公开(公告)号：US06515309B1

公开(公告)日：2003-02-04

申请号：US09472349

申请日：1999-12-27

申请人： Hiroshi Tohyama ,  Susumu Ozawa ,  Yuko Kasamura ,  Satoru Yamada

发明人： Hiroshi Tohyama ,  Susumu Ozawa ,  Yuko Kasamura ,  Satoru Yamada

IPC分类号： H01L3300

CPC分类号： H01L27/153 ,  H01L33/0095 ,  H01L33/20

摘要： An LED array chip comprises a semiconductor substrate having a front surface and a side surface. The first surface and the front surface come together at an end of the chip to define an end portion of said semiconductor substrate that has an acute angle between the first surface and the front surface. The end of the chip defines an outermost dimension of the chip. The first surface extends further away from the front surface than the diffuison depth of the light emitting elements. A method of manufacturing an LED array chip includes the steps of: forming grooves between adjacent LED arrays of the plurality of LED arrays, each of the grooves having opposing side walls each of which makes an acute angle with the front surface; and dicing the semiconductor wafer except for the opposing side walls of each of the grooves to separate the plurality of LED arrays into individual LED array chips.

摘要翻译： LED阵列芯片包括具有前表面和侧表面的半导体衬底。 第一表面和前表面在芯片的一端汇合在一起，以限定在第一表面和前表面之间具有锐角的所述半导体衬底的端部。 芯片的端部限定了芯片的最外层尺寸。 第一表面比发光元件的扩散深度远离前表面延伸。 制造LED阵列芯片的方法包括以下步骤：在多个LED阵列的相邻LED阵列之间形成凹槽，每个凹槽具有与前表面成锐角的相对侧壁; 并且除了每个凹槽的相对的侧壁之外的半导体晶片划片以将多个LED阵列分离成单独的LED阵列芯片。

公开(公告)号：US06433367B1

公开(公告)日：2002-08-13

申请号：US09599106

申请日：2000-06-22

申请人： Hiroshi Tohyama ,  Susumu Ozawa ,  Satoru Yamada

发明人： Hiroshi Tohyama ,  Susumu Ozawa ,  Satoru Yamada

IPC分类号： H01L3300

CPC分类号： H01L24/06 ,  B41J2/451 ,  H01L24/05 ,  H01L24/48 ,  H01L33/20 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01031 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2224/45099 ,  H01L2924/00

摘要： A semiconductor device has a first surface with at least one wire bonding pad, a second surface located opposite to the first surface, and at least one side sloping inward from the first surface to the second surface. According to a first aspect of the invention, all wire bonding pads formed on the first surface are formed in the part opposite the second surface, so that mechanical loads applied during wire bonding are transmitted to the second surface and do not cause cracks in the sloping side. According to a second aspect of the invention, when an array of such semiconductor devices is mounted on a substrate, resin mounds supporting the sloping sides are formed between the semiconductor devices, so that mechanical loads transmitted to the sloping sides during wire bonding are then transmitted through the resin mounds to the substrate.

摘要翻译： 半导体器件具有第一表面，其具有至少一个引线接合焊盘，与第一表面相对的第二表面和从第一表面向第二表面向内倾斜的至少一个侧面。 根据本发明的第一方面，形成在第一表面上的所有引线接合焊盘形成在与第二表面相对的部分中，使得在引线接合期间施加的机械载荷被传递到第二表面，并且不会在倾斜中引起裂纹 侧。 根据本发明的第二方面，当将这种半导体器件的阵列安装在基板上时，在半导体器件之间形成支撑倾斜侧的树脂堆，从而在引线接合期间传输到倾斜侧的机械载荷然后传输 通过树脂堆到基材。

公开(公告)号：US08864060B2

公开(公告)日：2014-10-21

申请号：US13449976

申请日：2012-04-18

申请人： Satoru Yamada ,  Yoshiyuki Hatayama

发明人： Satoru Yamada ,  Yoshiyuki Hatayama

IPC分类号： B21H3/04 ,  B65H18/28 ,  B65H75/18 ,  H01F27/28 ,  H01F27/26 ,  H01F41/06 ,  H01F17/04

CPC分类号： H01F27/29 ,  H01F27/2823 ,  H01F41/064 ,  H01F41/071 ,  H01F2017/048

摘要： A coil component includes an air-core winding wire portion wound by a wire with a plurality of wound layers by alignment winding, a spiral shaped wound portion in which the wire wound in a spiral shape from an inner edge of an end surface toward an outer edge thereof along the end surface while in contact with the end surface on one side in the axis direction of the winding wire portion, a first lead portion extended and extracted outward from a winding first end point of the spiral shaped wound portion, and a second lead portion extended and extracted outward from a winding second end point at the outer circumference of the winding wire portion.

摘要翻译： 线圈部件包括由具有通过对准绕组的多个卷绕层的线缠绕的空心绕组线，螺旋形缠绕部分，其中线从端表面的内边缘向外部缠绕成螺旋形状 其沿着所述端面与所述绕线部的轴线方向的一侧的端面接触，从所述螺旋状卷绕部的卷绕的第一端部向外延伸并向外伸出的第一引导部， 引线部分从卷绕线部分的外周上的绕组第二端点向外延伸和提取。

公开(公告)号：US08385077B2

公开(公告)日：2013-02-26

申请号：US12900390

申请日：2010-10-07

申请人： Satoru Yamada

发明人： Satoru Yamada

IPC分类号： H05K1/14 ,  H05K7/16 ,  H05K5/00 ,  H05K7/14

CPC分类号： G11B33/128 ,  G11B33/122 ,  G11B33/126

摘要： An electronic device includes a housing having an accommodation space, a first support body being slidably insertable into the accommodation space in parallel with a predetermined plane, a second support body coupled with the first support body rotatably around a rotation axis parallel to a front side of the housing and being rotatable between a reference attitude disposed in the same plane with respect to the first support body and an inclined attitude disposed at a given angle with respect to the first support body, and a drive mechanism for changing the attitude of the second support body.

摘要翻译： 电子设备包括具有容纳空间的壳体，与预定平面平行地可滑动地插入到容纳空间中的第一支撑体;与第一支撑体可旋转地围绕平行于预定平面的旋转轴线可旋转地连接的第二支撑体 所述壳体能够相对于所述第一支撑体设置在同一平面中的基准姿态和相对于所述第一支撑体以给定角度设置的倾斜姿态之间旋转;以及驱动机构，用于改变所述第二支撑件的姿态 身体。

公开(公告)号：US08368169B2

公开(公告)日：2013-02-05

申请号：US12897095

申请日：2010-10-04

申请人： Seunguk Han ,  Satoru Yamada ,  Young Jin Choi

发明人： Seunguk Han ,  Satoru Yamada ,  Young Jin Choi

IPC分类号： H01L21/70

CPC分类号： H01L21/823481 ,  H01L21/76229 ,  H01L21/823425

摘要： An example semiconductor device includes a trench formed in a semiconductor substrate to define an active region, a filling dielectric layer provided within the trench, an oxide layer provided between the filling dielectric layer and the trench, a nitride layer provided between the oxide layer and the filling dielectric layer, and a barrier layer provided between the oxide layer and the nitride layer.

摘要翻译： 示例性半导体器件包括形成在半导体衬底中以限定有源区的沟槽，设置在沟槽内的填充介电层，设置在填充介电层和沟槽之间的氧化物层，设置在氧化物层和 填充介电层，以及设置在氧化物层和氮化物层之间的阻挡层。

公开(公告)号：US20120251171A1

公开(公告)日：2012-10-04

申请号：US13523763

申请日：2012-06-14

申请人： Norifumi Muranaka ,  Satoru Yamada ,  Kazuhiro Yamauchi ,  Seiji Tsuru ,  Yuka Muranaka

发明人： Norifumi Muranaka ,  Satoru Yamada ,  Kazuhiro Yamauchi ,  Seiji Tsuru ,  Yuka Muranaka

IPC分类号： G03G21/18 ,  B32B25/00 ,  G03G15/00

CPC分类号： G03G15/0233 ,  B05D3/007 ,  B32B1/08 ,  B32B15/06 ,  B32B15/18 ,  B32B25/02 ,  B32B25/14 ,  B32B2264/104 ,  B32B2264/108 ,  B32B2307/202 ,  B32B2457/00 ,  G03G15/0818 ,  G03G15/1685 ,  Y10T428/31855

摘要： Provided is such a conductive member that a change in its electrical resistance value caused by its long-term use is reduced to the extent possible. The conductive member has a conductive support and a conductive layer, the conductive layer contains a rubber composition formed of a modified epichlorohydrin rubber, and the modified epichlorohydrin rubber has a unit represented by the following formula (1). In the formula (1), R1, R2, and R3 each independently represent hydrogen or a saturated hydrocarbon group having 1 to 18 carbon atoms.

摘要翻译： 提供这样的导电构件，其长期使用引起的其电阻值的变化尽可能地减小。 导电构件具有导电性支撑体和导电层，导电层含有由改性表氯醇橡胶形成的橡胶组合物，改性表氯醇橡胶具有下述式（1）表示的单元。 在式（1）中，R 1，R 2和R 3各自独立地表示氢或碳原子数1〜18的饱和烃基。

公开(公告)号：US08207808B2

公开(公告)日：2012-06-26

申请号：US13093299

申请日：2011-04-25

申请人： Satoru Yamada ,  Yoshiyuki Hatayama

发明人： Satoru Yamada ,  Yoshiyuki Hatayama

IPC分类号： H01F27/29

CPC分类号： H01F27/29 ,  H01F17/04 ,  H01F27/292 ,  H01F41/10 ,  H01F2017/048 ,  Y10T29/49071 ,  Y10T29/49073

摘要： A coil component includes a core formed by a magnetic material, a coil embedded in the core, a part of a terminal portion of the coil protruded from a side surface of the core, and a tabular terminal, a part thereof protruded from the side surface of the core and partly connected with the protruded part of the terminal portion of the coil. The protruded part of the terminal portion of the coil and the protruded part of the tabular terminal are respectively bent toward the bottom surface side of the core along the side surface of the core, and the protruded and bent part of the terminal portion of the coil is arranged between the protruded and bent part of the tabular terminal and the core.

摘要翻译： 线圈部件包括由磁性材料形成的芯部，嵌入在芯部中的线圈，从芯部的侧表面突出的线圈的端子部分的一部分，以及从侧面突出的部分 并且部分地与线圈的端子部分的突出部分连接。 线圈的端子部分的突出部分和平板状端子的突出部分分别沿着芯的侧表面朝着芯的底表面侧弯曲，并且线圈的端子部分的突出和弯曲部分 布置在板状端子的突出部分和弯曲部分之间。

公开(公告)号：US20120070188A1

公开(公告)日：2012-03-22

申请号：US13305262

申请日：2011-11-28

申请人： Yuka Hirakoso ,  Satoru Yamada ,  Seiji Tsuru ,  Kazuhiro Yamauchi ,  Norifumi Muranaka

发明人： Yuka Hirakoso ,  Satoru Yamada ,  Seiji Tsuru ,  Kazuhiro Yamauchi ,  Norifumi Muranaka

IPC分类号： G03G21/16 ,  G03G15/02

CPC分类号： G03G15/0233 ,  G03G15/0818 ,  G03G21/1814 ,  Y10T428/25

摘要： An electroconductive member excellent in durability even when applying direct current voltage over a long period of time is provided. Disclosed is an electroconductive member including an electroconductive mandrel and an electroconductive layer, wherein: the electroconductive layer includes a binder resin and an electroconductive metal oxide particle dispersed in the electroconductive layer; the metal oxide particle has a group represented by the following structural formula (1) on the surface of the metal oxide particle; and the group represented by the following structural formula (1) is introduced by substituting a hydrogen atom of a hydroxyl group as a functional group originating from the metal oxide particle, with the group represented by the following structural formula (1): —R—SO3H

摘要翻译： 提供即使在长时间施加直流电压时耐久性优异的导电构件。 公开了一种导电构件，其包括导电心轴和导电层，其中：导电层包括分散在导电层中的粘合剂树脂和导电金属氧化物颗粒; 金属氧化物颗粒在金属氧化物颗粒的表面上具有由以下结构式（1）表示的基团; 并且由以下结构式（1）表示的基团代替由羟基作为起始金属氧化物颗粒的官能团的氢原子引入由以下结构式（1）表示的基团：-R- SO3H

公开(公告)号：US20090233433A1

公开(公告)日：2009-09-17

申请号：US12453737

申请日：2009-05-20

申请人： Satoru Yamada ,  Ryo Nagai

发明人： Satoru Yamada ,  Ryo Nagai

IPC分类号： H01L21/28

CPC分类号： H01L21/28061 ,  H01L21/823842 ,  H01L29/4941

摘要： A method for forming a semiconductor device includes, in order, consecutively depositing a gate insulating film and a silicon layer on a semiconductor substrate, implanting boron into the silicon layer, diffusing the boron by heat-treating the silicon layer, implanting phosphorous into the silicon layer, diffusing at least the phosphorous by heat-treating the silicon layer, and patterning the silicon layer by using a dry etching technique.

摘要翻译： 一种形成半导体器件的方法依次包括在半导体衬底上沉积栅极绝缘膜和硅层，将硼注入到硅层中，通过热处理硅层来扩散硼，将磷注入到硅中 层，通过热处理硅层至少扩散至少磷，并通过使用干蚀刻技术图案化硅层。

公开(公告)号：US20080099850A1

公开(公告)日：2008-05-01

申请号：US11976252

申请日：2007-10-23

申请人： Chang-Hoon Jeon ,  Satoru Yamada ,  Sang-Yeon Han ,  Jong-Man Park ,  Si-Ok Sohn

发明人： Chang-Hoon Jeon ,  Satoru Yamada ,  Sang-Yeon Han ,  Jong-Man Park ,  Si-Ok Sohn

IPC分类号： H01L29/78 ,  H01L21/336

CPC分类号： H01L29/7851 ,  H01L29/41791 ,  H01L29/66795 ,  H01L2029/7858

摘要： In a fin field effect transistor (Fin FET)and a method of manufacturing the Fin FET, the Fin FET includes an active pattern inside which insulating layer patterns are formed, an isolation layer pattern enclosing a sidewall of the active pattern such that an opening exposing a sidewall of the active pattern located between the insulating layer patterns is formed, a gate electrode formed on the active pattern to fill the opening, impurity regions formed at portions of the active pattern adjacent to sidewalls of the gate electrode, an insulating interlayer covering the active pattern and the gate electrode and contact plugs formed through portions of the insulating interlayer and the active pattern adjacent to the sidewalls of the gate electrode such that the contact plug makes contact with the impurity region.

摘要翻译： 在翅片场效应晶体管（Fin FET）和制造Fin FET的方法中，Fin FET包括其中形成绝缘层图案的有源图案，包围有源图案的侧壁的隔离层图案，使得开口露出 形成位于绝缘层图案之间的有源图案的侧壁，形成在有源图案上以填充开口的栅电极，形成在与栅电极的侧壁相邻的有源图案的部分处的杂质区，覆盖 有源图案和通过绝缘夹层的一部分和与栅电极的侧壁相邻的有源图案形成的栅电极和接触插塞，使得接触插塞与杂质区接触。