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公开(公告)号：US20230313401A1
公开(公告)日：2023-10-05
申请号：US18002918
申请日：2021-06-29
摘要： The invention relates to aqueous acidic plating baths for electrodeposition of copper and copper alloys in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.
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公开(公告)号：US20180340261A1
公开(公告)日：2018-11-29
申请号：US15778247
申请日：2016-11-28
发明人： Andreas WALTER , Christof SUCHENTRUNK , Thomas BECK , Gerhard STEINBERGER , Holger BERA , Heiko BRUNNER , Sven RÜCKBROD
IPC分类号： C23C18/44 , C23C18/16 , H01L21/288 , H01L21/768 , H05K3/18 , H05K1/09 , H01L23/532
摘要： The invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the invention comprises a source for palladium ions, a reducing agent for palladium ions and a cyanide group containing aromatic compound. The aqueous plating bath composition according to the invention has an improved stability against undesired decomposition due to the cyanide group containing aromatic compounds while keeping the deposition rate for palladium at the desired satisfying value. The aqueous plating bath composition has also a prolonged life time. The cyanide group containing aromatic compounds of the invention allow for adjusting the deposition rate to a satisfying range over the bath life time and for electrolessly depositing palladium layers at lower temperatures.
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公开(公告)号：US20190264328A1
公开(公告)日：2019-08-29
申请号：US16332830
申请日：2017-09-15
发明人： Tobias BERNHARD , Anna PETER , Michael MERSCHKY , Frank BRÜNING , Taybet BILKAY-TRONI , Heiko BRUNNER
IPC分类号： C23C18/18 , C23C18/16 , C23C28/00 , C09D179/02
摘要： The present invention relates to a method for providing a multilayer coating on a surface of a substrate comprising the following method steps (i) providing the substrate; (ii) depositing at least one metal oxide compound onto the surface of the substrate; (iii) heat-treating the surface of the substrate such that a metal oxide is formed thereon; (iv) treating the surface of the substrate with a treatment solution comprising at least one nitrogen containing polymeric treatment additive; (v) treating the surface of the substrate with an activation solution; and (vi) treating the surface of the substrate with a metallising solution such that a metal or metal alloy is deposited thereon. The invention further concerns the use of treatment additives as enhancer for the metal deposition.
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公开(公告)号：US20180340260A1
公开(公告)日：2018-11-29
申请号：US15778242
申请日：2016-11-28
发明人： Andreas WALTER , Christof SUCHENTRUNK , Thomas BECK , Gerhard STEINBERGER , Holger BERA , Heiko BRUNNER , Bernd FROESE
IPC分类号： C23C18/44 , H05K3/24 , H01L21/288 , C23C18/16
摘要： The invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the invention comprises a source for palladium ions, a reducing agent for palladium ions and an unsaturated compound. The aqueous plating bath composition according to the invention has an improved stability against undesired decomposition due to the unsaturated compounds while keeping the deposition rate for palladium at the desired satisfying value. The aqueous plating bath composition has also a prolonged life time. The unsaturated compounds of the invention allow for adjusting the deposition rate to a satisfying range over the bath life time and for electrolessly depositing palladium layers at lower temperatures.
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公开(公告)号：US20180112320A1
公开(公告)日：2018-04-26
申请号：US15567637
申请日：2016-04-20
发明人： Heiko BRUNNER , Dirk ROHDE , Manuel PÖLLETH , Sven RÜCKBROD , Desthree DARWIN , Sandra NIEMANN , Gerhard STEINBERGER
摘要： The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions, at least one acid and at least one guanidine compound. The plating bath is particularly useful for plating recessed structures with copper and build-up of copper pillar bump structures.
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公开(公告)号：US20200340132A1
公开(公告)日：2020-10-29
申请号：US16961940
申请日：2018-12-14
发明人： Angela LLAVONA-SERRANO , Timo BANGERTER , Olivier MANN , Pamela CEBULLA , Stefanie ACKERMANN , Heiko BRUNNER , Kinga HAUBNER , Bernd FROESE
摘要： The present invention concerns a metal or metal alloy deposition composition, particularly a copper or copper alloy deposition composition, for electrolytic deposition of a metal or metal alloy layer, particularly for electrolytic deposition of a copper or copper alloy layer, comprising at least one type of metal ions to be deposited, preferably copper ions, and at least one imidazole based plating compound. The present invention further concerns a method for preparation of the plating compound, the plating compound itself and its use in a metal or metal alloy deposition composition. The inventive metal or metal alloy deposition composition can be preferably used for filling recessed structures, in particular those having higher diameter to depth aspect ratios.
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7.发明申请公开(公告)号：US20180223442A1
公开(公告)日：2018-08-09
申请号：US15748332
申请日：2016-08-30
发明人： Heiko BRUNNER , Lars KOHLMANN , Agnieszka WITCZAK , Olivier MANN
摘要： The present invention relates to bisurea derivatives and their use in aqueous plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions and a bisurea derivative. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.
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公开(公告)号：US20150299883A1
公开(公告)日：2015-10-22
申请号：US14646739
申请日：2013-11-12
发明人： Heiko BRUNNER , Bernd ROELFS , Agnieszka WITCZAK , Lars KOHLMANN , Olivier MANN , Christian OHDE , Timo BANGERTER , Angelo FERRO , Andreas KIRBS , Andre SCHMÖKEL , Dirk ROHDE , Stefanie ACKERMANN
CPC分类号： C25D3/38 , C25D3/58 , C25D5/02 , H01L21/2885 , H01L21/76898
摘要： The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer comprising amino residues on both termini and which is free of organically bound halogen. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.
摘要翻译： 本发明涉及用于电子应用的印刷电路板，IC基板，半导体和玻璃装置的制造中铜和铜合金沉积的酸性电镀液。 根据本发明的电镀浴包含铜离子，至少一种酸和乙烯聚合物，其在两个末端包含氨基残基且不含有机结合的卤素。 电镀槽特别适用于填充具有铜的凹陷结构和柱状凸起结构的积聚。
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9.发明公开公开(公告)号：US20230220558A1
公开(公告)日：2023-07-13
申请号：US18000480
申请日：2021-06-10
发明人： Lars KOHLMANN , Heiko BRUNNER
摘要： An aqueous etching composition comprising:
(a) functionalized urea, biuret and guanidine derivatives and/or salts thereof selected from compounds having formulae I or II:
wherein
X and Y are independently selected from oxygen, NRR′ and NR5,
R, R′ and R5 are independently selected from R1, hydrogen, polyethylene glycols, aromatic compounds, and C1-C4 alkyl, wherein the aromatic compounds and C1-C4 alkyl optionally comprise at least one substituent selected as OR6,
R6 is selected from hydrogen and C1-C4alkyl,
X and Y can be identical or different;
R1 and R2 are independently selected from hydrogen, alkyl compounds, amines, and nitrogen-comprising heteroaromatic compounds,
R1 and R2 can be identical or different, with the proviso that R1 cannot be hydrogen,
and with the proviso that in compounds having formula I R1 cannot be hydrogen or alkyl compound if X is oxygen;
m is an integer from 1 to 4, and
n is an integer from 0 to 8;
wherein m and n can be identical or different;
(b) an oxidizing agent; and
wherein the composition comprises a pH from 7.1 to 14.-
公开(公告)号：US20200231565A1
公开(公告)日：2020-07-23
申请号：US16483053
申请日：2018-01-26
发明人： Rangarajan JAGANNATHAN , James ADOLF , Jun WU , Lars KOHLMANN , Heiko BRUNNER
IPC分类号： C07D401/12 , C25D3/58 , C25D7/12 , C25D3/38
摘要： The present invention concerns pyridinium compounds, a synthesis method for their preparation, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths.The plating baths are particularly suitable for use in filling of recessed structures in the electronics and semiconductor industry including dual damascene applications.
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