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1.发明申请Leadframe-based packages for solid state light emitting devices and methods of forming leadframe-based packages for solid state light emitting devices 有权用于固态发光器件的基于引线框的封装以及用于形成固态发光器件的基于引线框的封装的方法公开(公告)号：US20080121921A1
公开(公告)日：2008-05-29
申请号：US11486244
申请日：2006-07-13
申请人： Ban P. Loh , Bernd Keller , Nicholas W. Medendorp
发明人： Ban P. Loh , Bernd Keller , Nicholas W. Medendorp
IPC分类号： H01L23/495 , H01L21/70
CPC分类号： H01L33/647 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L33/642 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/01019 , H01L2924/01068 , H01L2924/181 , H01L2924/3011 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A modular package for a light emitting device includes a leadframe having a top surface and including a central region having a bottom surface and having a first thickness between the top surface of the leadframe and the bottom surface of the central region. The leadframe may further include an electrical lead extending away from the central region. The electrical lead has a bottom surface and has a second thickness from the top surface of the leadframe to the bottom surface of the electrical lead. The second thickness may be less than the first thickness. The package further includes a package body on the leadframe surrounding the central region and exposing the bottom surface of the central region. The package body may be at least partially provided beneath the bottom surface of the lead and adjacent the bottom surface of the central region. Methods of forming modular packages and leadframes are also disclosed.
摘要翻译： 用于发光器件的模块化封装包括具有顶表面的引线框架，并且包括具有底表面的中心区域，并且在引线框架的顶表面和中心区域的底表面之间具有第一厚度。 引线框还可以包括远离中心区延伸的电引线。 电引线具有底表面并且具有从引线框架的顶表面到电引线的底表面的第二厚度。 第二厚度可以小于第一厚度。 所述封装还包括围绕所述中心区域并且暴露所述中心区域的底表面的所述引线框上的封装体。 封装体可以至少部分地设置在引线的底表面下方并且邻近中心区域的底表面。 还公开了形成模块化封装和引线框架的方法。
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2.发明授权Leadframe-based packages for solid state light emitting devices and methods of forming leadframe-based packages for solid state light emitting devices 有权用于固态发光器件的基于引线框的封装以及用于形成固态发光器件的基于引线框的封装的方法公开(公告)号：US08193547B2
公开(公告)日：2012-06-05
申请号：US13153930
申请日：2011-06-06
IPC分类号： H01L23/495 , H01L33/62
CPC分类号： H01L33/647 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L33/642 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/01019 , H01L2924/01068 , H01L2924/181 , H01L2924/3011 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A modular package for a light emitting device includes a leadframe having a top surface and including a central region having a bottom surface and having a first thickness between the top surface of the leadframe and the bottom surface of the central region. The leadframe may further include an electrical lead extending away from the central region. The electrical lead has a bottom surface and has a second thickness from the top surface of the leadframe to the bottom surface of the electrical lead. The second thickness may be less than the first thickness. The package further includes a package body on the leadframe surrounding the central region and exposing the bottom surface of the central region. The package body may be at least partially provided beneath the bottom surface of the lead and adjacent the bottom surface of the central region. Methods of forming modular packages and leadframes are also disclosed.
摘要翻译： 用于发光器件的模块化封装包括具有顶表面的引线框架，并且包括具有底表面的中心区域，并且在引线框架的顶表面和中心区域的底表面之间具有第一厚度。 引线框还可以包括远离中心区延伸的电引线。 电引线具有底表面并且具有从引线框架的顶表面到电引线的底表面的第二厚度。 第二厚度可以小于第一厚度。 所述封装还包括围绕所述中心区域并且暴露所述中心区域的底表面的所述引线框上的封装体。 封装体可以至少部分地设置在引线的底表面下方并且邻近中心区域的底表面。 还公开了形成模块化封装和引线框架的方法。
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3.发明申请LEADFRAME-BASED PACKAGES FOR SOLID STATE LIGHT EMITTING DEVICES AND METHODS OF FORMING LEADFRAME-BASED PACKAGES FOR SOLID STATE LIGHT EMITTING DEVICES 有权用于固态发光装置的基于LEADFRAME的封装以及形成用于固态发光装置的基于引线框架的封装的方法公开(公告)号：US20120012879A1
公开(公告)日：2012-01-19
申请号：US13242103
申请日：2011-09-23
IPC分类号： H01L33/60 , H01L21/56 , H01L23/495
CPC分类号： H01L33/483 , H01L23/49861 , H01L24/73 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L33/641 , H01L33/642 , H01L33/647 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2924/01019 , H01L2924/01068 , H01L2924/01322 , H01L2924/3011 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A modular package for a light emitting device includes a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness. The leadframe further includes an electrical lead extending laterally away from the second region, and the package further includes a thermoset package body on the leadframe and surrounding the first region. The thermoset package body may be on both the top and bottom surfaces of the second region. A leak barrier may be on the leadframe, and the package body may be on the leak barrier. Methods of forming modular packages including thermoset package bodies on leadframes are also disclosed.
摘要翻译： 用于发光器件的模块化封装包括引线框架，其包括具有顶表面，底表面和第一厚度的第一区域和具有小于第一厚度的顶表面，底表面和第二厚度的第二区域 。 引线框还包括从第二区域横向延伸的电引线，并且封装件还包括在引线框上并围绕第一区域的热固性封装主体。 热固性封装体可以在第二区域的顶表面和底表面上。 泄漏屏障可以在引线框架上，并且封装主体可以在泄漏屏障上。 还公开了在引线框架上形成包括热固性封装体的模块化封装的方法。
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公开(公告)号：US08044418B2
公开(公告)日：2011-10-25
申请号：US11657347
申请日：2007-01-24
IPC分类号： H01L23/495
CPC分类号： H01L33/483 , H01L23/49861 , H01L24/73 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L33/641 , H01L33/642 , H01L33/647 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2924/01019 , H01L2924/01068 , H01L2924/01322 , H01L2924/3011 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A modular package for a light emitting device includes a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness. The leadframe further includes an electrical lead extending laterally away from the second region, and the package further includes a thermoset package body on the leadframe and surrounding the first region. The thermoset package body may be on both the top and bottom surfaces of the second region. A leak barrier may be on the leadframe, and the package body may be on the leak barrier. Methods of forming modular packages including thermoset package bodies on leadframes are also disclosed.
摘要翻译： 用于发光器件的模块化封装包括引线框架，该引线框架包括具有顶表面，底表面和第一厚度的第一区域和具有小于第一厚度的顶表面，底表面和第二厚度的第二区域 。 引线框还包括从第二区域横向延伸的电引线，并且封装件还包括在引线框上并围绕第一区域的热固性封装主体。 热固性封装体可以在第二区域的顶表面和底表面上。 泄漏屏障可以在引线框架上，并且封装主体可以在泄漏屏障上。 还公开了在引线框架上形成包括热固性封装体的模块化封装的方法。
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公开(公告)号：US07960819B2
公开(公告)日：2011-06-14
申请号：US11486244
申请日：2006-07-13
IPC分类号： H01L23/495
CPC分类号： H01L33/647 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L33/642 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/01019 , H01L2924/01068 , H01L2924/181 , H01L2924/3011 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A modular package for a light emitting device includes a leadframe having a top surface and including a central region having a bottom surface and having a first thickness between the top surface of the leadframe and the bottom surface of the central region. The leadframe may further include an electrical lead extending away from the central region. The electrical lead has a bottom surface and has a second thickness from the top surface of the leadframe to the bottom surface of the electrical lead. The second thickness may be less than the first thickness. The package further includes a package body on the leadframe surrounding the central region and exposing the bottom surface of the central region. The package body may be at least partially provided beneath the bottom surface of the lead and adjacent the bottom surface of the central region. Methods of forming modular packages and leadframes are also disclosed.
摘要翻译： 用于发光器件的模块化封装包括具有顶表面的引线框架，并且包括具有底表面的中心区域，并且在引线框架的顶表面和中心区域的底表面之间具有第一厚度。 引线框还可以包括远离中心区延伸的电引线。 电引线具有底表面并且具有从引线框架的顶表面到电引线的底表面的第二厚度。 第二厚度可以小于第一厚度。 所述封装还包括围绕所述中心区域并且暴露所述中心区域的底表面的所述引线框上的封装体。 封装体可以至少部分地设置在引线的底表面下方并且邻近中心区域的底表面。 还公开了形成模块化封装和引线框架的方法。
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6.发明申请Packaged light emitting devices including multiple index lenses and methods of fabricating the same 有权包括多个折射率透镜的封装发光器件及其制造方法公开(公告)号：US20070278512A1
公开(公告)日：2007-12-06
申请号：US11443741
申请日：2006-05-31
申请人： Ban P. Loh , Nicholas W. Medendorp , Bernd Keller
发明人： Ban P. Loh , Nicholas W. Medendorp , Bernd Keller
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , B29C45/14655 , B29C45/1671 , B29L2011/0016 , G02B19/0028 , G02B19/0052 , G02B19/0071 , H01L33/54 , Y10T156/10
摘要： A packaged light emitting device includes a substrate, a solid state light emitting device on the substrate, a first generally toroidal lens on the substrate and defining a cavity relative to the solid state light emitting device and having a first index of refraction, and a second lens at least partially within the cavity formed by the first lens and having a second index of refraction that is different from the first index of refraction. The second index of refraction may be higher than the first index of refraction. The lenses may be mounted on the substrate and/or may formed by dispensing and curing liquid encapsulant materials.
摘要翻译： 封装的发光器件包括衬底，在衬底上的固态发光器件，在衬底上的第一大致环形透镜，并且相对于固态发光器件限定空腔并具有第一折射率，第二 透镜至少部分地在由第一透镜形成的空腔内，并且具有不同于第一折射率的第二折射率。 第二折射率可能高于第一折射率。 透镜可以安装在基板上和/或可以通过分配和固化液体密封剂材料而形成。
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7.发明授权Packaged light emitting devices including multiple index lenses and multiple index lenses for packaged light emitting devices 有权封装的发光器件包括多个折射率透镜和用于封装的发光器件的多个折射率透镜公开(公告)号：US07646035B2
公开(公告)日：2010-01-12
申请号：US11443741
申请日：2006-05-31
IPC分类号： H01L29/16
CPC分类号： H01L33/58 , B29C45/14655 , B29C45/1671 , B29L2011/0016 , G02B19/0028 , G02B19/0052 , G02B19/0071 , H01L33/54 , Y10T156/10
摘要： A packaged light emitting device includes a substrate, a solid state light emitting device on the substrate, a first generally toroidal lens on the substrate and defining a cavity relative to the solid state light emitting device and having a first index of refraction, and a second lens at least partially within the cavity formed by the first lens and having a second index of refraction that is different from the first index of refraction. The second index of refraction may be higher than the first index of refraction. The lenses may be mounted on the substrate and/or may formed by dispensing and curing liquid encapsulant materials.
摘要翻译： 封装的发光器件包括衬底，在衬底上的固态发光器件，在衬底上的第一大致环形透镜，并且相对于固态发光器件限定空腔并具有第一折射率，第二 透镜至少部分地在由第一透镜形成的空腔内，并且具有不同于第一折射率的第二折射率。 第二折射率可能高于第一折射率。 透镜可以安装在基板上和/或可以通过分配和固化液体密封剂材料而形成。
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8.发明申请LEADFRAME-BASED PACKAGES FOR SOLID STATE LIGHT EMITTING DEVICES AND METHODS OF FORMING LEADFRAME-BASED PACKAGES FOR SOLID STATE LIGHT EMITTING DEVICES 有权用于固态发光装置的基于LEADFRAME的封装以及形成用于固态发光装置的基于引线框架的封装的方法公开(公告)号：US20110233579A1
公开(公告)日：2011-09-29
申请号：US13153930
申请日：2011-06-06
IPC分类号： H01L33/62
CPC分类号： H01L33/647 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L33/642 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/01019 , H01L2924/01068 , H01L2924/181 , H01L2924/3011 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A modular package for a light emitting device includes a leadframe having a top surface and including a central region having a bottom surface and having a first thickness between the top surface of the leadframe and the bottom surface of the central region. The leadframe may further include an electrical lead extending away from the central region. The electrical lead has a bottom surface and has a second thickness from the top surface of the leadframe to the bottom surface of the electrical lead. The second thickness may be less than the first thickness. The package further includes a package body on the leadframe surrounding the central region and exposing the bottom surface of the central region. The package body may be at least partially provided beneath the bottom surface of the lead and adjacent the bottom surface of the central region. Methods of forming modular packages and leadframes are also disclosed.
摘要翻译： 用于发光器件的模块化封装包括具有顶表面的引线框架，并且包括具有底表面的中心区域，并且在引线框架的顶表面和中心区域的底表面之间具有第一厚度。 引线框还可以包括远离中心区延伸的电引线。 电引线具有底表面并且具有从引线框架的顶表面到电引线的底表面的第二厚度。 第二厚度可以小于第一厚度。 所述封装还包括围绕所述中心区域并且暴露所述中心区域的底表面的所述引线框上的封装体。 封装体可以至少部分地设置在引线的底表面下方并且邻近中心区域的底表面。 还公开了形成模块化封装和引线框架的方法。
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9.发明授权Leadframe-based packages for solid state light emitting devices having heat dissipating regions in packaging 有权用于在封装中具有散热区域的固态发光器件的基于引线框的封装公开(公告)号：US08941134B2
公开(公告)日：2015-01-27
申请号：US13242103
申请日：2011-09-23
IPC分类号： H01L33/62 , H01L23/495 , H01L33/48 , H01L33/64 , H01L23/498 , H01L25/075
CPC分类号： H01L33/483 , H01L23/49861 , H01L24/73 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L33/641 , H01L33/642 , H01L33/647 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2924/01019 , H01L2924/01068 , H01L2924/01322 , H01L2924/3011 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A modular package for a light emitting device includes a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness. The leadframe further includes an electrical lead extending laterally away from the second region, and the package further includes a thermoset package body on the leadframe and surrounding the first region. The thermoset package body may be on both the top and bottom surfaces of the second region. A leak barrier may be on the leadframe, and the package body may be on the leak barrier. Methods of forming modular packages including thermoset package bodies on leadframes are also disclosed.
摘要翻译： 用于发光器件的模块化封装包括引线框架，其包括具有顶表面，底表面和第一厚度的第一区域和具有小于第一厚度的顶表面，底表面和第二厚度的第二区域 。 引线框还包括从第二区域横向延伸的电引线，并且封装件还包括在引线框上并围绕第一区域的热固性封装主体。 热固性封装体可以在第二区域的顶表面和底表面上。 泄漏屏障可以在引线框架上，并且封装主体可以在泄漏屏障上。 还公开了在引线框架上形成包括热固性封装体的模块化封装的方法。
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10.发明授权Packaged light emitting devices including multiple index lenses and methods of fabricating the same 有权包括多个折射率透镜的封装发光器件及其制造方法公开(公告)号：US07952115B2
公开(公告)日：2011-05-31
申请号：US12624885
申请日：2009-11-24
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , B29C45/14655 , B29C45/1671 , B29L2011/0016 , G02B19/0028 , G02B19/0052 , G02B19/0071 , H01L33/54 , Y10T156/10
摘要： A packaged light emitting device includes a substrate, a solid state light emitting device on the substrate, a first generally toroidal lens on the substrate and defining a cavity relative to the solid state light emitting device and having a first index of refraction, and a second lens at least partially within the cavity formed by the first lens and having a second index of refraction that is different from the first index of refraction. The second index of refraction may be higher than the first index of refraction. The lenses may be mounted on the substrate and/or may formed by dispensing and curing liquid encapsulant materials.
摘要翻译： 封装的发光器件包括衬底，在衬底上的固态发光器件，在衬底上的第一大致环形透镜，并且相对于固态发光器件限定空腔并具有第一折射率，第二 透镜至少部分地在由第一透镜形成的空腔内，并且具有不同于第一折射率的第二折射率。 第二折射率可能高于第一折射率。 透镜可以安装在基板上和/或可以通过分配和固化液体密封剂材料而形成。
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