公开(公告)号：US06224396B1

公开(公告)日：2001-05-01

申请号：US09329537

申请日：1999-06-10

申请人： Benson Chan ,  Kishor V. Desai ,  John H. Sherman

发明人： Benson Chan ,  Kishor V. Desai ,  John H. Sherman

IPC分类号： H01R1200

CPC分类号： H05K7/1069 ,  H01R12/52 ,  H01R12/714 ,  H05K3/325

摘要： An interposer for connecting two circuit members. The interposer has two extending conductive ends, is “Z” shaped, and has a center of gravity positioned relative to one of the conductive ends such that the interposer is capable of standing upright upon that end without external support. The interposer may be composed of a plated metal, and at least one of the extending conductive ends may have deposited dendrites or a raised bump. The Z-shaped interposer prevents bowing or cracking of the connected structure which otherwise occurs during use due to the different thermal coefficients of expansion of the two circuit members.

摘要翻译： 用于连接两个电路部件的插入器。 插入器具有两个延伸的导电端，为“Z”形，并且具有相对于导电端之一定位的重心，使得插入件能够在该端部处直立而无需外部支撑。 插入器可以由电镀金属组成，并且至少一个延伸的导电端可以具有沉积的枝晶或凸起的凸起。 由于两个电路构件的不同的热膨胀系数，Z形插入件防止在使用期间发生的连接结构的弯曲或破裂。

公开(公告)号：US06712527B1

公开(公告)日：2004-03-30

申请号：US09481903

申请日：2000-01-12

申请人： Benson Chan ,  Mitchell S. Cohen ,  Paul F. Fortier ,  Ladd W. Freitag ,  Richard R. Hall ,  Glen W. Johnson ,  How Tzu Lin ,  John H. Sherman

发明人： Benson Chan ,  Mitchell S. Cohen ,  Paul F. Fortier ,  Ladd W. Freitag ,  Richard R. Hall ,  Glen W. Johnson ,  How Tzu Lin ,  John H. Sherman

IPC分类号： G02B636

CPC分类号： G02B6/4201 ,  G02B6/3885 ,  G02B6/421 ,  G02B6/4246 ,  G02B6/4261 ,  G02B6/4268 ,  G02B6/4277 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292 ,  H05K1/189

摘要： A package is described that couples a twelve channel wide fiber optic cable to a twelve channel Vertical Cavity Surface Emitting Laser (VCSEL) transmitter and a multiple channel Perpendicularly Aligned Integrated Die (PAID) receiver. The package allows for reduction in the height of the assembly package by vertically orienting certain dies parallel to the fiber optic cable and horizontally orienting certain other dies. The assembly allows the vertically oriented optoelectronic dies to be perpendicularly attached to the horizontally oriented laminate via a flexible circuit.

摘要翻译： 描述了将十二通道宽光纤电缆耦合到十二通道垂直腔面发射激光器（VCSEL）发射器和多通道垂直对准集成管芯（PAID）接收器的封装。 该封装允许通过垂直定向平行于光纤电缆的某些管芯并水平地定向某些其他管芯来降低组件封装的高度。 组件允许垂直定向的光电管芯通过柔性电路垂直地附接到水平取向的层压板。

公开(公告)号：US06644864B2

公开(公告)日：2003-11-11

申请号：US10097767

申请日：2002-03-14

申请人： Benson Chan ,  Richard R. Hall ,  How T. Lin ,  John H. Sherman

发明人： Benson Chan ,  Richard R. Hall ,  How T. Lin ,  John H. Sherman

IPC分类号： G02B638

CPC分类号： G02B6/3676 ,  G02B6/3636 ,  G02B6/3692 ,  G02B6/3885 ,  G02B6/4249

摘要： The present invention relates generally to fiber optical arrays, and particularly, but not by way of limitation, to 3-dimentional array fiber optical couplers. More particularly, the present invention provides means of coupling semiconductor laser light sources to fiber-optic transmission devices.

摘要翻译： 本发明一般涉及光纤阵列，特别是涉及三维阵列光纤耦合器，而非限制性的。 更具体地，本发明提供了将半导体激光光源耦合到光纤传输装置的装置。

公开(公告)号：US07108809B2

公开(公告)日：2006-09-19

申请号：US10262754

申请日：2002-10-01

申请人： Benson Chan ,  Richard R. Hall ,  How T. Lin ,  Christopher J. Majka ,  John H. Sherman

发明人： Benson Chan ,  Richard R. Hall ,  How T. Lin ,  Christopher J. Majka ,  John H. Sherman

IPC分类号： B29D11/00

CPC分类号： B29D11/00 ,  B29C33/42

摘要： An optical coupler arrangement which is employed for replicating surface features of diverse types of optical devices. Also disclosed is to a novel method of accurately replicating surface features of optical devices; particularly through the utilization of the novel optical coupler arrangement.

摘要翻译： 用于复制各种类型的光学器件的表面特征的光耦合器装置。 还公开了一种准确地复制光学器件的表面特征的新颖方法; 特别是通过利用新颖的光耦合装置。

公开(公告)号：US06547452B1

公开(公告)日：2003-04-15

申请号：US09568978

申请日：2000-05-11

申请人： Benson Chan ,  Paul F. Fortier ,  Francois M. Guindon ,  Glen W. Johnson ,  Martial A. Letourneau ,  John H. Sherman ,  Real Tetreault

发明人： Benson Chan ,  Paul F. Fortier ,  Francois M. Guindon ,  Glen W. Johnson ,  Martial A. Letourneau ,  John H. Sherman ,  Real Tetreault

IPC分类号： G02B636

CPC分类号： B29C45/14655 ,  B29C45/14065 ,  G02B6/4201 ,  G02B6/421 ,  G02B6/423 ,  G02B6/4231 ,  G02B6/4239 ,  G02B6/4255 ,  G02B6/4277 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292

摘要： Alignment systems for optoelectronic modules with overmolded chip carriers include drilled or milled substrate corners for engaging dowel pins to precisely align the substrate in a mold for molding an overmold frame on the substrate. The overmold frame includes slot and trilobe holes for receiving retainer posts to precisely align a retainer assembly on the overmold frame. Cooperating standoff pads on the overmold frame and on the retainer assembly stabilize the assembly of these components and provide a precise gap for receiving an adhesive to permanently attach these two components. The retainer assembly carries optoelectronic components that include a flexible circuit, and a distal end portion of this flexible circuit and walls of a receiving cavity in the overmold frame have cooperating features for precisely aligning distal electrical leads of the flexible circuit with an array of electrical pads on the substrate. A permanent shroud on a proximate end portion of the flexible circuit protects and helps align proximate electrical leads with electrical pads on optic dies and their carriers.

摘要翻译： 用于具有包覆成型芯片载体的光电子模块的对准系统包括用于接合定位销的钻孔或铣削基板拐角，以将基板精确地对准模具中用于模制基板上的二次模制框架。 包覆模制框架包括用于接收保持器柱的狭槽和三叶孔，以将保持器组件精确对准在包覆模制框架上。 包覆模制框架和保持器组件上的合作支座稳定了这些组件的组装，并提供了一个精确的间隙，用于接收粘合剂以永久地附接这两个部件。 保持器组件携载包括柔性电路的光电子部件，并且该柔性电路的远端部分和包覆模制框架中的接收腔的壁具有用于将柔性电路的远端电引线与电极焊盘阵列精确对准的配合特征 在基板上。 柔性电路的近端部分上的永久性护罩保护并有助于使邻近的电引线与光学管芯及其载体上的电焊盘对准。

公开(公告)号：US06741778B1

公开(公告)日：2004-05-25

申请号：US09578216

申请日：2000-05-23

申请人： Benson Chan ,  Richard R. Hall ,  How Tzu Lin ,  John H. Sherman

发明人： Benson Chan ,  Richard R. Hall ,  How Tzu Lin ,  John H. Sherman

IPC分类号： G02B626

CPC分类号： G02B6/4232 ,  G02B6/421 ,  G02B6/4231 ,  G02B6/4236 ,  G02B6/4239 ,  G02B6/4243 ,  G02B6/4244 ,  G02B6/4249 ,  G02B6/426

摘要： Optical packages and a method of fabricating same, wherein an active optical device can be located relative to a substrate and coupler. The structure includes a substrate having electrical contact pads and alignment pads with precision aligned through-holes for at least one optical fiber. The optical fibers are supported by a housing, or coupler, having alignment pins that are precision located relative to the through-holes in the substrate and the optical fiber. A die, or active optical device, with one or more active optical elements on a first die surface and electrical contacts on a second die surface, is aligned with the electrical pads of the substrate and the active optical elements. The method incorporates the steps of grinding alignment pins into metallic pads and grinding optical fibers in one pass and then aligning the active optical device and the optical fibers by using the surface tension of conductive adhesive liquid. The fibers are then bonded.

摘要翻译： 光学封装及其制造方法，其中有源光学器件可相对于衬底和耦合器定位。 该结构包括具有电接触焊盘和具有用于至少一个光纤的精确对准的通孔的对准焊盘的衬底。 光纤由具有相对于衬底和光纤中的通孔精确定位的对准引脚的壳体或耦合器支撑。 与第一裸片表面上的一个或多个有源光学元件和第二裸片表面上的电接触的裸片或有源光学器件与衬底和有源光学元件的电焊盘对准。 该方法包括将对准针磨成金属垫并一次研磨光纤的步骤，然后通过使用导电粘合剂液体的表面张力来对准有源光学器件和光纤。 然后粘合纤维。

公开(公告)号：US06635866B2

公开(公告)日：2003-10-21

申请号：US09838645

申请日：2001-04-19

申请人： Benson Chan ,  Richard R. Hall ,  How T. Lin ,  John H. Sherman

发明人： Benson Chan ,  Richard R. Hall ,  How T. Lin ,  John H. Sherman

IPC分类号： H01J502

CPC分类号： G02B6/4292 ,  G02B6/3885 ,  G02B6/3897 ,  G02B6/4232 ,  G02B6/4249

摘要： An optical coupler that provides for the direct mounting of integrated circuit(s). The coupler includes a two-part housing with grooves for accommodating optical fibers that are held in place when the two parts are put together. Circuitry is formed on the housing and solder balls, when heated to a liquid state and cooled (reflowed), are used to attach integrated circuit(s) onto the housing. At least one of these integrated circuit(s) is an optical die that is positioned in close proximity to the optical fibers to provide for the receipt and/or transmission of optical signals. The reflowing of the solder balls forms an electrical connection between the circuitry on the housing and the integrated circuit(s) and provides for alignment of these components. The housing is attached to a circuitized substrate using reflowed solder balls or wirebonds.

公开(公告)号：US06822875B2

公开(公告)日：2004-11-23

申请号：US10281036

申请日：2002-10-24

申请人： Benson Chan ,  Paul Francis Fortier ,  Ladd William Freitag ,  Gary T. Galli ,  Francois Guindon ,  Glen Walden Johnson ,  Martial Letourneau ,  John H. Sherman ,  Real Tetreault

发明人： Benson Chan ,  Paul Francis Fortier ,  Ladd William Freitag ,  Gary T. Galli ,  Francois Guindon ,  Glen Walden Johnson ,  Martial Letourneau ,  John H. Sherman ,  Real Tetreault

IPC分类号： H05K710

CPC分类号： H01L23/3737 ,  G02B6/4201 ,  G02B6/421 ,  G02B6/4245 ,  G02B6/4249 ,  G02B6/4253 ,  G02B6/4255 ,  G02B6/4269 ,  G02B6/4277 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292 ,  H01L23/3733 ,  H01L2224/32057 ,  H01L2224/45144 ,  H01L2224/83385 ,  H01L2924/01079 ,  H01L2924/3011 ,  H01L2924/00

摘要： A heat sink for a transceiver optoelectronic module including dual direct heat paths and a structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.

摘要翻译： 一种用于收发机光电模块的散热器，包括双重直接热路径以及封闭多个芯片的结构，该芯片具有将发射机和接收机芯片彼此电隔离的中心腹板。 一种用于具有端口的光耦合器的保持器，其中注入有环氧树脂。 一种用于光电子模块的包覆成型基座，其具有在其上构建的环氧流量控制器构件。 光电子模块的装配方法包括间隙设置和TAB粘结工艺的变化。

公开(公告)号：US06527457B2

公开(公告)日：2003-03-04

申请号：US09775725

申请日：2001-02-01

申请人： Benson Chan ,  Richard R. Hall ,  How T. Lin ,  John H. Sherman

发明人： Benson Chan ,  Richard R. Hall ,  How T. Lin ,  John H. Sherman

IPC分类号： G02B636

CPC分类号： G02B6/4249 ,  G02B6/3644 ,  G02B6/3664 ,  G02B6/3696 ,  G02B6/3834 ,  G02B6/3847 ,  G02B6/3855 ,  G02B6/4224 ,  G02B6/4238 ,  G02B6/424 ,  G02B6/4257 ,  G02B6/4267

摘要： An optical fiber guide includes a matrix of holes integrated directly into a substrate on which one or more optical chips are mounted. The substrate therefore functions both as a guide for optically coupling a plurality of optical fibers to an optical chip, as well as a carrier for the optical chip itself. The size of the fiber guide and its integration density is therefore improved over conventional fiber connectors. The substrate is preferably made of a material having a coefficient of thermal expansion substantially similar to the coefficient of thermal expansion of the optical chip. This ensures that the optical fibers will remain optically coupled to the chip through the matrix of holes in the substrate regardless of external temperature influences. If desired, integrated circuits may be mounted onto the substrate to increase the functionality of the fiber guide. A method for making the fiber guide has fewer process steps than conventional methods because fiber guide has fewer parts than conventional fiber-optic connectors.

公开(公告)号：US06508595B1

公开(公告)日：2003-01-21

申请号：US09569029

申请日：2000-05-11

申请人： Benson Chan ,  Paul Francis Fortier ,  Ladd William Freitag ,  Gary T. Galli ,  Francois Guindon ,  Glen Walden Johnson ,  Martial Letourneau ,  John H. Sherman ,  Real Tetreault

发明人： Benson Chan ,  Paul Francis Fortier ,  Ladd William Freitag ,  Gary T. Galli ,  Francois Guindon ,  Glen Walden Johnson ,  Martial Letourneau ,  John H. Sherman ,  Real Tetreault

IPC分类号： G02B642

CPC分类号： H01L23/3737 ,  G02B6/4201 ,  G02B6/421 ,  G02B6/4245 ,  G02B6/4249 ,  G02B6/4253 ,  G02B6/4255 ,  G02B6/4269 ,  G02B6/4277 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292 ,  H01L23/3733 ,  H01L2224/32057 ,  H01L2224/45144 ,  H01L2224/83385 ,  H01L2924/01079 ,  H01L2924/3011 ,  H01L2924/00

摘要： A heat sink for a transceiver optoelectronic module including dual direct heat paths and structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.

摘要翻译： 一种用于收发器光电模块的散热器，包括双重直接热路径和结构，其包围具有将发射器和接收器芯片彼此电隔离的中心腹板的多个芯片。 一种用于具有端口的光耦合器的保持器，其中注入有环氧树脂。 一种用于光电子模块的包覆成型基座，其具有在其上构建的环氧流量控制器构件。 光电子模块的装配方法包括间隙设置和TAB粘结工艺的变化。