摘要:
A modular semiconductor substrate cleaning system is provided that processes vertically oriented semiconductor substrates. The system features a plurality of cleaning modules that may include a megasonic tank-type cleaner followed by a scrubber. An input module may receive a horizontally oriented substrate and rotate the substrate to a vertical orientation, and an output module may receive a vertically oriented substrate and rotate the substrate to a horizontal orientation. Each of the modules (input, cleaning and output) has a substrate support and may be positioned such that the substrate supports of adjacent modules are equally spaced. The modules are coupled by an overhead transfer mechanism having a plurality of substrate handlers spaced the same distance (X) as the substrate supports of the modules therebelow. The transfer mechanism indexes forward and backward the distance X to simultaneously transport semiconductor substrates through the cleaning system, lifting and lowering substrates from the desired modules wafer rotation/orientation sensors, an input module cart for transporting wafers between a substrate handler of a previous tool (such as a semiconductor substrate polisher) and a substrate handler of the cleaning system are also included.
摘要:
A modular semiconductor substrate cleaning system is provided that processes vertically oriented semiconductor substrates. The system features a plurality of cleaning modules that may include a megasonic tank-type cleaner followed by a scrubber. An input module may receive a horizontally oriented substrate and rotate the substrate to a vertical orientation, and an output module may receive a vertically oriented substrate and rotate the substrate to a horizontal orientation. Each of the modules (input, cleaning and output) has a substrate support and may be positioned such that the substrate supports of adjacent modules are equally spaced. The modules are coupled by an overhead transfer mechanism having a plurality of substrate handlers spaced the same distance (X) as the substrate supports of the modules therebelow. The transfer mechanism indexes forward and backward the distance X to simultaneously transport semiconductor substrates through the cleaning system, lifting and lowering substrates from the desired modules wafer rotation/orientation sensors, an input module cart for transporting wafers between a substrate handler of a previous tool (such as a semiconductor substrate polisher) and a substrate handler of the cleaning system are also included.
摘要:
A wireless headset capable of receiving audio signals transmitted wirelessly and compatible for use in an MRI scanner is disclosed. The headset includes a first wireless module connected to the first earphone and a second wireless module connected to the second earphone. Each wireless module is electrically connected to a speaker in the respective earphone. The first wireless module receives the audio signal from a remote source and coordinates transmission of the audio signal to each of the speakers. The compact nature of each earphone minimizes the length of wire runs. In addition, the headset is made of materials having low magnetic susceptibility such that they will not be affected by the magnetic field from the MRI scanner.
摘要:
An apparatus for generating electricity from a flowing stream of water is disclosed. A rigid frame is fixed with a pair of wheels, or with two linkages in circuit around two pairs of wheels. A plurality of blades are fixed between the wheel or linkages at their side edges, a cross-sectional area of each blade being substantially comparable to the cross-sectional area of the stream of water. An orientating mechanism is adapted to maintain the orientation of each blade such that rotation of the wheels or linkages results in an opposite rotation of each blade to maintain the orientation of the blade. As such, each blade “stabs” orthogonally into and out of the flow of water edge first, minimizing the displacement and disruption of the water upon entering. Each wheel or linkage, when mechanically coupled with a generator, results in the production of electricity.
摘要:
A method is provided for measuring edge exclusion on a workpiece that includes a wafer having a film disposed thereon. The method is performed by a CMP system employing a platen and a thickness sensor coupled to the platen and positioned to repeatedly travel a path over the edge of the film during polishing. The method comprises measuring the thickness of the workpiece during selected iterations of the probe path, and establishing from the wafer thickness measurements the length of time the probe is over the film (ton) during the selected iterations. Edge exclusion is determined for at least one iteration utilizing a function related to ton.
摘要:
A stent may be formed of at least one structural material having a pattern including at least one serpentine structure, which extends about the longitudinal axis of the stent. The structure is formed of a plurality of struts. Adjacent struts are interconnected by end portions having inner turns and outer turns. At least some of the end portions are elongated and other end portions are non-elongated and have a predetermined length. At least one of said elongated end portions is configured to serve as a fiducial marker.
摘要:
The present invention is directed to compounds of formula (I) wherein variables X1, X2, Y, R1a, R1b, R2a, R2b, A1, A2, A3, and A4 are as defined in the description, and methods of use to treat pain, neuropathic pain, allodynia, pain associated with inflammation or an inflammatory disease, inflammatory hyperalgesia, bladder overactivity, and urinary incontinence.
摘要:
A stent may be formed of at least one structural material having a pattern including at least one serpentine structure which extends about the longitudinal axis of the stent. The structure is formed of a plurality of struts. Adjacent struts are interconnected by end portions having inner turns and outer turns. At least some of the end portions are elongated and other end portions are non-elongated and have a predetermined length. The inner turns of the elongated end portions are substantially unaligned longitudinally with the inner turns of the non-elongated end portions. At least one of said elongated end portions is configured to serve as a fiducial marker.
摘要:
A method of fabricating a film for attachment of one or more printhead integrated circuits to an ink supply manifold is provided. The method comprises the steps of: (a) providing an adhesive polymeric film having a protective liner; (b) depositing photoresist onto the protective liner; (c) photopatterning the photoresist to define a plurality of openings positioned for etching supply holes through the film; (d) etching the plurality of ink supply holes through the film, the photoresist acting as a mask for the etch; and (e) removing the protective liner having the photoresist deposited thereon.