-
1.发明公开公开(公告)号：US20240355978A1
公开(公告)日：2024-10-24
申请号：US18254210
申请日：2022-04-21
发明人： Nianqi YAO , Zhongpeng TIAN , Ce NING , Zhengliang LI , Hehe HU , Jie HUANG , Jiayu HE , Feifei LI , Kun ZHAO , Yimin CHEN
IPC分类号： H01L33/62 , G02F1/13357 , H05K3/46
CPC分类号： H01L33/62 , G02F1/133603 , H05K3/4688
摘要： A circuit board includes a substrate and a stress neutral layer disposed on a side of the substrate. The stress neutral layer includes one or more first metal layers and one or more second metal layers. The one or more second metal layers and the one or more first metal layers are stacked. At least one of the one or more first metal layers is made of a material for generating a tensile stress, and at least one of the one or more second metal layers is made of a material for generating a compressive stress.
-
2.发明申请公开(公告)号：US20180277344A1
公开(公告)日：2018-09-27
申请号：US15541883
申请日：2017-01-03
发明人： Zhongpeng TIAN , Xuewei GAO , Lei XIAO , Jianhua DU
摘要： A magnetron sputtering device, a magnetron sputtering apparatus, and a magnetron sputtering method are provided. The magnetron sputtering device includes: a target material bearing portion, configured to bear a target material thereon; a magnet bearing section, configured to bear a magnet thereon and to be capable of driving the magnet to perform reciprocating motion along a predetermined path with respect to the target material bearing portion; a limit sensor, configured to determine an end-point position of the predetermined path along which the magnet performs reciprocating motion; the end-point position determined by the limit sensor can be adjusted along the predetermined path during a working procedure of the magnetron sputtering device.
-
搜索结果
2 条记录 (耗时 0.017 秒)
