公开(公告)号：US06712527B1

公开(公告)日：2004-03-30

申请号：US09481903

申请日：2000-01-12

申请人： Benson Chan ,  Mitchell S. Cohen ,  Paul F. Fortier ,  Ladd W. Freitag ,  Richard R. Hall ,  Glen W. Johnson ,  How Tzu Lin ,  John H. Sherman

发明人： Benson Chan ,  Mitchell S. Cohen ,  Paul F. Fortier ,  Ladd W. Freitag ,  Richard R. Hall ,  Glen W. Johnson ,  How Tzu Lin ,  John H. Sherman

IPC分类号： G02B636

CPC分类号： G02B6/4201 ,  G02B6/3885 ,  G02B6/421 ,  G02B6/4246 ,  G02B6/4261 ,  G02B6/4268 ,  G02B6/4277 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292 ,  H05K1/189

摘要： A package is described that couples a twelve channel wide fiber optic cable to a twelve channel Vertical Cavity Surface Emitting Laser (VCSEL) transmitter and a multiple channel Perpendicularly Aligned Integrated Die (PAID) receiver. The package allows for reduction in the height of the assembly package by vertically orienting certain dies parallel to the fiber optic cable and horizontally orienting certain other dies. The assembly allows the vertically oriented optoelectronic dies to be perpendicularly attached to the horizontally oriented laminate via a flexible circuit.

摘要翻译： 描述了将十二通道宽光纤电缆耦合到十二通道垂直腔面发射激光器（VCSEL）发射器和多通道垂直对准集成管芯（PAID）接收器的封装。 该封装允许通过垂直定向平行于光纤电缆的某些管芯并水平地定向某些其他管芯来降低组件封装的高度。 组件允许垂直定向的光电管芯通过柔性电路垂直地附接到水平取向的层压板。

公开(公告)号：US06798953B1

公开(公告)日：2004-09-28

申请号：US09479109

申请日：2000-01-07

申请人： Mitchell S. Cohen ,  Michael J. Cordes ,  Steven A. Cordes ,  William K. Hogan ,  Glen W. Johnson ,  Daniel M. Kuchta ,  Dianne L. Lacey ,  James L. Speidell ,  Jeannine M. Trewhella ,  Joseph P. Zinter

发明人： Mitchell S. Cohen ,  Michael J. Cordes ,  Steven A. Cordes ,  William K. Hogan ,  Glen W. Johnson ,  Daniel M. Kuchta ,  Dianne L. Lacey ,  James L. Speidell ,  Jeannine M. Trewhella ,  Joseph P. Zinter

IPC分类号： G02B630

CPC分类号： G02B6/4246 ,  G02B6/3652 ,  G02B6/423 ,  G02B6/4239

摘要： A structure that includes a substrate, typically a semiconductor chip such as a VCSEL or photodetector chip, and a guide for aligning a signal conveying device, typically an optical fiber, to a transducer such as an optoelectronic device on the semiconductor chip. The guide is formed, in a preferred embodiment, by lithographically exposing and developing a thick layer of photoresist. The structure is assembled by placing and securing the signal conveying device into a cavity-like region of the guide.

摘要翻译： 包括基板，通常为诸如VCSEL或光电检测器芯片的半导体芯片的结构，以及用于将信号传送装置（通常为光纤）对准到诸如半导体芯片上的光电子装置的换能器的引导件。 在优选实施例中，通过光刻曝光和显影厚的光致抗蚀剂层来形成引导件。 通过将信号传送装置放置并固定到引导件的腔状区域来组装结构。

公开(公告)号：US5093879A

公开(公告)日：1992-03-03

申请号：US542275

申请日：1990-06-22

申请人： Mark F. Bregman ,  William D. Brewer ,  Mitchell S. Cohen ,  Glen W. Johnson ,  Ismail C. Noyan ,  Modest M. Oprysko ,  Mark B. Ritter ,  Dennis L. Rogers ,  Jeanine M. Trewhella

发明人： Mark F. Bregman ,  William D. Brewer ,  Mitchell S. Cohen ,  Glen W. Johnson ,  Ismail C. Noyan ,  Modest M. Oprysko ,  Mark B. Ritter ,  Dennis L. Rogers ,  Jeanine M. Trewhella

IPC分类号： G02B6/42 ,  G02B6/43 ,  H01L31/12 ,  H01L31/167 ,  H04B10/00

CPC分类号： G02B6/4249 ,  G02B6/43 ,  H01L31/167 ,  H04B10/803

摘要： A direct optical connector (DOC) comprised of first and second members, each including a plurality of light emitting and light detecting locations, operative in combination with energy transfer media to form direct optical connections between the light emitting locations and the light detecting locations, wherein said first and second members are adapted for reclosable connection to each other whereupon the light emitting locations on one member are aligned with the light detecting locations on the other member. The first and second members of the preferred DOC are modular. Alternative forms of energy transfer media are used in various embodiments of the invention including lenslet arrays, imaging fiber plates (IFPs), and energy transfer fiber plates (ETFPs). These media have differing alignment criteria, differing degrees of immunity from crosstalk, differing degrees of transfer efficiency, different manufacturing costs, etc., thereby permitting the fabrication and/or use of a connector most suited to meet the requirements of a particular application.A modular half of a DOC can be used in conjunction with a remote optical connector (ROC) to channel light over relatively long distances. The invention also encompasses processes for fabricating ROCs.

公开(公告)号：US5631991A

公开(公告)日：1997-05-20

申请号：US592279

申请日：1996-01-26

申请人： Mitchell S. Cohen ,  Glen W. Johnson ,  Jeannine M. Trewhella

发明人： Mitchell S. Cohen ,  Glen W. Johnson ,  Jeannine M. Trewhella

IPC分类号： G02B6/42 ,  G02B6/00 ,  G02B6/255

CPC分类号： G02B6/4234 ,  G02B6/4204 ,  G02B6/4225 ,  G02B6/4207

摘要： A method for providing X,Y and Z alignment during fabrication of an optical subassembly (OSA) by active alignment and fixing with epoxy through the agency of radio frequency (RF) heating in order to provide acceptable feedback-induced noise level along with acceptable coupling efficiency.

摘要翻译： 一种在通过射频（RF）加热来主动对准和固定环氧树脂来制造光学子组件（OSA）期间提供X，Y和Z对准的方法，以便提供可接受的反馈感应噪声水平以及可接受的耦合 效率。

公开(公告)号：US5537504A

公开(公告)日：1996-07-16

申请号：US551072

申请日：1995-10-31

申请人： Michael F. Cina ,  Mitchell S. Cohen ,  Glen W. Johnson ,  Modest M. Oprysko ,  Jeannine M. Trewhella

发明人： Michael F. Cina ,  Mitchell S. Cohen ,  Glen W. Johnson ,  Modest M. Oprysko ,  Jeannine M. Trewhella

IPC分类号： G02B6/42 ,  G02B6/00 ,  G02B6/36

CPC分类号： G02B6/4206 ,  G02B6/4204 ,  G02B6/4234

摘要： An optical subassembly for transferring light between an optoelectronic converter and an optical fiber where the housing and the lens are of plastic in which the housing is made to dimensions within the precision of molded plastic and the lens imparts focusing properties that compensate for the limitations of the plastic technology. Alignment in the X-Y plane only is employed. The lens has a first surface focused on the optoelectronic converter which substantially collimates the light through the lens and a second surface that introduces deliberate longitudinal spherical aberration that compensates for component position. Attachment or fixing of the optoelectronic converter to the housing is accomplished by RF heating a TO can to quickly cure an epoxylayer.

公开(公告)号：US5511140A

公开(公告)日：1996-04-23

申请号：US322849

申请日：1994-10-13

申请人： Michael F. Cina ,  Mitchell S. Cohen ,  Glen W. Johnson ,  Modest M. Oprysko ,  Jeannine M. Trewhella

发明人： Michael F. Cina ,  Mitchell S. Cohen ,  Glen W. Johnson ,  Modest M. Oprysko ,  Jeannine M. Trewhella

IPC分类号： G02B6/42 ,  G02B6/36

CPC分类号： G02B6/4206 ,  G02B6/4204 ,  G02B6/4234

摘要： An optical subassembly for transferring light between an optoelectronic converter and an optical fiber where the housing and the lens are of plastic in which the housing is made to dimensions within the precision of molded plastic and the lens imparts focusing properties that compensate for the limitations of the plastic technology. Alignment in the X-Y plane only is employed. The lens has a first surface focused on the optoelectronic converter which substantially collimates the light through the lens and a second surface that introduces deliberate longitudinal spherical aberration that compensates for component position. Attachment or fixing of the optoelectronic converter to the housing is accomplished by RF heating a TO can to quickly cure an epoxylayer.

摘要翻译： 一种用于在光电转换器和光纤之间传输光的光学子组件，其中壳体和透镜是塑料，其中壳体被制成尺寸在模制塑料的精度内，并且透镜赋予聚焦性能以补偿 塑料技术。 仅使用X-Y平面中的对准。 透镜具有聚焦在光电转换器上的第一表面，其基本上准直透过透镜的光，以及引入有意的纵向球面像差的第二表面，其补偿分量位置。 通过RF加热TO罐可快速固化环氧树脂来实现将光电转换器附着或固定到外壳。

公开(公告)号：US06350625B1

公开(公告)日：2002-02-26

申请号：US09753272

申请日：2000-12-28

申请人： Mitchell S. Cohen ,  William K. Hogan ,  Sudipta K. Ray ,  James L. Speidell ,  S. Jay Chey ,  Steven A. Cordes

发明人： Mitchell S. Cohen ,  William K. Hogan ,  Sudipta K. Ray ,  James L. Speidell ,  S. Jay Chey ,  Steven A. Cordes

IPC分类号： H01L2144

CPC分类号： H01L24/11 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/30107 ,  H01S5/02268 ,  H01S5/02272 ,  H01S5/02284 ,  H01S5/183

摘要： A novel optoelectronic packaging submount arrangement which incorporates a 90° C. electrical conductor turn, and more specifically methods of producing optoelectronic packaging submount arrangement incorporating 90° C. electrical conductor turns.

摘要翻译： 一种新颖的光电封装基座装置，其结合了90 C.电导体转弯，更具体地说，制造了包含90 C.电导线的光电封装基座装置的方法

公开(公告)号：US4568621A

公开(公告)日：1986-02-04

申请号：US663624

申请日：1984-10-22

申请人： Ari Aviram ,  Mitchell S. Cohen

发明人： Ari Aviram ,  Mitchell S. Cohen

IPC分类号： B41M5/42 ,  B41M5/48 ,  G03C5/16 ,  G01D9/00 ,  G01D15/10

CPC分类号： B41M5/426 ,  B41M5/48

摘要： Processes for thermal transfer printing are disclosed which comprise electroerosion printing to produce an image bearing element and exposing the imaged element to irradiation so as to permit transfer of thermographic ink from an associated ink layer or ink-containing element onto an ink receiving substrate thus producing copies of the image carried by the image bearing element. Also, described are products for use in such processes.

摘要翻译： 公开了用于热转印印刷的方法，其包括电渗印刷以产生图像承载元件并将成像元件暴露于照射，以便允许将热像印刷油墨从相关联的油墨层或含油墨元件转移到油墨接收基底上，从而产生副本 由图像承载元件承载的图像。 此外，描述了用于这些方法的产品。

公开(公告)号：US4550061A

公开(公告)日：1985-10-29

申请号：US599875

申请日：1984-04-13

申请人： Krishna G. Sachdev ,  Stephen A. Shear ,  Keith S. Pennington ,  Mitchell S. Cohen

发明人： Krishna G. Sachdev ,  Stephen A. Shear ,  Keith S. Pennington ,  Mitchell S. Cohen

IPC分类号： B41M5/24 ,  B32B15/08 ,  B32B27/06 ,  B32B27/08

CPC分类号： B41M5/245 ,  Y10S428/913 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31692 ,  Y10T428/31699 ,  Y10T428/31935

摘要： Improved electroerosion recording media are described in which ablatable polymers are used in the electroerosion recording medium. This medium includes at least a substrate or support layer, a base layer which protects the substrate, a thin film of conductive material on the base layer and which can be eroded, and a protective overcoat layer. Ablatable polymers are used as binders in either the base layer or the top protective layer, or both, in order to provide advantages during electroerosion. These ablatable polymers undergo thermally induced depolymerization in such a way that the result is the formation of volatile monomeric or low molecular weight species as the predominant products, with little or no adherent residue.

摘要翻译： 描述了改进的电腐蚀记录介质，其中可电解聚合物用于电腐蚀记录介质中。 该介质至少包括基底或支撑层，保护基底的基底层，基底层上的导电材料薄膜和可被侵蚀的保护性外涂层。 可以使用可充气的聚合物作为基层或顶部保护层中的粘合剂，或两者都可以使用，以便在电腐蚀过程中提供优点。 这些可焙烧的聚合物以这样的方式进行热诱导解聚，结果是形成挥发性单体或低分子量物质作为主要产物，几乎没有或没有粘附残留物。

公开(公告)号：US4156936A

公开(公告)日：1979-05-29

申请号：US801872

申请日：1977-05-31

申请人： Gregory W. Beall ,  Mitchell S. Cohen ,  Mark H. Kryder

发明人： Gregory W. Beall ,  Mitchell S. Cohen ,  Mark H. Kryder

IPC分类号： G11C11/14 ,  G11C19/08 ,  H03K17/84

CPC分类号： G11C19/0883 ,  H03K17/84

摘要： SLM field access bubble devices which include at least one conductor crossing a bubble propagation path have severely limited operating margins (especially for small bubbles) for the bubble in the vicinity of the conductor. Apparatus and method for operating such a bubble device is disclosed which improves the device operation in this region. The improved apparatus and method provides an additional field source with a sense and magnitude to support the bubble when it reaches the conductor region. Such a field source, as disclosed, includes a current pulse in the conductor.

摘要翻译： 包括至少一个穿过气泡传播路径的导体的SLM场存取气泡装置对导体附近的气泡具有严格限制的操作余量（特别是对于小气泡）。 公开了用于操作这种气泡装置的装置和方法，其改进了该区域中的装置操作。 改进的装置和方法提供具有感觉和大小的附加场源，以在气泡到达导体区域时支撑气泡。 如所公开的，这种场源包括导体中的电流脉冲。