Driving substrate, manufacturtion method thereof and display device

    公开(公告)号:US12183867B2

    公开(公告)日:2024-12-31

    申请号:US17628926

    申请日:2021-03-10

    Abstract: The present disclosure provides a driving substrate, including: a flexible substrate including a display region and a bendable region; a first conductive layer on the flexible substrate and including a first wire in the display region, and a connection wire at least partially in the bendable region; a flexible insulating layer including a first insulation pattern in the display region, and a second insulation pattern in the bendable region; a second conductive layer at a side of the flexible insulating layer far away from the flexible substrate; and a planarization layer at a side of the second conductive layer far away from the flexible substrate and having a hollow structure in the bendable region, wherein a thickness of a portion of the second insulating pattern covering the connection wire is d2, a thickness of the flexible substrate is d3, and d2≥2 μm and |d2−d3|≤3 μm.

    CHIP ON FILM, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE

    公开(公告)号:US20240363510A1

    公开(公告)日:2024-10-31

    申请号:US18580229

    申请日:2022-11-24

    CPC classification number: H01L23/49822 H01L21/4857 H01L23/4985

    Abstract: A chip on film includes: a flexible substrate; and a multilayer wiring structure disposed on the flexible substrate. The multilayer wiring structure includes a first wiring layer, a first insulation layer and a second wiring layer, which are sequentially arranged in a direction towards the flexible substrate the flexible substrate. The first wiring layer includes a first conductive material and the second wiring layer includes a second conductive material. The chip on film further includes: pins, at least part of which are in the first wiring layer; first via holes in the first insulation layer; and a second wire and a second wire leading portion in the second wiring layer, which are electrically connected to each other. More than one pin is electrically connected to the second wire leading portion through more than one first via hole, respectively.

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