公开(公告)号：US06169322A

公开(公告)日：2001-01-02

申请号：US09036598

申请日：1998-03-06

申请人： Bo S. Chang ,  Fritz W. Beyerlein

发明人： Bo S. Chang ,  Fritz W. Beyerlein

IPC分类号： H01L23495

CPC分类号： H01L23/49544 ,  H01L23/49503 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： The invention enables a die to be attached to a die attach pad so as to reduce delamination stress that can arise when the die and die attach pad are heated, and so as to provide support for the die at locations where bond pads are formed so that the die is not damaged by forces applied to the die during attachment of bond wires to the bond pads. The die and die attach pad so attached can be used to produce a packaged die having improved delamination characteristics, so that the cost to manufacture and/or store the packaged die can be reduced. The invention further provides die attach pads and leadframes including such die attach pads that are particularly suited to achieving the aforementioned functional characteristics.

摘要翻译： 本发明使得模具能够附接到管芯附接焊盘，以便减少当管芯和管芯附接焊盘被加热时可能出现的分层应力，并且为了在形成接合焊盘的位置处为管芯提供支撑，使得 在将接合线附接到接合焊盘期间，管芯不会被施加到管芯上的力损坏。 可以使用如此附接的管芯和管芯附接垫来制造具有改进的分层特性的封装的模具，从而可以减少制造和/或存储封装的管芯的成本。 本发明还提供了包括这样的管芯附接焊盘的管芯附接焊盘和引线框架，其特别适用于实现上述功能特性。

公开(公告)号：US4017963A

公开(公告)日：1977-04-19

申请号：US578673

申请日：1975-05-19

申请人： Fritz W. Beyerlein

发明人： Fritz W. Beyerlein

IPC分类号： H01L23/495 ,  H01L25/11 ,  H05K3/30 ,  H05K3/34 ,  B01J17/00

CPC分类号： H01L23/49541 ,  H01L24/01 ,  H01L25/117 ,  H05K3/3426 ,  H01L2924/14 ,  H05K2201/09418 ,  H05K2201/09709 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2203/087 ,  H05K2203/1581 ,  H05K3/305 ,  H05K3/3473 ,  H05K3/3494 ,  Y02P70/613 ,  Y10T29/49121

摘要： Semiconductor assembly and method in which very small pill-like packages can be mounted directly on boards and can be directly mounted in assemblies and stacks. The pill-like package encapsulates a semiconductor body having at least a portion of an electrical circuit formed therein with contact pads in a predetermined pattern carried by the body and lying in a common plane with a plurality of first leads bonded to the contact pads and the first leads extending outwardly from the semiconductor body and having outer extremities which lie in a predetermined pattern with encapsulating means encapsulating the semiconductor body and the portions of the first leads in engagement with the contact pads. The pill-like package is very small and has a spider-like conformation. The leads are formed in such a manner so that the packages can be directly mounted upon printed circuit boards without extending the leads through holes. The pill-like packages can be stacked into assemblies in which the leads are interconnected.

摘要翻译： 半导体组件和方法，其中非常小的药丸状包装可以直接安装在板上，并且可以直接安装在组件和堆叠中。 药丸状包装封装半导体本体，其具有形成在其中的电路的至少一部分，接触垫以预定的图案承载，并且与公共平面相连，多个第一引线与接触垫接合，并且 第一引线从半导体本体向外延伸并且具有以预定图案形成的外端，封装装置封装半导体本体，并且第一引线的部分与接触焊盘接合。 丸状包装非常小，具有蜘蛛状构型。 引线以这样的方式形成，使得封装可以直接安装在印刷电路板上，而不会使引线通过孔延伸。 药丸状包装可以堆叠在其中引线相互连接的组件中。

公开(公告)号：US4026008A

公开(公告)日：1977-05-31

申请号：US578668

申请日：1975-05-19

申请人： Joseph M. Drees ,  Fritz W. Beyerlein

发明人： Joseph M. Drees ,  Fritz W. Beyerlein

IPC分类号： H01L21/48 ,  H01L23/057 ,  H01L23/31 ,  H01L23/433 ,  H01L23/485 ,  H01L23/495 ,  B01J17/00

CPC分类号： H01L24/10 ,  H01L21/4842 ,  H01L23/057 ,  H01L23/3135 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  Y10T29/49004 ,  Y10T29/49121

摘要： A lead structure formed from a sheet of electrically conducting material having a plurality of spaced integral lead arrays formed therein with each of the arrays comprising a plurality of first leads formed from the sheet material in one region thereof and being integral with the sheet with each of the leads being cantilevered and having inner extremities which are free and positioned in a predetermined pattern. Portions of the first leads adjacent the free ends are convoluted. A semiconductor body having at least portions of an electrical circuit formed therein and with contacts in a predetermined pattern carried by the body and lying in a common plane is secured to each of the arrays with the contact pads being bonded to the inner extemities of the first leads. A first encapsulating means is provided for encapsulating the semiconductor body and the inner extremities of the first leads with the outer extremities of the first leads being free of the first encapsulating means. After the first encapsulation, the outer extremities of the first lead are separated from the sheet of material. A plurality of spaced second leads are then secured to the outer extremities of the first leads. A second encapsulating means is then provided for encapsulating the first encapsulating means, the outer extremities of the first leads and the inner extremities of the second leads with the outer extremities of the second leads being free.

摘要翻译： 由一片导电材料形成的引线结构，其具有形成在其中的多个间隔开的整体引线阵列，其中每个阵列包括由片材在其一个区域中形成的多个第一引线， 引线是悬臂的并且具有自由并且以预定图案定位的内端。 邻近自由端的第一引线的部分被卷绕。 半导体本体至少具有形成在其中的电路的一部分，并且具有由本体承载并且位于公共平面中的预定图案中的触点的每个阵列被固定到每个阵列上，其中触点焊盘与第一 领导。 提供了第一封装装置，用于封装半导体本体和第一引线的内端，第一引线的外端没有第一封装装置。 在第一次封装之后，第一引线的外端与材料片分离。 然后将多个间隔开的第二引线固定到第一引线的外端。 然后提供第二封装装置，用于封装第一封装装置，第一引线的外端和第二引线的内端与第二引线的外端自由。