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    Antireflective coatings for via fill and photolithography applications and methods of preparation thereof
    1.
    发明授权
    Antireflective coatings for via fill and photolithography applications and methods of preparation thereof 有权
    用于通孔填充和光刻应用的抗反射涂层及其制备方法

    公开(公告)号：US08992806B2

    公开(公告)日：2015-03-31

    申请号：US13217706

    申请日：2011-08-25

    申请人： Bo Li ,  Joseph Kennedy ,  Nancy Iwamoto ,  Mark A. Fradkin ,  Makarem A. Hussein ,  Michael D. Goodner ,  Victor Lu ,  Roger Leung

    发明人： Bo Li ,  Joseph Kennedy ,  Nancy Iwamoto ,  Mark A. Fradkin ,  Makarem A. Hussein ,  Michael D. Goodner ,  Victor Lu ,  Roger Leung

    IPC分类号： C09K3/00 ,  G03F7/11 ,  C09D183/04 ,  G03F7/075 ,  C09D183/08 ,  G03F7/09

    CPC分类号： C09D183/04 ,  C09D183/08 ,  G03F7/0751 ,  G03F7/0752 ,  G03F7/091

    摘要： An absorbing composition is described herein that includes at least one inorganic-based compound, at least one absorbing compound, and at least one material modification agent. In addition, methods of making an absorbing composition are also described that includes: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, an acid/water mixture, and one or more solvents to form a reaction mixture; and b) allowing the reaction mixture to form the absorbing composition at room temperature. Another method of making an absorbing composition includes: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, an acid/water mixture, and one or more solvents to form a reaction mixture; and b) heating the reaction mixture to form the absorbing composition. Yet another method of making an absorbing composition is described that includes: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, and one or more solvents to form a reaction mixture, wherein the at least one material modification agent comprises at least one acid and water; and b) heating the reaction mixture to form an absorbing material, a coating or a film. In other methods of making an absorbing composition described herein, those methods include: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, and one or more solvents to form a reaction mixture, wherein the at least one material modification agent comprises at least one acid and water; and b) allowing the reaction mixture to form an absorbing material, a coating or a film.

    摘要翻译： 本文描述的吸收组合物包括至少一种无机基化合物，至少一种吸收化合物和至少一种材料改性剂。 此外，还描述了制备吸收组合物的方法，其包括：a）将至少一种无机基化合物，至少一种吸收化合物，至少一种材料改性剂，酸/水混合物和一种或多种溶剂 形成反应混合物; 和b）使反应混合物在室温下形成吸收组合物。 制备吸收组合物的另一种方法包括：a）将至少一种无机基化合物，至少一种吸收化合物，至少一种材料改性剂，酸/水混合物和一种或多种溶剂组合以形成反应混合物; 和b）加热反应混合物以形成吸收组合物。 描述了制备吸收组合物的另一种方法，其包括：a）将至少一种无机基化合物，至少一种吸收化合物，至少一种材料改性剂和一种或多种溶剂组合以形成反应混合物，其中 至少一种材料改性剂包含至少一种酸和水; 和b）加热反应混合物以形成吸收材料，涂层或膜。 在制备本文所述的吸收组合物的其它方法中，这些方法包括：a）将至少一种无机基化合物，至少一种吸收化合物，至少一种材料改性剂和一种或多种溶剂组合以形成反应混合物， 其中所述至少一种材料改性剂包含至少一种酸和水; 和b）使反应混合物形成吸收材料，涂层或膜。

    Antireflective Coatings for Via Fill and Photolithography Applications and Methods of Preparation Thereof
    2.
    发明申请
    Antireflective Coatings for Via Fill and Photolithography Applications and Methods of Preparation Thereof 审中-公开
    用于通孔填充和光刻的抗反射涂层及其制备方法

    公开(公告)号：US20120001135A1

    公开(公告)日：2012-01-05

    申请号：US13217706

    申请日：2011-08-25

    申请人： Bo Li ,  Joseph Kennedy ,  Nancy Iwamoto ,  Mark A. Fradkin ,  Makarem A. Hussein ,  Michael D. Goodin ,  Victor Lu ,  Roger Leung

    发明人： Bo Li ,  Joseph Kennedy ,  Nancy Iwamoto ,  Mark A. Fradkin ,  Makarem A. Hussein ,  Michael D. Goodin ,  Victor Lu ,  Roger Leung

    IPC分类号： C09K3/00

    CPC分类号： C09D183/04 ,  C09D183/08 ,  G03F7/0751 ,  G03F7/0752 ,  G03F7/091

    摘要： An absorbing composition is described herein that includes at least one inorganic-based compound, at least one absorbing compound, and at least one material modification agent. In addition, methods of making an absorbing composition are also described that includes: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, an acid/water mixture, and one or more solvents to form a reaction mixture; and b) allowing the reaction mixture to form the absorbing composition at room temperature. Another method of making an absorbing composition includes: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, an acid/water mixture, and one or more solvents to form a reaction mixture; and b) heating the reaction mixture to form the absorbing composition. Yet another method of making an absorbing composition is described that includes: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, and one or more solvents to form a reaction mixture, wherein the at least one material modification agent comprises at least one acid and water; and b) heating the reaction mixture to form an absorbing material, a coating or a film. In other methods of making an absorbing composition described herein, those methods include: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, and one or more solvents to form a reaction mixture, wherein the at least one material modification agent comprises at least one acid and water; and b) allowing the reaction mixture to form an absorbing material, a coating or a film.

    摘要翻译： 本文描述的吸收组合物包括至少一种无机基化合物，至少一种吸收化合物和至少一种材料改性剂。 此外，还描述了制备吸收组合物的方法，其包括：a）将至少一种无机基化合物，至少一种吸收化合物，至少一种材料改性剂，酸/水混合物和一种或多种溶剂 形成反应混合物; 和b）使反应混合物在室温下形成吸收组合物。 制备吸收组合物的另一种方法包括：a）将至少一种无机基化合物，至少一种吸收化合物，至少一种材料改性剂，酸/水混合物和一种或多种溶剂组合以形成反应混合物; 和b）加热反应混合物以形成吸收组合物。 描述了制备吸收组合物的另一种方法，其包括：a）将至少一种无机基化合物，至少一种吸收化合物，至少一种材料改性剂和一种或多种溶剂组合以形成反应混合物，其中 至少一种材料改性剂包含至少一种酸和水; 和b）加热反应混合物以形成吸收材料，涂层或膜。 在制备本文所述的吸收组合物的其它方法中，这些方法包括：a）将至少一种无机基化合物，至少一种吸收化合物，至少一种材料改性剂和一种或多种溶剂组合以形成反应混合物， 其中所述至少一种材料改性剂包含至少一种酸和水; 和b）使反应混合物形成吸收材料，涂层或膜。

    Antireflective coatings for via fill and photolithography applications and methods of preparation thereof
    3.
    发明申请
    Antireflective coatings for via fill and photolithography applications and methods of preparation thereof 有权
    用于通孔填充和光刻应用的抗反射涂层及其制备方法

    公开(公告)号：US20050171277A1

    公开(公告)日：2005-08-04

    申请号：US10717028

    申请日：2003-11-18

    申请人： Bo Li ,  Joseph Kennedy ,  Nancy Iwamoto ,  Victor Lu ,  Roger Leung ,  Mark Fradkin ,  Makarem Hussein ,  Michael Goodner

    发明人： Bo Li ,  Joseph Kennedy ,  Nancy Iwamoto ,  Victor Lu ,  Roger Leung ,  Mark Fradkin ,  Makarem Hussein ,  Michael Goodner

    IPC分类号： C08G20060101 ,  C08L83/04 ,  C09D183/04 ,  C09D183/08 ,  G03F7/09

    CPC分类号： C09D183/04 ,  C09D183/08 ,  G03F7/0751 ,  G03F7/0752 ,  G03F7/091

    摘要： An absorbing composition is described herein that includes at least one inorganic-based compound, at least one absorbing compound, and at least one material modification agent. In addition, methods of making an absorbing composition are also described that includes: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, an acid/water mixture, and one or more solvents to form a reaction mixture; and b) allowing the reaction mixture to form the absorbing composition at room temperature. Another method of making an absorbing composition includes: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, an acid/water mixture, and one or more solvents to form a reaction mixture; and b) heating the reaction mixture to form the absorbing composition. Yet another method of making an absorbing composition is described that includes: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, and one or more solvents to form a reaction mixture, wherein the at least one material modification agent comprises at least one acid and water; and b) heating the reaction mixture to form an absorbing material, a coating or a film. In other methods of making an absorbing composition described herein, those methods include: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, and one or more solvents to form a reaction mixture, wherein the at least one material modification agent comprises at least one acid and water; and b) allowing the reaction mixture to form an absorbing material, a coating or a film.

    摘要翻译： 本文描述的吸收组合物包括至少一种无机基化合物，至少一种吸收化合物和至少一种材料改性剂。 此外，还描述了制备吸收组合物的方法，其包括：a）将至少一种无机基化合物，至少一种吸收化合物，至少一种材料改性剂，酸/水混合物和一种或多种溶剂 形成反应混合物; 和b）使反应混合物在室温下形成吸收组合物。 制备吸收组合物的另一种方法包括：a）将至少一种无机基化合物，至少一种吸收化合物，至少一种材料改性剂，酸/水混合物和一种或多种溶剂组合以形成反应混合物; 和b）加热反应混合物以形成吸收组合物。 描述了制备吸收组合物的另一种方法，其包括：a）将至少一种无机基化合物，至少一种吸收化合物，至少一种材料改性剂和一种或多种溶剂组合以形成反应混合物，其中 至少一种材料改性剂包含至少一种酸和水; 和b）加热反应混合物以形成吸收材料，涂层或膜。 在制备本文所述的吸收组合物的其它方法中，这些方法包括：a）将至少一种无机基化合物，至少一种吸收化合物，至少一种材料改性剂和一种或多种溶剂组合以形成反应混合物， 其中所述至少一种材料改性剂包含至少一种酸和水; 和b）使反应混合物形成吸收材料，涂层或膜。

    Coatings and hard mask compositions for integrated circuit applications methods of production and uses thereof
    4.
    发明申请
    Coatings and hard mask compositions for integrated circuit applications methods of production and uses thereof 有权
    用于集成电路应用的涂料和硬掩模组合物的生产方法及其用途

    公开(公告)号：US20070022909A1

    公开(公告)日：2007-02-01

    申请号：US10570750

    申请日：2004-10-05

    申请人： Joseph Kennedy ,  Wei Huang ,  Kim Do ,  Jason Stuck ,  Bo Li

    发明人： Joseph Kennedy ,  Wei Huang ,  Kim Do ,  Jason Stuck ,  Bo Li

    IPC分类号： C08L83/05

    CPC分类号： C09D183/04

    摘要： A coating material is described herein that includes at least one inorganic compound, and at least one densifying agent, wherein the densifying agent increases the density of the coating material as compared to the density of the at least one inorganic compound. A method of producing a coating material is described herein that includes: providing at least one inorganic compound, providing at least one densifying agent, combining the at least one inorganic compound with the at least one densifying agent to form the coating material, wherein the densifying agent increases the density of the coating material as compared to the density of the at least one inorganic compound.

    摘要翻译： 本文描述了包括至少一种无机化合物和至少一种致密化剂的涂层材料，其中与至少一种无机化合物的密度相比，致密化剂增加涂层材料的密度。 本文描述了制备涂料的方法，其包括：提供至少一种无机化合物，提供至少一种致密化剂，将至少一种无机化合物与至少一种致密化剂结合以形成涂层材料，其中致密化 与至少一种无机化合物的密度相比，增加了涂层材料的密度。

    Coatings and hard mask compositions for integrated circuit applications methods of production and uses thereof
    5.
    发明授权
    Coatings and hard mask compositions for integrated circuit applications methods of production and uses thereof 有权
    用于集成电路应用的涂料和硬掩模组合物的生产方法及其用途

    公开(公告)号：US08101015B2

    公开(公告)日：2012-01-24

    申请号：US10570750

    申请日：2004-10-05

    申请人： Joseph Kennedy ,  Wei T. Huang ,  Kim Do ,  Jason Stuck ,  Bo Li

    发明人： Joseph Kennedy ,  Wei T. Huang ,  Kim Do ,  Jason Stuck ,  Bo Li

    IPC分类号： C09D183/08

    CPC分类号： C09D183/04

    摘要： A coating material is described herein that includes at least one inorganic compound, and at least one densifying agent, wherein the densifying agent increases the density of the coating material as compared to the density of the at least one inorganic compound. A method of producing a coating material is described herein that includes: providing at least one inorganic compound, providing at least one densifying agent, combining the at least one inorganic compound with the at least one densifying agent to form the coating material, wherein the densifying agent increases the density of the coating material as compared to the density of the at least one inorganic compound.

    摘要翻译： 本文描述了包括至少一种无机化合物和至少一种致密化剂的涂层材料，其中与至少一种无机化合物的密度相比，致密化剂增加涂层材料的密度。 本文描述了制备涂料的方法，其包括：提供至少一种无机化合物，提供至少一种致密化剂，将至少一种无机化合物与至少一种致密化剂结合以形成涂层材料，其中致密化 与至少一种无机化合物的密度相比，增加了涂层材料的密度。

    Sacrificial layers comprising water-soluble compounds, uses and methods of production thereof
    7.
    发明申请
    Sacrificial layers comprising water-soluble compounds, uses and methods of production thereof 审中-公开
    包含水溶性化合物的牺牲层，用途及其生产方法

    公开(公告)号：US20060154485A1

    公开(公告)日：2006-07-13

    申请号：US11033798

    申请日：2005-01-12

    申请人： Bo Li ,  Joseph Kennedy

    发明人： Bo Li ,  Joseph Kennedy

    IPC分类号： H01L21/461

    CPC分类号： H01L21/02118 ,  H01L21/02282 ,  H01L21/312 ,  H01L21/76808

    摘要： Sacrificial composition and/or coating materials contemplated herein for use in semiconductor and electronic applications comprise at least one water-soluble compound and/or at least one water-soluble compound precursor and at least one solvent. Sacrificial materials and/or compositions may be produced by a method, comprising: a) providing at least one water-soluble compound and/or at least one water-soluble compound precursor, b) providing at least one solvent and c) blending the at least one water-soluble compound and/or precursor with the at least one solvent to form the sacrificial material and/or composition.

    摘要翻译： 本文中用于半导体和电子应用的牺牲组合物和/或涂层材料包含至少一种水溶性化合物和/或至少一种水溶性化合物前体和至少一种溶剂。 牺牲材料和/或组合物可以通过以下方法制备：a）提供至少一种水溶性化合物和/或至少一种水溶性化合物前体，b）提供至少一种溶剂，和c） 至少一种水溶性化合物和/或前体与至少一种溶剂形成牺牲材料和/或组合物。

    Initiators for living carbocationic polymerization
    9.
    发明授权
    Initiators for living carbocationic polymerization 有权

    公开(公告)号：US10472457B2

    公开(公告)日：2019-11-12

    申请号：US16069659

    申请日：2017-01-20

    申请人： Joseph Kennedy ,  Turgut Nugay

    发明人： Joseph Kennedy ,  Turgut Nugay

    IPC分类号： C08F2/46 ,  C08F2/50 ,  C08G61/04 ,  C08G18/62 ,  C08G81/02 ,  C08F2/48 ,  C08F8/06 ,  C08F8/30 ,  C08F210/10

    摘要： In various embodiments, the present invention is directed to new low cost initiator compositions for use with the production of well-defined telechelic PIBs (by LC+P of isobutylene). In various other embodiments, the present invention is directed to methods for using these novel compositions as initiators for isobutylene (IB) and other cationically polymerizable monomers, such as styrene and its derivatives. In still other embodiments, the present invention is directed to structurally new, allyl (and chlorine) telechelic PIBs formed from these new initiator compositions and their derivatives (in particular, hydroxyl telechelic PIB and amine telechelic PIB). In yet other embodiments, the present invention is directed to structurally new polyurethanes, polyureas, and polyurethane ureas made using telechelic PIBs formed from these new initiator compositions.