公开(公告)号：US06433367B1

公开(公告)日：2002-08-13

申请号：US09599106

申请日：2000-06-22

申请人： Hiroshi Tohyama ,  Susumu Ozawa ,  Satoru Yamada

发明人： Hiroshi Tohyama ,  Susumu Ozawa ,  Satoru Yamada

IPC分类号： H01L3300

CPC分类号： H01L24/06 ,  B41J2/451 ,  H01L24/05 ,  H01L24/48 ,  H01L33/20 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01031 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2224/45099 ,  H01L2924/00

摘要： A semiconductor device has a first surface with at least one wire bonding pad, a second surface located opposite to the first surface, and at least one side sloping inward from the first surface to the second surface. According to a first aspect of the invention, all wire bonding pads formed on the first surface are formed in the part opposite the second surface, so that mechanical loads applied during wire bonding are transmitted to the second surface and do not cause cracks in the sloping side. According to a second aspect of the invention, when an array of such semiconductor devices is mounted on a substrate, resin mounds supporting the sloping sides are formed between the semiconductor devices, so that mechanical loads transmitted to the sloping sides during wire bonding are then transmitted through the resin mounds to the substrate.

摘要翻译： 半导体器件具有第一表面，其具有至少一个引线接合焊盘，与第一表面相对的第二表面和从第一表面向第二表面向内倾斜的至少一个侧面。 根据本发明的第一方面，形成在第一表面上的所有引线接合焊盘形成在与第二表面相对的部分中，使得在引线接合期间施加的机械载荷被传递到第二表面，并且不会在倾斜中引起裂纹 侧。 根据本发明的第二方面，当将这种半导体器件的阵列安装在基板上时，在半导体器件之间形成支撑倾斜侧的树脂堆，从而在引线接合期间传输到倾斜侧的机械载荷然后传输 通过树脂堆到基材。

公开(公告)号：US06515309B1

公开(公告)日：2003-02-04

申请号：US09472349

申请日：1999-12-27

申请人： Hiroshi Tohyama ,  Susumu Ozawa ,  Yuko Kasamura ,  Satoru Yamada

发明人： Hiroshi Tohyama ,  Susumu Ozawa ,  Yuko Kasamura ,  Satoru Yamada

IPC分类号： H01L3300

CPC分类号： H01L27/153 ,  H01L33/0095 ,  H01L33/20

摘要： An LED array chip comprises a semiconductor substrate having a front surface and a side surface. The first surface and the front surface come together at an end of the chip to define an end portion of said semiconductor substrate that has an acute angle between the first surface and the front surface. The end of the chip defines an outermost dimension of the chip. The first surface extends further away from the front surface than the diffuison depth of the light emitting elements. A method of manufacturing an LED array chip includes the steps of: forming grooves between adjacent LED arrays of the plurality of LED arrays, each of the grooves having opposing side walls each of which makes an acute angle with the front surface; and dicing the semiconductor wafer except for the opposing side walls of each of the grooves to separate the plurality of LED arrays into individual LED array chips.

摘要翻译： LED阵列芯片包括具有前表面和侧表面的半导体衬底。 第一表面和前表面在芯片的一端汇合在一起，以限定在第一表面和前表面之间具有锐角的所述半导体衬底的端部。 芯片的端部限定了芯片的最外层尺寸。 第一表面比发光元件的扩散深度远离前表面延伸。 制造LED阵列芯片的方法包括以下步骤：在多个LED阵列的相邻LED阵列之间形成凹槽，每个凹槽具有与前表面成锐角的相对侧壁; 并且除了每个凹槽的相对的侧壁之外的半导体晶片划片以将多个LED阵列分离成单独的LED阵列芯片。

公开(公告)号：US5212472A

公开(公告)日：1993-05-18

申请号：US413678

申请日：1989-09-28

申请人： Atsushi Takahashi ,  Hiroshi Furuya ,  Hideo Sawai ,  Mio Chiba ,  Yukio Nakamura ,  Masao Ikehata ,  Hiroshi Tohyama ,  Hiromi Takahashi ,  Yoshitaka Terao ,  Yuuji Terouchi

发明人： Atsushi Takahashi ,  Hiroshi Furuya ,  Hideo Sawai ,  Mio Chiba ,  Yukio Nakamura ,  Masao Ikehata ,  Hiroshi Tohyama ,  Hiromi Takahashi ,  Yoshitaka Terao ,  Yuuji Terouchi

IPC分类号： G06K15/12 ,  G09G3/29

CPC分类号： G06K15/1247 ,  G09G3/285

摘要： A method is for driving a gas discharge type light emission apparatus having an electrode block line(s) constituted by electrode blocks. Scanning of adjacent cathodes, one being in one of two adjacent electrode blocks and the other being in the other electrode block, is effected such that subsequent to the scanning of one adjacent cathode, at least one cathode other than the other adjacent cathode is scanned prior to the scanning of the other adjacent cathode. By the method, crosstalk between adjacent electrode blocks is prevented without the provision of a partitioning member between the adjacent electrode blocks. A gas discharge type light emission apparatus includes an anode(s) on a front substrate and cathodes on a rear substrate. The anodes and cathodes face one another via a discharge gas medium to constitute discharge cells. The anodes are made of a light-blocking material and including windows at positions corresponding to the cathodes. The windows are also provided at positions corresponding to boundaries between adjacent anodes. By providing windows, discharge light emission having a clear shape and a high resolution can be obtained.

摘要翻译： 一种用于驱动具有由电极块构成的电极块线的气体放电型发光装置的方法。 实现相邻阴极的扫描，一个位于两个相邻电极块中的一个中，另一个位于另一个电极块中，使得在一个相邻阴极的扫描之后，至少一个除了另一个相邻阴极之外的阴极被扫描 到另一个相邻阴极的扫描。 通过该方法，可以防止相邻的电极块之间的串扰，而不在相邻的电极块之间设置分隔构件。 气体放电型发光装置包括前基板上的阳极和后基板上的阴极。 阳极和阴极通过放电气体介质彼此面对以构成放电单元。 阳极由遮光材料制成，并且在对应于阴极的位置处包括窗口。 窗口也设置在对应于相邻阳极之间的边界的位置处。 通过提供窗口，可以获得具有清晰形状和高分辨率的放电发光。

公开(公告)号：US5835120A

公开(公告)日：1998-11-10

申请号：US542063

申请日：1995-10-12

申请人： Hiroshi Hamano ,  Hiroshi Furuya ,  Hiroshi Tohyama ,  Hiromasa Kanno ,  Shigeki Ogura ,  Yuji Terouchi

发明人： Hiroshi Hamano ,  Hiroshi Furuya ,  Hiroshi Tohyama ,  Hiromasa Kanno ,  Shigeki Ogura ,  Yuji Terouchi

IPC分类号： B41J2/45 ,  B41J2/47

CPC分类号： B41J2/451

摘要： Light emitted from an array of light-emitting elements in an electrophotographic printer is transmitted through a birefringent plate that deflects light polarized in a first plane but does not deflect light polarized in a second plane perpendicular to the first plane, and through a polarization switching device that is controlled by an electrical signal so as to selectably transmit light polarized in either the first plane or the second plane. The transmitted light illuminates a photosensitive medium. Each light-emitting element can illuminate two dots on the photosensitive medium, depending on the state of the polarization switching device, thereby doubling the dot resolution.

摘要翻译： 从电子照相打印机中的发光元件阵列发射的光透过双折射板，该双折射板使偏振在第一平面中的光偏转，但不偏转垂直于第一平面的第二平面偏振的光，并且通过偏振切换装置 其由电信号控制，以便可选择地透射在第一平面或第二平面中偏振的光。 透射光照射光敏介质。 根据偏振切换装置的状态，每个发光元件可以照射光敏介质上的两个点，从而使点分辨率加倍。