公开(公告)号：US20240183052A1

公开(公告)日：2024-06-06

申请号：US18552244

申请日：2022-03-25

申请人： Atotech Deutschland GmbH & Co. KG

发明人： Peter HAACK ,  Vera PELDZINSKI-RANISCH ,  Grigory VAZHENIN ,  Hee-Bum SHIN ,  Jaewon LEE ,  Tobias BERNHARD

IPC分类号： C25D5/18 ,  B32B3/26 ,  B32B15/01 ,  B32B15/08 ,  B32B15/20 ,  C23C18/16 ,  C23C18/38 ,  C23C28/02 ,  C23F1/18 ,  C25D3/38 ,  C25D5/00 ,  C25D7/06 ,  H05K3/02

CPC分类号： C25D5/18 ,  B32B3/266 ,  B32B15/01 ,  B32B15/08 ,  B32B15/20 ,  C23C18/1637 ,  C23C18/1653 ,  C23C18/38 ,  C23C28/023 ,  C23F1/18 ,  C25D3/38 ,  C25D5/627 ,  C25D7/0614 ,  H05K3/022 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2255/28 ,  B32B2307/206 ,  B32B2307/406 ,  B32B2307/7376 ,  B32B2457/08

摘要： A process for electrochemical deposition of copper, including:



providing a rolled and annealed copper foil comprising a first surface and a second surface,
etching the first surface of the rolled and annealed copper foil, thereby creating a first etched surface,
depositing copper by electroless copper deposition on the first etched surface, thereby creating a first electroless copper layer on the first etched surface,
depositing further copper by electrochemical deposition on the first electroless copper layer, thereby creating a first electrochemical copper layer, wherein in the electrochemical deposition in a first period of time a first current density is applied and in a second period of time a second current density is applied, wherein the second current density is lower than the first current density, and a layered product obtainable by the process.

公开(公告)号：US20190264328A1

公开(公告)日：2019-08-29

申请号：US16332830

申请日：2017-09-15

申请人： Atotech Deutschland GmbH

发明人： Tobias BERNHARD ,  Anna PETER ,  Michael MERSCHKY ,  Frank BRÜNING ,  Taybet BILKAY-TRONI ,  Heiko BRUNNER

IPC分类号： C23C18/18 ,  C23C18/16 ,  C23C28/00 ,  C09D179/02

摘要： The present invention relates to a method for providing a multilayer coating on a surface of a substrate comprising the following method steps (i) providing the substrate; (ii) depositing at least one metal oxide compound onto the surface of the substrate; (iii) heat-treating the surface of the substrate such that a metal oxide is formed thereon; (iv) treating the surface of the substrate with a treatment solution comprising at least one nitrogen containing polymeric treatment additive; (v) treating the surface of the substrate with an activation solution; and (vi) treating the surface of the substrate with a metallising solution such that a metal or metal alloy is deposited thereon. The invention further concerns the use of treatment additives as enhancer for the metal deposition.