, and a second storage element is configured with a second state which is one of a second, different plurality of states. The sense amplifier is coupled to the selected cell via a bit line and configured to detect the first and second states. Each cell may further include a third storage element configured with a third state which is one of a third plurality of states. In this case, the sense amplifier is also configured to detect the third state. Examples of candidate storage states include charges on a capacitance, conductivities of transistors, resistances between terminals, turn-on voltages of transistors, currents flowing in closed loops, and orientations of magnetized material.
摘要:
A multi-port semiconductor memory includes first and second data ports and a plurality of memory cells arranged in rows and columns. Each column comprises first and second pairs of complementary bit lines, which are coupled to each of the memory cells in that column. The first pair of bit lines cross one another between every N and N+1 of the memory cells the column, where N=2M and M is an integer variable greater than zero. A data inversion circuit is coupled between the first pair of bit lines and the first data port, which selectively inverts the first pair of bit lines as a function of the first port's (M+1)th row address input bit only, as measured from the least significant row address input bit.
摘要:
A memory circuit which uses multiple storage mechanisms in each of its memory cells. In one embodiment, the memory circuit comprises a memory cell array and a data sense module. Each cell of the array includes a first, second and third transistors, and a capacitance. The first transistor has a first gate coupled to a first word line, a floating gate which stores a first charge, a first source coupled to a first data line, and a first drain. The second transistor has a second gate coupled to the first drain, a second source coupled to a second word line, and a second drain. The third transistor has a third gate coupled to a third word line, a third source coupled to the second drain, and a third drain coupled to a second data line. The capacitance is coupled between ground and the third source. The capacitance stores a second charge when the second word line is asserted and the third word line is de-asserted. The second gate stores a third charge when the first word line is de-asserted. The data sense module is coupled to the first and second data lines, and configured to sense the second charge if the third word line is asserted while the second word line is asserted. The data sense module is further configured to sense the third charge by detecting a current through the second transistor if the second word line is de-asserted while the third word line is asserted. The data sense module is still further configured to detect the first charge by storing a fourth charge on said second gate if the first word line is asserted while the first data line is de-asserted, the first data line is then asserted, and the first word line is then de-asserted at a predetermined time period after the assertion of the first data line. The fourth charge is then sensed by detecting a current through the second transistor if the second word line is de-asserted while the third word line is asserted. The data sense module determines the state represented by the stored charge quantities. Since additional logic states may be used to represent additional information bits, this memory circuit increases the number of bits that may be stored per memory cell, thereby increasing the storage density and reducing the cost per bit.