PHOTOELECTRIC DETECTOR, PREPARATION METHOD THEREOF, DISPLAY PANEL AND DISPLAY DEVICE

    公开(公告)号:US20210005769A1

    公开(公告)日:2021-01-07

    申请号:US16909526

    申请日:2020-06-23

    摘要: The present disclosure discloses a photoelectric detector, a preparation method thereof, a display panel and a display device. The photoelectric detector includes a base, and a thin film transistor (TFT) and a photosensitive PIN device on the base, wherein the PIN device includes an I-type region that does not overlap with an orthographic projection of the TFT on the base; a first etching barrier layer covering a top surface of the I-type region; a first heavily doped region in contact with a side surface on a side, proximate to the TFT, of the I-type region; and a second heavily doped region in contact with a side surface on a side, away from the TFT, of the I-type region, the doping types of the first heavily doped region and the second heavily doped region being different from each other.

    ARRAY SUBSTRATE, ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ARRAY SUBSTRATE

    公开(公告)号:US20210408095A1

    公开(公告)日:2021-12-30

    申请号:US17290495

    申请日:2020-09-23

    摘要: The present disclosure provides an array substrate, an electronic device and a manufacturing method of the array substrate. The array substrate includes a base substrate, and a first transistor and a second transistor on the base substrate, a first electrode of the first transistor being connected to a second electrode of the second transistor; the array substrate further includes a photodiode including a first electrode, a second electrode, and a photosensitive layer between the first electrode and the second electrode, and the first electrode is electrically connected to a gate of the first transistor. In the arrangement, the first transistor and the second transistor are connected in series to form one control unit, and the uniformity and stability of the control unit are greatly improved.

    METHOD FOR PREPARING ARRAY SUBSTRATE, ARRAY SUBSTRATE AND DISPLAY PANEL

    公开(公告)号:US20210111200A1

    公开(公告)日:2021-04-15

    申请号:US16846888

    申请日:2020-04-13

    摘要: The present disclosure discloses a method for preparing an array substrate, an array substrate and a display panel, wherein the method comprises: forming a buffer layer on a substrate in a first region and a second region, wherein the buffer layer has a groove located in the second region; forming a first indium oxide thin film on the buffer layer in the first region; forming a second indium oxide thin film in the groove; performing a reduction process on the second indium oxide thin film to obtain indium particles; forming an amorphous silicon thin film in the groove, and inducing the amorphous silicon of the amorphous silicon thin film to form microcrystalline silicon at a preset temperature by using the indium particles; and removing the indium particles in the microcrystalline silicon to form a microcrystalline silicon semiconductor layer of the microcrystalline silicon thin film transistor.

    DRIVING SUBSTRATE AND MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE

    公开(公告)号:US20220028898A1

    公开(公告)日:2022-01-27

    申请号:US17354007

    申请日:2021-06-22

    IPC分类号: H01L27/12 H01L25/16

    摘要: The present disclosure provides a driving substrate including: a flexible substrate base, a plurality of thin film transistors on the flexible substrate base and a first conductive pattern layer on a side of the thin film transistors distal to the flexible substrate base. The first conductive pattern layer includes: a plurality of first connection terminals in the display region and a plurality of signal supply lines in the bendable region. A first number of first connection terminals are electrically coupled to first electrodes of the plurality of thin film transistors. The plurality of signal supply lines are coupled to a second number of first connection terminals other than the first number of first connection terminals. At least one inorganic insulating layer including a hollowed-out pattern in the bendable region is between the first conductive pattern layer and the flexible substrate base.

    THIN FILM TRANSISTOR, PIXEL STRUCTURE, DISPLAY DEVICE AND MANUFACTURING METHOD

    公开(公告)号:US20210028315A1

    公开(公告)日:2021-01-28

    申请号:US16641078

    申请日:2019-02-22

    摘要: The present disclosure provides a thin film transistor, a pixel structure, a display device, and a manufacturing method. The thin film transistor includes: a gate on the substrate; a gate insulating layer covering the gate and the substrate; a first support portion and a second support portion, which are provided on the gate insulating layer covering the substrate and located on both sides of the gate, wherein the first support portion is not connected to the second support portion; a semiconductor layer on the first support portion, the second support portion, and the gate insulating layer covering the gate; and a source and a drain respectively connected to the semiconductor layer. The first support portion and the second support portion are respectively configured to support the semiconductor layer.

    Light Emitting Diode, Display Substrate and Transfer Method

    公开(公告)号:US20210020613A1

    公开(公告)日:2021-01-21

    申请号:US16904584

    申请日:2020-06-18

    IPC分类号: H01L25/075 H01L25/16

    摘要: A light emitting diode, a display substrate and a transfer method are disclosed. The transfer method includes: disposing a display substrate on an adsorption carrier plate, and absorbing, by a transport head, multiple light emitting diodes from a donor substrate; dropping, by the transport head, the multiple light emitting diodes onto the display substrate, the light emitting diodes falling into positioning holes on the display substrate; and absorbing and removing, by the transport head, a light emitting diode on the display substrate which does not fall into a positioning hole.

    THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS

    公开(公告)号:US20220416091A1

    公开(公告)日:2022-12-29

    申请号:US17776923

    申请日:2021-06-15

    摘要: A thin film transistor includes an active layer, first and second electrodes, and a third doped pattern. The active layer has a channel region, and a first electrode region and a second electrode region, the first electrode region has a first ion doping concentration, and the second electrode region has a second ion doping concentration. The first electrode and the second electrode are disposed on a side of the active layer in the thickness direction. The first electrode is coupled to the first electrode region, and the second electrode is coupled to the second electrode region. The third doped pattern is disposed between the first electrode and the first electrode region, and in direct contact with the first electrode and the first electrode region. The third doped pattern has a third ion doping concentration, and the third ion doping concentration is different from the first ion doping concentration.