公开(公告)号：US07108809B2

公开(公告)日：2006-09-19

申请号：US10262754

申请日：2002-10-01

申请人： Benson Chan ,  Richard R. Hall ,  How T. Lin ,  Christopher J. Majka ,  John H. Sherman

发明人： Benson Chan ,  Richard R. Hall ,  How T. Lin ,  Christopher J. Majka ,  John H. Sherman

IPC分类号： B29D11/00

CPC分类号： B29D11/00 ,  B29C33/42

摘要： An optical coupler arrangement which is employed for replicating surface features of diverse types of optical devices. Also disclosed is to a novel method of accurately replicating surface features of optical devices; particularly through the utilization of the novel optical coupler arrangement.

摘要翻译： 用于复制各种类型的光学器件的表面特征的光耦合器装置。 还公开了一种准确地复制光学器件的表面特征的新颖方法; 特别是通过利用新颖的光耦合装置。

公开(公告)号：US06644864B2

公开(公告)日：2003-11-11

申请号：US10097767

申请日：2002-03-14

申请人： Benson Chan ,  Richard R. Hall ,  How T. Lin ,  John H. Sherman

发明人： Benson Chan ,  Richard R. Hall ,  How T. Lin ,  John H. Sherman

IPC分类号： G02B638

CPC分类号： G02B6/3676 ,  G02B6/3636 ,  G02B6/3692 ,  G02B6/3885 ,  G02B6/4249

摘要： The present invention relates generally to fiber optical arrays, and particularly, but not by way of limitation, to 3-dimentional array fiber optical couplers. More particularly, the present invention provides means of coupling semiconductor laser light sources to fiber-optic transmission devices.

摘要翻译： 本发明一般涉及光纤阵列，特别是涉及三维阵列光纤耦合器，而非限制性的。 更具体地，本发明提供了将半导体激光光源耦合到光纤传输装置的装置。

公开(公告)号：US06635866B2

公开(公告)日：2003-10-21

申请号：US09838645

申请日：2001-04-19

申请人： Benson Chan ,  Richard R. Hall ,  How T. Lin ,  John H. Sherman

发明人： Benson Chan ,  Richard R. Hall ,  How T. Lin ,  John H. Sherman

IPC分类号： H01J502

CPC分类号： G02B6/4292 ,  G02B6/3885 ,  G02B6/3897 ,  G02B6/4232 ,  G02B6/4249

摘要： An optical coupler that provides for the direct mounting of integrated circuit(s). The coupler includes a two-part housing with grooves for accommodating optical fibers that are held in place when the two parts are put together. Circuitry is formed on the housing and solder balls, when heated to a liquid state and cooled (reflowed), are used to attach integrated circuit(s) onto the housing. At least one of these integrated circuit(s) is an optical die that is positioned in close proximity to the optical fibers to provide for the receipt and/or transmission of optical signals. The reflowing of the solder balls forms an electrical connection between the circuitry on the housing and the integrated circuit(s) and provides for alignment of these components. The housing is attached to a circuitized substrate using reflowed solder balls or wirebonds.

公开(公告)号：US06527457B2

公开(公告)日：2003-03-04

申请号：US09775725

申请日：2001-02-01

申请人： Benson Chan ,  Richard R. Hall ,  How T. Lin ,  John H. Sherman

发明人： Benson Chan ,  Richard R. Hall ,  How T. Lin ,  John H. Sherman

IPC分类号： G02B636

CPC分类号： G02B6/4249 ,  G02B6/3644 ,  G02B6/3664 ,  G02B6/3696 ,  G02B6/3834 ,  G02B6/3847 ,  G02B6/3855 ,  G02B6/4224 ,  G02B6/4238 ,  G02B6/424 ,  G02B6/4257 ,  G02B6/4267

摘要： An optical fiber guide includes a matrix of holes integrated directly into a substrate on which one or more optical chips are mounted. The substrate therefore functions both as a guide for optically coupling a plurality of optical fibers to an optical chip, as well as a carrier for the optical chip itself. The size of the fiber guide and its integration density is therefore improved over conventional fiber connectors. The substrate is preferably made of a material having a coefficient of thermal expansion substantially similar to the coefficient of thermal expansion of the optical chip. This ensures that the optical fibers will remain optically coupled to the chip through the matrix of holes in the substrate regardless of external temperature influences. If desired, integrated circuits may be mounted onto the substrate to increase the functionality of the fiber guide. A method for making the fiber guide has fewer process steps than conventional methods because fiber guide has fewer parts than conventional fiber-optic connectors.

公开(公告)号：US06712527B1

公开(公告)日：2004-03-30

申请号：US09481903

申请日：2000-01-12

申请人： Benson Chan ,  Mitchell S. Cohen ,  Paul F. Fortier ,  Ladd W. Freitag ,  Richard R. Hall ,  Glen W. Johnson ,  How Tzu Lin ,  John H. Sherman

发明人： Benson Chan ,  Mitchell S. Cohen ,  Paul F. Fortier ,  Ladd W. Freitag ,  Richard R. Hall ,  Glen W. Johnson ,  How Tzu Lin ,  John H. Sherman

IPC分类号： G02B636

CPC分类号： G02B6/4201 ,  G02B6/3885 ,  G02B6/421 ,  G02B6/4246 ,  G02B6/4261 ,  G02B6/4268 ,  G02B6/4277 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292 ,  H05K1/189

摘要： A package is described that couples a twelve channel wide fiber optic cable to a twelve channel Vertical Cavity Surface Emitting Laser (VCSEL) transmitter and a multiple channel Perpendicularly Aligned Integrated Die (PAID) receiver. The package allows for reduction in the height of the assembly package by vertically orienting certain dies parallel to the fiber optic cable and horizontally orienting certain other dies. The assembly allows the vertically oriented optoelectronic dies to be perpendicularly attached to the horizontally oriented laminate via a flexible circuit.

摘要翻译： 描述了将十二通道宽光纤电缆耦合到十二通道垂直腔面发射激光器（VCSEL）发射器和多通道垂直对准集成管芯（PAID）接收器的封装。 该封装允许通过垂直定向平行于光纤电缆的某些管芯并水平地定向某些其他管芯来降低组件封装的高度。 组件允许垂直定向的光电管芯通过柔性电路垂直地附接到水平取向的层压板。

公开(公告)号：US06741778B1

公开(公告)日：2004-05-25

申请号：US09578216

申请日：2000-05-23

申请人： Benson Chan ,  Richard R. Hall ,  How Tzu Lin ,  John H. Sherman

发明人： Benson Chan ,  Richard R. Hall ,  How Tzu Lin ,  John H. Sherman

IPC分类号： G02B626

CPC分类号： G02B6/4232 ,  G02B6/421 ,  G02B6/4231 ,  G02B6/4236 ,  G02B6/4239 ,  G02B6/4243 ,  G02B6/4244 ,  G02B6/4249 ,  G02B6/426

摘要： Optical packages and a method of fabricating same, wherein an active optical device can be located relative to a substrate and coupler. The structure includes a substrate having electrical contact pads and alignment pads with precision aligned through-holes for at least one optical fiber. The optical fibers are supported by a housing, or coupler, having alignment pins that are precision located relative to the through-holes in the substrate and the optical fiber. A die, or active optical device, with one or more active optical elements on a first die surface and electrical contacts on a second die surface, is aligned with the electrical pads of the substrate and the active optical elements. The method incorporates the steps of grinding alignment pins into metallic pads and grinding optical fibers in one pass and then aligning the active optical device and the optical fibers by using the surface tension of conductive adhesive liquid. The fibers are then bonded.

摘要翻译： 光学封装及其制造方法，其中有源光学器件可相对于衬底和耦合器定位。 该结构包括具有电接触焊盘和具有用于至少一个光纤的精确对准的通孔的对准焊盘的衬底。 光纤由具有相对于衬底和光纤中的通孔精确定位的对准引脚的壳体或耦合器支撑。 与第一裸片表面上的一个或多个有源光学元件和第二裸片表面上的电接触的裸片或有源光学器件与衬底和有源光学元件的电焊盘对准。 该方法包括将对准针磨成金属垫并一次研磨光纤的步骤，然后通过使用导电粘合剂液体的表面张力来对准有源光学器件和光纤。 然后粘合纤维。

公开(公告)号：US06349032B1

公开(公告)日：2002-02-19

申请号：US09244300

申请日：1999-02-03

申请人： Benson Chan ,  Richard R. Hall ,  John H. Sherman ,  Candido C. Tiberia

发明人： Benson Chan ,  Richard R. Hall ,  John H. Sherman ,  Candido C. Tiberia

IPC分类号： H05K720

CPC分类号： H01L23/4093 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2224/0401

摘要： An electronic package contains a circuit card to which a chip carrier plate is attached via solder balls. A heat spreader plate, supporting a heat sink, is spring loaded against the semiconductor chip of the carrier plate by means of elastomeric disks disposed upon a spring retainer plate that is, itself, disposed adjacent the chip carrier plate. A plastic cover both protects and supports the heat sink and semiconductor chip. A retention latch is disposed between the cover plate and the spring retainer plate.

摘要翻译： 电子封装包含电路卡，通过焊球将芯片载体板附接到电路卡上。 支撑散热器的散热板通过设置在本身邻近芯片载体板的弹簧保持板上的弹性体盘弹簧加载到承载板的半导体芯片上。 塑料盖既保护和支撑散热片和半导体芯片。 保持闩锁设置在盖板和弹簧保持板之间。

公开(公告)号：US20120260063A1

公开(公告)日：2012-10-11

申请号：US13082599

申请日：2011-04-08

申请人： Voya R. Markovich ,  How T. Lin ,  Benson Chan ,  Frank D. Egitto

发明人： Voya R. Markovich ,  How T. Lin ,  Benson Chan ,  Frank D. Egitto

IPC分类号： G06F15/76 ,  G06F9/02

CPC分类号： H05K3/365 ,  H01L2924/0002 ,  H05K1/148 ,  H05K2201/047 ,  H05K2201/10159 ,  H05K2201/209 ,  H01L2924/00

摘要： A detachable, logic leaf module having dendritic projections on a surface is connected to a recessed area on the surface of a cluster interface board. The projections are used for electrically connecting the logic module device to the cluster interface board or the like, the projections on the surface of the logic leaf being flexibly and conductively wired to the receiving area on the surface of the cluster interface board. The logic leaf connector is removable without the need for solder softening thermal cycles or special tools, and permits the simple removal or replacement of an individual leaf at any time.

摘要翻译： 在表面上具有树状突起的可拆卸的逻辑叶片模块连接到集群接口板的表面上的凹陷区域。 突起用于将逻辑模块设备电连接到集群接口板等，逻辑叶片的表面上的突起被灵活地和导电地连接到集群接口板的表面上的接收区域。 逻辑叶片连接器是可移动的，不需要焊料软化热循环或特殊工具，并且允许在任何时间简单地移除或更换单个叶片。

公开(公告)号：US20090109624A1

公开(公告)日：2009-04-30

申请号：US11976468

申请日：2007-10-25

申请人： Benson Chan ,  Frank D. Egitto ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  David L. Thomas

发明人： Benson Chan ,  Frank D. Egitto ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  David L. Thomas

IPC分类号： H05K7/20 ,  H05K3/20

CPC分类号： H05K1/0206 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K3/0061 ,  H05K3/44 ,  H05K2201/064 ,  H05K2201/09745 ,  H05K2201/10674 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T428/24917 ,  H01L2924/00

摘要： An electrical assembly which includes a circuitized substrate including a first plurality of dielectric and electrically conductive circuit layers alternatively oriented in a stacked orientation, a thermal cooling structure bonded to one of the dielectric layers and at least one electrical component mounted on the circuitized substrate. The circuitized substrate includes a plurality of electrically conductive and thermally conductive thru-holes located therein, selected ones of the thermally conductive thru-holes thermally coupled to the electrical component(s) and extending through the first plurality of dielectric and electrically conductive circuit layers and being thermally coupled to the thermal cooling structure, each of these selected ones of thermally conductive thru-holes providing a thermal path from the electrical component to the thermal cooling structure during assembly operation. The thermal cooling structure is adapted for having cooling fluid pass there-through during operation of the assembly. A method of making the substrate is also provided.

摘要翻译： 一种电气组件，其包括电路化衬底，其包括以层叠取向交替取向的第一多个电介质和导电电路层，结合到所述电介质层之一的热冷结构和安装在所述电路化衬底上的至少一个电气部件。 电路化衬底包括位于其中的多个导电和导热通孔，选择的导热通孔热耦合到电气部件并延伸穿过第一多个电介质和导电电路层，并且 热耦合到热冷却结构，这些选择的导热通孔中的每一个在组装操作期间提供从电气部件到热冷却结构的热路径。 热冷却结构适于在组件的操作期间使冷却流体通过。 还提供了制造基板的方法。

公开(公告)号：US20080238323A1

公开(公告)日：2008-10-02

申请号：US11730404

申请日：2007-04-02

申请人： Benson Chan ,  John E. Kozol ,  John M. Lauffer ,  How T. Lin

发明人： Benson Chan ,  John E. Kozol ,  John M. Lauffer ,  How T. Lin

IPC分类号： H01J7/44

CPC分类号： F21V29/70 ,  F21K9/00 ,  F21K9/69 ,  F21V29/85 ,  F21W2131/202 ,  F21W2131/205 ,  F21Y2115/10 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/10106

摘要： An LED lighting assembly including a plurality of individual LEDs mounted on a common, bendable heat sinking member designed to remove heat from the LEDs during operation and also to be formed (bent) to provide the desired light direction and intensity. Several such assemblies may be used within an LED lamp, as also provided herein. The lamp is ideal for use within medical and dental environments to assure optimal light onto a patient located at a specified distance from the lamp.

摘要翻译： 一种LED照明组件，包括安装在公共的可弯曲的散热构件上的多个单独的LED，该散热构件被设计成在操作期间从LED移除热量并且还被形成（弯曲）以提供期望的光的方向和强度。 如本文也提供的，LED灯内可以使用若干这样的组件。 该灯是理想的在医疗和牙科环境中使用，以确保最佳的光照射到距离灯具指定距离的患者。