摘要:
The layout method for a semiconductor device includes locating a plurality of first bit line selection circuits at a first side of a variable resistive memory cell block, and locating a plurality of second bit line selection circuits at a second side of the variable resistive memory cell block opposite the first side. The method further includes connecting the first bit line selection circuits with respective odd-numbered local bit lines of the variable resistive memory cell block, and connecting the second bit line selection circuits with respective even-numbered local bit lines of the variable resistive memory cell block. The method still further includes selectively connecting respective odd-numbered local bit lines to a global bit line using the first bit line selection circuits, and selectively connecting respective even-numbered local bit lines to the global bit line using the second bit line selection circuits.
摘要:
A phase change memory device includes a phase change memory cell block having alternating odd-numbered and even-numbered local bit lines, a global bit line, a plurality of first bit line selection circuits, and a plurality of second bit line selection circuits. The plurality of first bit line selection circuits are located at a first side of the phase change memory cell block and selectively connect respective odd-numbered local bit lines to the global bit line. The plurality of second bit line selection circuits are located at second side of the phase change memory cell block (opposite the first side) and selectively connect respective even-numbered local bit lines to the global bit line.
摘要:
The layout method for a semiconductor device includes locating a plurality of first bit line selection circuits at a first side of a variable resistive memory cell block, and locating a plurality of second bit line selection circuits at a second side of the variable resistive memory cell block opposite the first side. The method further includes connecting the first bit line selection circuits with respective odd-numbered local bit lines of the variable resistive memory cell block, and connecting the second bit line selection circuits with respective even-numbered local bit lines of the variable resistive memory cell block. The method still further includes selectively connecting respective odd-numbered local bit lines to a global bit line using the first bit line selection circuits, and selectively connecting respective even-numbered local bit lines to the global bit line using the second bit line selection circuits.
摘要:
A phase change memory device includes a phase change memory cell block having alternating odd-numbered and even-numbered local bit lines, a global bit line, a plurality of first bit line selection circuits, and a plurality of second bit line selection circuits. The plurality of first bit line selection circuits are located at a first side of the phase change memory cell block and selectively connect respective odd-numbered local bit lines to the global bit line. The plurality of second bit line selection circuits are located at second side of the phase change memory cell block (opposite the first side) and selectively connect respective even-numbered local bit lines to the global bit line.
摘要:
A firing method of a phase change memory device and a phase change memory capable of effectively performing a firing operation are described. The phase change memory device includes a plurality of memory cell array blocks, a counter clock generation unit, a decoding unit, and a driving unit. Each memory cell array block has phase change memory cells. The counter clock generation unit outputs first through third counter clock signals in response to an external clock signal and a firing mode signal, wherein the first through third counter clock signals have different cycles. The decoding unit, in response to the first through third counter clock signals, outputs a block address which selects one of the plurality of memory cell array blocks, word line addresses which enable word lines of the selected memory cell array block, and a redundant word line address which enables a redundant word line of the selected memory cell array block. The driving unit applies a firing current to the memory cell array blocks in response to the firing mode signal. According to the phase change memory device and the initial firing method, the time taken to perform the initial firing operation can be reduced. In addition, since the numbers of the needed signals are minimized, a large number of chips on a single wafer can be simultaneously tested.
摘要:
In a firing method of a phase change memory device and a phase change memory capable of effectively performing a firing operation, the phase change memory device includes a plurality of memory cell array blocks, a counter clock generation unit, a decoding unit, and a driving unit. Each memory cell array block has phase change memory cells. The counter clock generation unit outputs first through third counter clock signals in response to an external clock signal and a firing mode signal, wherein the first through third counter clock signals have different cycles. The decoding unit, in response to the first through third counter clock signals, outputs a block address which selects one of the plurality of memory cell array blocks, word line addresses which enable word lines of the selected memory cell array block, and a redundant word line address which enables a redundant word line of the selected memory cell array block. The driving unit applies a firing current to the memory cell array blocks in response to the firing mode signal. According to the phase change memory device and the initial firing method, the time taken to perform the initial firing operation can be reduced. In addition, since the numbers of the needed signals are minimized, a large number of chips on a single wafer can be simultaneously tested.
摘要:
Phase-changeable random access memory (PRAM) devices include a plurality of rows and columns of PRAM memory cells therein and at least one local bit line electrically coupled to a column of the PRAM memory cells. First and second bit line selection circuits are provided to increase the rate at which the at least one local bit line can be accessed and driven with a bit line signal. These first and second bit line selection circuits are configured to electrically connect first and second ends of the at least one local bit line to a global bit line during an operation to read data from a selected one of the PRAM memory cells in the column.
摘要:
In a firing method of a phase change memory device and a phase change memory capable of effectively performing a firing operation, the phase change memory device includes a plurality of memory cell array blocks, a counter clock generation unit, a decoding unit, and a driving unit. Each memory cell array block has phase change memory cells. The counter clock generation unit outputs first through third counter clock signals in response to an external clock signal and a firing mode signal, wherein the first through third counter clock signals have different cycles. The decoding unit, in response to the first through third counter clock signals, outputs a block address which selects one of the plurality of memory cell array blocks, word line addresses which enable word lines of the selected memory cell array block, and a redundant word line address which enables a redundant word line of the selected memory cell array block. The driving unit applies a firing current to the memory cell array blocks in response to the firing mode signal. According to the phase change memory device and the initial firing method, the time taken to perform the initial firing operation can be reduced. In addition, since the numbers of the needed signals are minimized, a large number of chips on a single wafer can be simultaneously tested.
摘要:
A firing method of a phase change memory device and a phase change memory capable of effectively performing a firing operation are described. The phase change memory device includes a plurality of memory cell array blocks, a counter clock generation unit, a decoding unit, and a driving unit. Each memory cell array block has phase change memory cells. The counter clock generation unit outputs first through third counter clock signals in response to an external clock signal and a firing mode signal, wherein the first through third counter clock signals have different cycles. The decoding unit, in response to the first through third counter clock signals, outputs a block address which selects one of the plurality of memory cell array blocks, word line addresses which enable word lines of the selected memory cell array block, and a redundant word line address which enables a redundant word line of the selected memory cell array block. The driving unit applies a firing current to the memory cell array blocks in response to the firing mode signal. According to the phase change memory device and the initial firing method, the time taken to perform the initial firing operation can be reduced. In addition, since the numbers of the needed signals are minimized, a large number of chips on a single wafer can be simultaneously tested.
摘要:
Phase-changeable random access memory (PRAM) devices include a plurality of rows and columns of PRAM memory cells therein and at least one local bit line electrically coupled to a column of the PRAM memory cells. First and second bit line selection circuits are provided to increase the rate at which the at least one local bit line can be accessed and driven with a bit line signal. These first and second bit line selection circuits are configured to electrically connect first and second ends of the at least one local bit line to a global bit line during an operation to read data from a selected one of the PRAM memory cells in the column.