摘要:
A method is for driving a gas discharge type light emission apparatus having an electrode block line(s) constituted by electrode blocks. Scanning of adjacent cathodes, one being in one of two adjacent electrode blocks and the other being in the other electrode block, is effected such that subsequent to the scanning of one adjacent cathode, at least one cathode other than the other adjacent cathode is scanned prior to the scanning of the other adjacent cathode. By the method, crosstalk between adjacent electrode blocks is prevented without the provision of a partitioning member between the adjacent electrode blocks. A gas discharge type light emission apparatus includes an anode(s) on a front substrate and cathodes on a rear substrate. The anodes and cathodes face one another via a discharge gas medium to constitute discharge cells. The anodes are made of a light-blocking material and including windows at positions corresponding to the cathodes. The windows are also provided at positions corresponding to boundaries between adjacent anodes. By providing windows, discharge light emission having a clear shape and a high resolution can be obtained.
摘要:
Light emitted from an array of light-emitting elements in an electrophotographic printer is transmitted through a birefringent plate that deflects light polarized in a first plane but does not deflect light polarized in a second plane perpendicular to the first plane, and through a polarization switching device that is controlled by an electrical signal so as to selectably transmit light polarized in either the first plane or the second plane. The transmitted light illuminates a photosensitive medium. Each light-emitting element can illuminate two dots on the photosensitive medium, depending on the state of the polarization switching device, thereby doubling the dot resolution.
摘要:
A semiconductor device has a first surface with at least one wire bonding pad, a second surface located opposite to the first surface, and at least one side sloping inward from the first surface to the second surface. According to a first aspect of the invention, all wire bonding pads formed on the first surface are formed in the part opposite the second surface, so that mechanical loads applied during wire bonding are transmitted to the second surface and do not cause cracks in the sloping side. According to a second aspect of the invention, when an array of such semiconductor devices is mounted on a substrate, resin mounds supporting the sloping sides are formed between the semiconductor devices, so that mechanical loads transmitted to the sloping sides during wire bonding are then transmitted through the resin mounds to the substrate.
摘要:
An LED array chip comprises a semiconductor substrate having a front surface and a side surface. The first surface and the front surface come together at an end of the chip to define an end portion of said semiconductor substrate that has an acute angle between the first surface and the front surface. The end of the chip defines an outermost dimension of the chip. The first surface extends further away from the front surface than the diffuison depth of the light emitting elements. A method of manufacturing an LED array chip includes the steps of: forming grooves between adjacent LED arrays of the plurality of LED arrays, each of the grooves having opposing side walls each of which makes an acute angle with the front surface; and dicing the semiconductor wafer except for the opposing side walls of each of the grooves to separate the plurality of LED arrays into individual LED array chips.