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1.发明申请公开(公告)号：US20090107003A1
公开(公告)日：2009-04-30
申请号：US12083753
申请日：2006-10-06
申请人： Brigitte Heinecke , Michael Ott
发明人： Brigitte Heinecke , Michael Ott
IPC分类号： F26B3/00
CPC分类号： F01D5/005 , C23G5/00 , F01D25/002 , Y02T50/67
摘要： There is described a method for cleaning components that comprise cracks that are polluted with oxides, in particular gas turbine part. In said method, the components to be cleaned are exposed in a cleaning chamber at high temperature to a cleaning gas containing gaseous halogen compounds, which ionize to form halide ions. A cleaning gas is used containing 18 to 30% by volume hydrogen halide.
摘要翻译： 描述了一种用于清洁包含被氧化物，特别是燃气轮机部分污染的裂纹的部件的方法。 在所述方法中，要清洁的部件在高温清洗室中暴露于含有气态卤素化合物的清洁气体，该气态卤素化合物电离以形成卤离子。 使用含有18至30体积％卤化氢的清洁气体。
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公开(公告)号：US07736700B2
公开(公告)日：2010-06-15
申请号：US10574722
申请日：2004-09-15
申请人： Reiner Anton , Christian Báhr , Brigitte Heinecke , Michael Ott
发明人： Reiner Anton , Christian Báhr , Brigitte Heinecke , Michael Ott
IPC分类号： B05D3/02
CPC分类号： B23P6/007 , C23C4/02 , C23C26/00 , C23C28/021 , C23C28/022 , C23C28/023 , C23C28/028 , C23C28/321 , C23C28/3215 , C23C28/322 , C23C28/3455 , C23C28/36 , F01D5/005 , F05D2230/80 , F05D2230/90 , Y10T428/12389 , Y10T428/12576 , Y10T428/12847 , Y10T428/12931 , Y10T428/24273
摘要： Conventionally, cavities and cracks are filled with a solder metal which forms brittle phases with a subsequently applied coating, which have a negative effect on the mechanical properties. According to the invention, the components which form brittle phases are removed from the solder metal. The above is achieved, whereby a second material is applied which reacts with said component and which is removed again with the brittle phases, before the coating.
摘要翻译： 通常，空穴和裂纹填充有随后施加的涂层形成脆性相的焊料金属，这对机械性能具有负面影响。 根据本发明，从焊料金属中去除形成脆性相的部件。 实现上述目的，由此施加第二材料，其在所述涂覆之前与所述组分反应并再次被所述脆性相除去。
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公开(公告)号：US20100192589A1
公开(公告)日：2010-08-05
申请号：US12758080
申请日：2010-04-12
申请人： Reiner Anton , Christian Bähr , Brigitte Heinecke , Michael Ott
发明人： Reiner Anton , Christian Bähr , Brigitte Heinecke , Michael Ott
CPC分类号： B23P6/007 , C23C4/02 , C23C26/00 , C23C28/021 , C23C28/022 , C23C28/023 , C23C28/028 , C23C28/321 , C23C28/3215 , C23C28/322 , C23C28/3455 , C23C28/36 , F01D5/005 , F05D2230/80 , F05D2230/90 , Y10T428/12389 , Y10T428/12576 , Y10T428/12847 , Y10T428/12931 , Y10T428/24273
摘要： Conventionally, cavities and cracks are filled with a solder metal which forms brittle phases with a subsequently applied coating, which have a negative effect on the mechanical properties. According to the invention, the components which form brittle phases are removed from the solder metal. The above is achieved, whereby a second material is applied which reacts with said component and which is removed again with the brittle phases, before the coating.
摘要翻译： 通常，空穴和裂纹填充有随后施加的涂层形成脆性相的焊料金属，这对机械性能具有负面影响。 根据本发明，从焊料金属中去除形成脆性相的部件。 实现上述目的，由此施加第二材料，其在所述涂覆之前与所述组分反应并再次被所述脆性相除去。
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公开(公告)号：US09144855B2
公开(公告)日：2015-09-29
申请号：US13133967
申请日：2009-11-19
申请人： Reiner Anton , Brigitte Heinecke , Michael Ott , Christian Ressel
发明人： Reiner Anton , Brigitte Heinecke , Michael Ott , Christian Ressel
IPC分类号： B32B3/26 , B32B3/30 , B32B15/00 , B32B15/01 , F01D5/00 , B23K1/00 , F16B5/00 , B23K3/08 , B23K26/03 , B23K26/20 , B23K26/30 , B23K37/06
CPC分类号： B23K1/0018 , B23K3/08 , B23K26/03 , B23K26/211 , B23K26/702 , B23K37/06 , B23K2101/001 , B32B3/26 , B32B3/30 , B32B15/00 , B32B15/01 , F01D5/005 , F05D2230/22 , F05D2230/237 , F05D2250/131 , F05D2250/70 , F05D2260/36 , Y02T50/67 , Y10T428/12229 , Y10T428/12361 , Y10T428/12375 , Y10T428/12382 , Y10T428/12479 , Y10T428/12486 , Y10T428/12493 , Y10T428/12931 , Y10T428/12944 , Y10T428/249953 , Y10T428/249981
摘要： The use of pre-sintered soldering plates, referred to as PSPs, frequently proceeds without a continuous, cohesive soldering connection between individual grains in the sinter material and between the sinter and base material. A process soldering of prefabricated, perforated, porous or drilled plates or porous, spongy, laminar material that, can be laid full-surfaced on a base element as a plurality of tiles or as individual porous, drilled or perforated inlay elements designed contour-close on a recess in the base material is provided. To this end, the selected plate materials can be mechanically equal to the base material or otherwise set off for the particular requirements of the component insert. The solder can be offset by specific diffusible, melting-point-lowering components. A mold that has an open, continuous porosity so that melted or fluid solder can flow through from the one surface to the other surface is also provided.
摘要翻译： 使用被称为PSP的预烧结焊盘经常在烧结材料中的各个晶粒之间以及烧结体和基底材料之间没有连续的，内聚的焊接连接的情况下进行。 预制的，穿孔的，多孔的或钻孔的板或多孔的，海绵状的层状材料的工艺焊接，其可以作为多个瓷砖或作为单独的多孔，钻孔或穿孔的嵌入元件全面地铺在基底元件上，设计成轮廓关闭 设置在基材的凹部上。 为此，所选择的板材可以机械地等于基材，或者为了组件插入件的特定要求而被去掉。 焊料可以被特定的可扩散，熔点降低的部件抵消。 还提供了一种具有开放，连续的孔隙度使得熔融或流体焊料可以从一个表面流过到另一个表面的模具。
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公开(公告)号：US08017250B2
公开(公告)日：2011-09-13
申请号：US12758080
申请日：2010-04-12
申请人： Reiner Anton , Christian Bähr , Brigitte Heinecke , Michael Ott
发明人： Reiner Anton , Christian Bähr , Brigitte Heinecke , Michael Ott
IPC分类号： B32B15/04
CPC分类号： B23P6/007 , C23C4/02 , C23C26/00 , C23C28/021 , C23C28/022 , C23C28/023 , C23C28/028 , C23C28/321 , C23C28/3215 , C23C28/322 , C23C28/3455 , C23C28/36 , F01D5/005 , F05D2230/80 , F05D2230/90 , Y10T428/12389 , Y10T428/12576 , Y10T428/12847 , Y10T428/12931 , Y10T428/24273
摘要： Conventionally, cavities and cracks are filled with a solder metal which forms brittle phases with a subsequently applied coating, which have a negative effect on the mechanical properties. According to the invention, the components which form brittle phases are removed from the solder metal. The above is achieved, whereby a second material is applied which reacts with said component and which is removed again with the brittle phases, before the coating.
摘要翻译： 通常，空穴和裂纹填充有随后施加的涂层形成脆性相的焊料金属，这对机械性能具有负面影响。 根据本发明，从焊料金属中去除形成脆性相的部件。 实现上述目的，由此施加第二材料，其在所述涂覆之前与所述组分反应并再次被所述脆性相除去。
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公开(公告)号：US20070059486A1
公开(公告)日：2007-03-15
申请号：US10574722
申请日：2004-09-15
申请人： Reiner Anton , Christian Bahr , Brigitte Heinecke , Michael Ott
发明人： Reiner Anton , Christian Bahr , Brigitte Heinecke , Michael Ott
CPC分类号： B23P6/007 , C23C4/02 , C23C26/00 , C23C28/021 , C23C28/022 , C23C28/023 , C23C28/028 , C23C28/321 , C23C28/3215 , C23C28/322 , C23C28/3455 , C23C28/36 , F01D5/005 , F05D2230/80 , F05D2230/90 , Y10T428/12389 , Y10T428/12576 , Y10T428/12847 , Y10T428/12931 , Y10T428/24273
摘要： Conventionally, cavities and cracks are filled with a solder metal which forms brittle phases with a subsequently applied coating, which have a negative effect on the mechanical properties. According to the invention, the components which form brittle phases are removed from the solder metal. The above is achieved, whereby a second material is applied which reacts with said component and which is removed again with the brittle phases, before the coating.
摘要翻译： 通常，空穴和裂纹填充有随后施加的涂层形成脆性相的焊料金属，这对机械性能具有负面影响。 根据本发明，从焊料金属中去除形成脆性相的部件。 实现上述目的，由此施加第二材料，其在所述涂覆之前与所述组分反应并再次被所述脆性相除去。
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公开(公告)号：US07946471B2
公开(公告)日：2011-05-24
申请号：US12525588
申请日：2007-02-06
申请人： Brigitte Heinecke , Volker Vosberg
发明人： Brigitte Heinecke , Volker Vosberg
IPC分类号： B23K31/00
CPC分类号： B23K35/0244 , B23K35/30 , B23K35/304
摘要： A brazing composition for the brazing of superalloys including a base material with at least one initial phase is provided. The initial phase has a solidus temperature that is below the solidus temperature of the base material and, above a certain temperature, forms with the base material and/or with at least one further initial phase at least one resultant phase, the solidus temperature of which is higher that the solidus temperature of the initial phases. Heat treatment takes place in two stages, wherein the temperature of the second heat treatment is preferably 800-1200° C. The brazing composition may likewise be of the type MCrAlX, and the power particles of the initial phase may be in the form of nanoparticles.
摘要翻译： 提供了一种用于包含具有至少一个初始相的基材的超级合金钎焊的钎焊组合物。 初始相的固相线温度低于基体材料的固相线温度，高于一定温度，与基体材料形成，和/或与至少一个另外的初始相位形成至少一个所得相，其固相线温度为 高于初始相的固相线温度。 热处理分两个阶段进行，其中第二次热处理的温度优选为800-1200℃。钎焊组合物同样可以是MCrAlX型，并且初始相的功率粒子可以是纳米颗粒的形式 。
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公开(公告)号：US20110154947A1
公开(公告)日：2011-06-30
申请号：US13043864
申请日：2011-03-09
申请人： Brigitte Heinecke , Volker Vosberg
发明人： Brigitte Heinecke , Volker Vosberg
CPC分类号： B23K35/0244 , B23K35/30 , B23K35/304
摘要： A brazing composition for the brazing of superalloys including a base material with at least one initial phase is provided. The initial phase has a solidus temperature that is below the solidus temperature of the base material and, above a certain temperature, forms with the base material and/or with at least one further initial phase at least one resultant phase, the solidus temperature of which is higher that the solidus temperature of the initial phases. Heat treatment takes place in two stages, wherein the temperature of the second heat treatment is preferably 800-1200° C. The brazing composition may likewise be of the type MCrAlX, and the power particles of the initial phase may be in the form of nanoparticles.
摘要翻译： 提供了一种用于包含具有至少一个初始相的基材的超级合金钎焊的钎焊组合物。 初始相的固相线温度低于基体材料的固相线温度，高于一定温度，与基体材料形成，和/或与至少一个另外的初始相位形成至少一个所得相，其固相线温度为 高于初始相的固相线温度。 热处理分两个阶段进行，其中第二次热处理的温度优选为800-1200℃。钎焊组合物同样可以是MCrAlX型，并且初始相的功率粒子可以是纳米颗粒的形式 。
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公开(公告)号：US20100224600A1
公开(公告)日：2010-09-09
申请号：US12716465
申请日：2010-03-03
CPC分类号： B23K15/0086 , B23K26/32 , B23K26/342 , B23K35/0255 , B23K2101/001 , B23K2103/26 , B23K2103/50 , B23P6/005 , B23P6/007 , F01D5/005 , F05D2230/233 , Y02T50/67
摘要： A welding process is provided. The welding process includes two steps. First, the welding material is applied over a large area of the substrate in the region without melting or partially melting the welding material. Then, a welding device is used to melt the applied welding material. In addition the welding material may be applied in two applications where the second application of the welding material is applied over a large area of the first application of molten and solidified welding material. Then, the second application of the welding material is melted.
摘要翻译： 提供焊接工艺。 焊接过程包括两个步骤。 首先，将焊接材料施加在区域的大面积基板上，而不熔化或部分熔化焊接材料。 然后，使用焊接装置来熔化所施加的焊接材料。 此外，焊接材料可以应用在两种应用中，其中焊接材料的第二次涂覆施加在熔融和固化的焊接材料的第一次施加的大面积上。 然后，焊接材料的第二次施加被熔化。
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公开(公告)号：US08123105B2
公开(公告)日：2012-02-28
申请号：US12743440
申请日：2008-11-11
CPC分类号： B23K1/0018 , B23K1/19 , B23K2101/001
摘要： A method for repairing wider gaps in a substrate of a component by brazing at a brazing temperature is provided. Filler material and solder are prevented from separating in that, in a two-stage process, first the filler material and then the solder are applied to the wider gap. The powder does not melt at the brazing temperature and the filler metal does melt at the brazing temperature.
摘要翻译： 提供了通过在钎焊温度下钎焊来修复部件的基板中较宽间隙的方法。 防止填料和焊料分离，因为在两阶段工艺中，首先将填充材料，然后将焊料施加到更宽的间隙。 该粉末在钎焊温度下不熔化，并且填料金属在钎焊温度下熔化。
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