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公开(公告)号：US06873045B2
公开(公告)日：2005-03-29
申请号：US10610822
申请日：2003-07-02
IPC分类号： H01L23/051 , H01L23/36 , H01L25/07 , H01L25/18 , H02M1/00 , H02M7/48 , H01L23/52 , H01L29/40 , H01L23/48
CPC分类号： H01L25/072 , H01L23/051 , H01L23/36 , H01L24/48 , H01L2224/05599 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/484 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01047 , H01L2924/01074 , H01L2924/014 , H01L2924/10253 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/3011 , H01L2924/351 , H01L2224/45099 , H01L2924/00
摘要： One method of achieving the above subjects is by connecting one of electroconductive members 12, which are pre-connected to the top and bottom of a semiconductor chip 11 and have thermal conductivity, to an electroconductive member 13, which is used with the semiconductor chip 11 to constitute a laminated structure, in electrically insulated form on the same surface as the installation surface of the electroconductive member 13 so as to straddle the laminated structure constituted by the semiconductor chip 11 and the electroconductive member 13.
摘要翻译： 实现上述目的的一种方法是将预先连接到半导体芯片11的顶部和底部并具有导热性的导电构件12之一连接到与半导体芯片11一起使用的导电构件13 以与导电构件13的安装表面相同的表面上形成电绝缘形式的层叠结构，以跨越由半导体芯片11和导电构件13构成的叠层结构。
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公开(公告)号：US20070159864A1
公开(公告)日：2007-07-12
申请号：US11670365
申请日：2007-02-01
IPC分类号： H02M7/04
CPC分类号： H01L23/3675 , H01L23/051 , H01L25/072 , H01L2224/32225 , H01L2224/33181 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/3011 , H01L2924/00
摘要： One method of achieving the above subjects is by connecting a block member 14, which is connected to the side opposite to that of a semiconductor chip 11 having insulating substrates 12 and 13 connected to the top and bottom of the semiconductor chip 11, to a block member 15 across an laminated structure constituted by the semiconductor chip 11 and the insulating substrates 12 and 13.
摘要翻译： 实现上述目的的一种方法是通过将连接到具有连接到半导体芯片11的顶部和底部的具有绝缘基板12和13的半导体芯片11的相反侧的块的连接件块连接到块 构件15跨越由半导体芯片11和绝缘基板12和13构成的层叠结构。
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公开(公告)号：US07508068B2
公开(公告)日：2009-03-24
申请号：US11670365
申请日：2007-02-01
IPC分类号： H01L23/34
CPC分类号： H01L23/3675 , H01L23/051 , H01L25/072 , H01L2224/32225 , H01L2224/33181 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/3011 , H01L2924/00
摘要： One method of achieving the above subjects is by connecting a block member 14, which is connected to the side opposite to that of a semiconductor chip 11 having insulating substrates 12 and 13 connected to the top and bottom of the semiconductor chip 11, to a block member 15 across an laminated structure constituted by the semiconductor chip 11 and the insulating substrates 12 and 13.
摘要翻译： 实现上述目的的一种方法是通过将连接到具有连接到半导体芯片11的顶部和底部的具有绝缘基板12和13的半导体芯片11的相反侧的块的连接件块连接到块 构件15跨越由半导体芯片11和绝缘基板12和13构成的层叠结构。
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公开(公告)号：US07193317B2
公开(公告)日：2007-03-20
申请号：US10610816
申请日：2003-07-02
IPC分类号： H01L23/367
CPC分类号： H01L23/3675 , H01L23/051 , H01L25/072 , H01L2224/32225 , H01L2224/33181 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/3011 , H01L2924/00
摘要： One method of achieving the above subjects is by connecting a block member 14, which is connected to the side opposite to that of a semiconductor chip 11 having insulating substrates 12 and 13 connected to the top and bottom of the semiconductor chip 11, to a block member 15 across an laminated structure constituted by the semiconductor chip 11 and the insulating substrates 12 and 13.
摘要翻译： 实现上述目的的一种方法是通过将连接到具有连接到半导体芯片11的顶部和底部的具有绝缘基板12和13的半导体芯片11的相反侧的块的连接件块连接到块 构件15跨越由半导体芯片11和绝缘基板12和13构成的层叠结构。
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公开(公告)号：US06943445B2
公开(公告)日：2005-09-13
申请号：US10468038
申请日：2002-03-29
申请人： Shinji Shirakawa , Akira Mishima , Keiichi Mashino , Toshiyuki Innami , Shinichi Fujino , Hiromichi Anan , Yoshitaka Ochiai
发明人： Shinji Shirakawa , Akira Mishima , Keiichi Mashino , Toshiyuki Innami , Shinichi Fujino , Hiromichi Anan , Yoshitaka Ochiai
IPC分类号： H01L23/538 , H01L25/07 , H02M7/00 , H01L23/34
CPC分类号： H02M7/003 , H01L23/5383 , H01L23/645 , H01L24/48 , H01L24/49 , H01L25/072 , H01L25/18 , H01L2224/32225 , H01L2224/40225 , H01L2224/48091 , H01L2224/48111 , H01L2224/48227 , H01L2224/48472 , H01L2224/49111 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01074 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/19041 , H01L2924/19043 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： The present invention provides a semiconductor device which reduces an inductance of wiring for bridge-connecting semiconductor switches and realizes a reduction in size. Within the semiconductor device formed are two controllable bridge-connected semiconductor switches 13a and 13b, an output terminal, positive/negative polarity DC terminals 2 and 3, and an insulating substrate 15a in which conductor layers 12, 17 and 19 having a conductor section and in an inner layer for bridge-connecting the semiconductor switches to the DC terminals on a surface thereof and insulating layers 16 and 18 are alternately laminated. The surface and inner-layer conductor layers 12 and 17 which interpose the insulating layer 16 therebetween are electrically connected by a conductor 20 passing through the insulating layer 16 interposed between the conductor layers 12 and 17. A current path (dotted line) is so provided as to allow current flowing through a bridge circuit for mounting the two semiconductor switches on the insulating substrate to flow in opposite directions between the conductor layers 12 and 17 which interpose the insulating layer 16 therebetween.
摘要翻译： 本发明提供一种降低用于桥接半导体开关的布线的电感的半导体器件，并且实现了尺寸的减小。 在形成的半导体器件内部有两个可控制的桥接半导体开关13a和13b，一个输出端子，正/负极性DC端子2和3以及绝缘基板15a，其中导体层12,17和19具有 导体部分和用于将半导体开关桥接到其表面上的DC端子的内层中，并且绝缘层16和18交替层叠。 其间插入绝缘层16的表面和内层导体层12和17通过插在导体层12和17之间的绝缘层16的导体20电连接。 提供电流路径（虚线），以允许电流流过用于将绝缘基板上的两个半导体开关安装在绝缘基板上的电桥流动，以在导体层12和17之间的相反方向流动，其间插入绝缘层16。
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公开(公告)号：US06843335B2
公开(公告)日：2005-01-18
申请号：US10024338
申请日：2001-12-21
申请人： Shinji Shirakawa , Akira Mishima , Keiichi Mashino , Toshiyuki Innami , Shinichi Fujino , Hiromichi Anan , Yoshitaka Ochiai
发明人： Shinji Shirakawa , Akira Mishima , Keiichi Mashino , Toshiyuki Innami , Shinichi Fujino , Hiromichi Anan , Yoshitaka Ochiai
IPC分类号： H02M7/04 , B60L11/14 , B60L11/18 , H01L23/50 , H01L25/16 , H02M7/00 , H02M7/5387 , H02P27/06 , H05K7/14 , B60K1/00
CPC分类号： B60L15/007 , B60L11/1803 , H01L23/50 , H01L24/48 , H01L24/49 , H01L25/162 , H01L25/165 , H01L2224/0603 , H01L2224/48091 , H01L2224/48472 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01074 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H02M7/003 , H05K7/1432 , Y02T10/645 , Y02T10/7005 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A positive side conductor and a negative side conductor of an input terminal electrically connected to semiconductor elements, are electrically insulated from each other, and are laminated with each other, and the input terminal having such a laminated structure, an output terminal and substrates mounted thereon the semiconductor elements are arranged in a checkered pattern in a container. Further, the semiconductor elements mounted on the substrates, the input terminal and the output terminal are electrically connected to one another so as to obtain a loop-like electric path on a conductive member, thereby it is possible to aim at miniaturizing the power conversion apparatus and lowering the inductance thereof.
摘要翻译： 与半导体元件电连接的输入端子的正侧导体和负极导体彼此电绝缘，并且彼此层叠，并且具有这种层叠结构的输入端子，安装在其上的输出端子和基板 半导体元件以容器中的方格布置。 此外，安装在基板，输入端子和输出端子上的半导体元件彼此电连接，以便在导电构件上获得环状电路，从而可以将电力转换装置 并降低其电感。
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公开(公告)号：US06618278B2
公开(公告)日：2003-09-09
申请号：US09810259
申请日：2001-03-19
申请人： Osamu Suzuki , Shinji Shirakawa , Akira Mishima , Toshiyuki Innami , Shinichi Fujino , Hideaki Mori , Kenji Takahashi , Keiichi Mashino , Hiromichi Anan
发明人： Osamu Suzuki , Shinji Shirakawa , Akira Mishima , Toshiyuki Innami , Shinichi Fujino , Hideaki Mori , Kenji Takahashi , Keiichi Mashino , Hiromichi Anan
IPC分类号： H01L2340
CPC分类号： H02M7/003 , H01L2224/32245 , H01L2224/33181 , H01L2924/13055 , H01L2924/13091 , H01L2924/00
摘要： In an electric power conversion/inversion apparatus, including, such as an inverter therein, for obtaining reduction in circuit inductance and wiring resistance therein by bringing small as a whole, having good installability and high reliability and efficiency of electric power conversion, as well, semiconductor chips 1 are disposed, being put between a positive input bus bar 14p and a negative input bus bar 14n and plural output bus bars 18 at crossing positions thereof, and are connected electrically and thermally, to the positive input bus bar 14p in a pole direction consistent therewith while to the negative input bus bar 14n in a pole direction consistent therewith, and further to the common output bus bars 18 in pole directions being different from side by side.
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公开(公告)号：US07471004B2
公开(公告)日：2008-12-30
申请号：US11745036
申请日：2007-05-07
申请人： Hiroshi Kanazawa , Takashi Kobayashi , Noriaki Hino , Shinji Shirakawa , Keiichi Mashino , Masanori Tsuchiya
发明人： Hiroshi Kanazawa , Takashi Kobayashi , Noriaki Hino , Shinji Shirakawa , Keiichi Mashino , Masanori Tsuchiya
CPC分类号： H02P25/22 , H02J7/1492 , Y02T10/7005 , Y02T10/92
摘要： An AC generator comprises a rotor and a stator having a three-phase winding. A three-phase inverter is connected to the three-phase winding. Here, the three-phase winding comprises at least two independent three-phase windings. Switching elements for respective phases of the three-phase inverter are connected in parallel by the number of the independent three-phase windings, and in-phase windings are individually connected to their parallel switching elements.
摘要翻译： 交流发电机包括转子和具有三相绕组的定子。 三相绕组连接三相逆变器。 这里，三相绕组包括至少两个独立的三相绕组。 三相逆变器的各相的开关元件并联连接独立的三相绕组的数量，并且同相绕组分别连接到它们的并联开关元件。
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公开(公告)号：US20060006655A1
公开(公告)日：2006-01-12
申请号：US11177392
申请日：2005-07-11
申请人： Hiroshi Kanazawa , Takashi Kobayashi , Noriaki Hino , Shinji Shirakawa , Keiichi Mashino , Masanori Tsuchiya
发明人： Hiroshi Kanazawa , Takashi Kobayashi , Noriaki Hino , Shinji Shirakawa , Keiichi Mashino , Masanori Tsuchiya
CPC分类号： H02P25/22 , H02J7/1492 , Y02T10/7005 , Y02T10/92
摘要： An AC generator comprises a rotor and a stator having a three-phase winding. A three-phase inverter is connected to the three-phase winding. Here, the three-phase winding comprises at least two independent three-phase windings. Switching elements for respective phases of the three-phase inverter are connected in parallel by the number of the independent three-phase windings, and in-phase windings are individually connected to their parallel switching elements.
摘要翻译： 交流发电机包括转子和具有三相绕组的定子。 三相绕组连接三相逆变器。 这里，三相绕组包括至少两个独立的三相绕组。 三相逆变器的各相的开关元件并联连接独立的三相绕组的数量，并且同相绕组分别连接到它们的并联开关元件。
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公开(公告)号：US5929613A
公开(公告)日：1999-07-27
申请号：US923938
申请日：1997-09-05
CPC分类号： H02J7/166
摘要： A regulator for an alternator installed in a vehicle has a switching circuit in which a field current limiting transistor interruptibly controls a flow of current to a field coil of the alternator. A battery output voltage detection terminal is connected to the battery, and an alternator output voltage terminal is connected to the alternator. A diode connected to the battery output voltage detection terminal has a reverse recovery time of 20 ns-20 .mu.s, and a resistor is connected between the diode and the alternator output voltage terminal. A control circuit controls the switching circuit, in order to regulate the voltage at a connection point of the diode and the resistor so as to keep the voltage constant, and an alarm generating circuit illuminates a charge indicator lamp if the voltage at a junction of said diode and said resistor exceeds a reference voltage.
摘要翻译： 安装在车辆中的交流发电机的调节器具有开关电路，其中励磁电流限制晶体管可以阻断对交流发电机的励磁线圈的电流的流动。 电池输出电压检测端子连接到电池，并且交流发电机输出电压端子连接到交流发电机。 连接到电池输出电压检测端子的二极管具有20ns-20μs的反向恢复时间，并且在二极管和交流发电机输出电压端子之间连接有电阻器。 控制电路控制开关电路，以便调节二极管和电阻器的连接点处的电压，以便保持电压恒定，并且如果所述电压指示灯的接点处的电压为所述电压指示灯，则警报发生电路照亮充电指示灯 二极管和所述电阻器超过参考电压。
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