-
公开(公告)号：US20100192589A1
公开(公告)日：2010-08-05
申请号：US12758080
申请日：2010-04-12
申请人： Reiner Anton , Christian Bähr , Brigitte Heinecke , Michael Ott
发明人： Reiner Anton , Christian Bähr , Brigitte Heinecke , Michael Ott
CPC分类号： B23P6/007 , C23C4/02 , C23C26/00 , C23C28/021 , C23C28/022 , C23C28/023 , C23C28/028 , C23C28/321 , C23C28/3215 , C23C28/322 , C23C28/3455 , C23C28/36 , F01D5/005 , F05D2230/80 , F05D2230/90 , Y10T428/12389 , Y10T428/12576 , Y10T428/12847 , Y10T428/12931 , Y10T428/24273
摘要： Conventionally, cavities and cracks are filled with a solder metal which forms brittle phases with a subsequently applied coating, which have a negative effect on the mechanical properties. According to the invention, the components which form brittle phases are removed from the solder metal. The above is achieved, whereby a second material is applied which reacts with said component and which is removed again with the brittle phases, before the coating.
摘要翻译： 通常，空穴和裂纹填充有随后施加的涂层形成脆性相的焊料金属，这对机械性能具有负面影响。 根据本发明，从焊料金属中去除形成脆性相的部件。 实现上述目的，由此施加第二材料，其在所述涂覆之前与所述组分反应并再次被所述脆性相除去。
-
公开(公告)号：US08017250B2
公开(公告)日：2011-09-13
申请号：US12758080
申请日：2010-04-12
申请人： Reiner Anton , Christian Bähr , Brigitte Heinecke , Michael Ott
发明人： Reiner Anton , Christian Bähr , Brigitte Heinecke , Michael Ott
IPC分类号： B32B15/04
CPC分类号： B23P6/007 , C23C4/02 , C23C26/00 , C23C28/021 , C23C28/022 , C23C28/023 , C23C28/028 , C23C28/321 , C23C28/3215 , C23C28/322 , C23C28/3455 , C23C28/36 , F01D5/005 , F05D2230/80 , F05D2230/90 , Y10T428/12389 , Y10T428/12576 , Y10T428/12847 , Y10T428/12931 , Y10T428/24273
摘要： Conventionally, cavities and cracks are filled with a solder metal which forms brittle phases with a subsequently applied coating, which have a negative effect on the mechanical properties. According to the invention, the components which form brittle phases are removed from the solder metal. The above is achieved, whereby a second material is applied which reacts with said component and which is removed again with the brittle phases, before the coating.
摘要翻译： 通常，空穴和裂纹填充有随后施加的涂层形成脆性相的焊料金属，这对机械性能具有负面影响。 根据本发明，从焊料金属中去除形成脆性相的部件。 实现上述目的，由此施加第二材料，其在所述涂覆之前与所述组分反应并再次被所述脆性相除去。
-
公开(公告)号：US07736700B2
公开(公告)日：2010-06-15
申请号：US10574722
申请日：2004-09-15
申请人： Reiner Anton , Christian Báhr , Brigitte Heinecke , Michael Ott
发明人： Reiner Anton , Christian Báhr , Brigitte Heinecke , Michael Ott
IPC分类号： B05D3/02
CPC分类号： B23P6/007 , C23C4/02 , C23C26/00 , C23C28/021 , C23C28/022 , C23C28/023 , C23C28/028 , C23C28/321 , C23C28/3215 , C23C28/322 , C23C28/3455 , C23C28/36 , F01D5/005 , F05D2230/80 , F05D2230/90 , Y10T428/12389 , Y10T428/12576 , Y10T428/12847 , Y10T428/12931 , Y10T428/24273
摘要： Conventionally, cavities and cracks are filled with a solder metal which forms brittle phases with a subsequently applied coating, which have a negative effect on the mechanical properties. According to the invention, the components which form brittle phases are removed from the solder metal. The above is achieved, whereby a second material is applied which reacts with said component and which is removed again with the brittle phases, before the coating.
摘要翻译： 通常，空穴和裂纹填充有随后施加的涂层形成脆性相的焊料金属，这对机械性能具有负面影响。 根据本发明，从焊料金属中去除形成脆性相的部件。 实现上述目的，由此施加第二材料，其在所述涂覆之前与所述组分反应并再次被所述脆性相除去。
-
公开(公告)号：US09144855B2
公开(公告)日：2015-09-29
申请号：US13133967
申请日：2009-11-19
申请人： Reiner Anton , Brigitte Heinecke , Michael Ott , Christian Ressel
发明人： Reiner Anton , Brigitte Heinecke , Michael Ott , Christian Ressel
IPC分类号： B32B3/26 , B32B3/30 , B32B15/00 , B32B15/01 , F01D5/00 , B23K1/00 , F16B5/00 , B23K3/08 , B23K26/03 , B23K26/20 , B23K26/30 , B23K37/06
CPC分类号： B23K1/0018 , B23K3/08 , B23K26/03 , B23K26/211 , B23K26/702 , B23K37/06 , B23K2101/001 , B32B3/26 , B32B3/30 , B32B15/00 , B32B15/01 , F01D5/005 , F05D2230/22 , F05D2230/237 , F05D2250/131 , F05D2250/70 , F05D2260/36 , Y02T50/67 , Y10T428/12229 , Y10T428/12361 , Y10T428/12375 , Y10T428/12382 , Y10T428/12479 , Y10T428/12486 , Y10T428/12493 , Y10T428/12931 , Y10T428/12944 , Y10T428/249953 , Y10T428/249981
摘要： The use of pre-sintered soldering plates, referred to as PSPs, frequently proceeds without a continuous, cohesive soldering connection between individual grains in the sinter material and between the sinter and base material. A process soldering of prefabricated, perforated, porous or drilled plates or porous, spongy, laminar material that, can be laid full-surfaced on a base element as a plurality of tiles or as individual porous, drilled or perforated inlay elements designed contour-close on a recess in the base material is provided. To this end, the selected plate materials can be mechanically equal to the base material or otherwise set off for the particular requirements of the component insert. The solder can be offset by specific diffusible, melting-point-lowering components. A mold that has an open, continuous porosity so that melted or fluid solder can flow through from the one surface to the other surface is also provided.
摘要翻译： 使用被称为PSP的预烧结焊盘经常在烧结材料中的各个晶粒之间以及烧结体和基底材料之间没有连续的，内聚的焊接连接的情况下进行。 预制的，穿孔的，多孔的或钻孔的板或多孔的，海绵状的层状材料的工艺焊接，其可以作为多个瓷砖或作为单独的多孔，钻孔或穿孔的嵌入元件全面地铺在基底元件上，设计成轮廓关闭 设置在基材的凹部上。 为此，所选择的板材可以机械地等于基材，或者为了组件插入件的特定要求而被去掉。 焊料可以被特定的可扩散，熔点降低的部件抵消。 还提供了一种具有开放，连续的孔隙度使得熔融或流体焊料可以从一个表面流过到另一个表面的模具。
-
公开(公告)号：US20070059486A1
公开(公告)日：2007-03-15
申请号：US10574722
申请日：2004-09-15
申请人： Reiner Anton , Christian Bahr , Brigitte Heinecke , Michael Ott
发明人： Reiner Anton , Christian Bahr , Brigitte Heinecke , Michael Ott
CPC分类号： B23P6/007 , C23C4/02 , C23C26/00 , C23C28/021 , C23C28/022 , C23C28/023 , C23C28/028 , C23C28/321 , C23C28/3215 , C23C28/322 , C23C28/3455 , C23C28/36 , F01D5/005 , F05D2230/80 , F05D2230/90 , Y10T428/12389 , Y10T428/12576 , Y10T428/12847 , Y10T428/12931 , Y10T428/24273
摘要： Conventionally, cavities and cracks are filled with a solder metal which forms brittle phases with a subsequently applied coating, which have a negative effect on the mechanical properties. According to the invention, the components which form brittle phases are removed from the solder metal. The above is achieved, whereby a second material is applied which reacts with said component and which is removed again with the brittle phases, before the coating.
摘要翻译： 通常，空穴和裂纹填充有随后施加的涂层形成脆性相的焊料金属，这对机械性能具有负面影响。 根据本发明，从焊料金属中去除形成脆性相的部件。 实现上述目的，由此施加第二材料，其在所述涂覆之前与所述组分反应并再次被所述脆性相除去。
-
6.发明申请公开(公告)号：US20090107003A1
公开(公告)日：2009-04-30
申请号：US12083753
申请日：2006-10-06
申请人： Brigitte Heinecke , Michael Ott
发明人： Brigitte Heinecke , Michael Ott
IPC分类号： F26B3/00
CPC分类号： F01D5/005 , C23G5/00 , F01D25/002 , Y02T50/67
摘要： There is described a method for cleaning components that comprise cracks that are polluted with oxides, in particular gas turbine part. In said method, the components to be cleaned are exposed in a cleaning chamber at high temperature to a cleaning gas containing gaseous halogen compounds, which ionize to form halide ions. A cleaning gas is used containing 18 to 30% by volume hydrogen halide.
摘要翻译： 描述了一种用于清洁包含被氧化物，特别是燃气轮机部分污染的裂纹的部件的方法。 在所述方法中，要清洁的部件在高温清洗室中暴露于含有气态卤素化合物的清洁气体，该气态卤素化合物电离以形成卤离子。 使用含有18至30体积％卤化氢的清洁气体。
-
公开(公告)号：US20110244264A1
公开(公告)日：2011-10-06
申请号：US13133967
申请日：2009-11-19
CPC分类号： B23K1/0018 , B23K3/08 , B23K26/03 , B23K26/211 , B23K26/702 , B23K37/06 , B23K2101/001 , B32B3/26 , B32B3/30 , B32B15/00 , B32B15/01 , F01D5/005 , F05D2230/22 , F05D2230/237 , F05D2250/131 , F05D2250/70 , F05D2260/36 , Y02T50/67 , Y10T428/12229 , Y10T428/12361 , Y10T428/12375 , Y10T428/12382 , Y10T428/12479 , Y10T428/12486 , Y10T428/12493 , Y10T428/12931 , Y10T428/12944 , Y10T428/249953 , Y10T428/249981
摘要： The use of pre-sintered soldering plates, referred to as PSPs, frequently proceeds without a continuous, cohesive soldering connection between individual grains in the sinter material and between the sinter and base material. A process soldering of prefabricated, perforated, porous or drilled plates or porous, spongy, laminar material that, can be laid full-surfaced on a base element as a plurality of tiles or as individual porous, drilled or perforated inlay elements designed contour-close on a recess in the base material is provided. To this end, the selected plate materials can be mechanically equal to the base material or otherwise set off for the particular requirements of the component insert. The solder can be offset by specific diffusible, melting-point-lowering components. A mould that has an open, continuous porosity so that melted or fluid solder can flow through from the one surface to the other surface is also provided.
摘要翻译： 使用被称为PSP的预烧结焊盘经常在烧结材料中的各个晶粒之间以及烧结体和基底材料之间没有连续的，内聚的焊接连接的情况下进行。 预制的，穿孔的，多孔的或钻孔的板或多孔的海绵状层状材料的工艺焊接，其可以作为多个瓷砖或作为单独的多孔，钻孔或穿孔的嵌入元件全面地铺设在基底元件上，设计成轮廓关闭 设置在基材的凹部上。 为此，所选择的板材可以机械地等于基材，或者为了组件插入件的特定要求而被去掉。 焊料可以被特定的可扩散，熔点降低的部件抵消。 还提供了一种具有开放，连续的孔隙度使得熔融或流体焊料可以从一个表面流过到另一个表面的模具。
-
8.发明授权Method and device for welding workpieces made of high-temperature resistant super alloys 有权用于焊接由耐高温超合金制成的工件的方法和装置公开(公告)号：US09347318B2
公开(公告)日：2016-05-24
申请号：US12994899
申请日：2008-11-25
申请人： Nikolai Arjakine , Georg Bostanjoglo , Bernd Burbaum , Andres Gasser , Torsten Jambor , Stefanie Linnenbrink , Torsten Melzer-Jokisch , Michael Ott , Norbert Pirch , Rolf Wilkenhöner
发明人： Nikolai Arjakine , Georg Bostanjoglo , Bernd Burbaum , Andres Gasser , Torsten Jambor , Stefanie Linnenbrink , Torsten Melzer-Jokisch , Michael Ott , Norbert Pirch , Rolf Wilkenhöner
CPC分类号： F01D5/005 , B23K26/144 , B23K26/32 , B23K26/342 , B23K35/007 , B23K2101/001 , B23K2103/08 , B23K2103/26 , F05D2230/232 , F05D2230/31 , F05D2230/80 , Y02T50/67 , Y02T50/671
摘要： A method of welding workpieces of high-temperature superalloys is provided. Welding filler is applied in a plurality of layers to a surface of the workpiece via a heat input zone and a supply zone for supplying the welding filler into the heat input zone. The heat input zone and the supply zone on the one hand and the workpiece surface on the other hand are moved in relation to one another. A polycrystalline weld seam is generated by remelting a previously applied layer of the plurality of layers. Welding parameters are chosen such that a cooling rate during a solidifying of the material is at least 8000 Kelvins per second. Further, a welding apparatus for carrying out such a method is provided.
摘要翻译： 提供了一种焊接高温超合金工件的方法。 焊接填料通过热输入区域和用于将焊接填料供应到热输入区域的供应区域以多层施加到工件的表面。 另一方面，热输入区域和供给区域以及工件表面彼此相对移动。 通过重新熔化多个层的先前施加的层来产生多晶焊缝。 选择焊接参数使得材料固化期间的冷却速率为至少8000Kelvins /秒。 此外，提供了一种用于执行这种方法的焊接装置。
-
9.发明申请REPAIR CHAIN FOR TURBOMACHINERY COMPONENTS USING ADDITIVE MANUFACTURING TECHNOLOGY 审中-公开使用添加剂制造技术的涡轮机组件维修链公开(公告)号：US20150047168A1
公开(公告)日：2015-02-19
申请号：US13965314
申请日：2013-08-13
申请人： Allister William James , Jan Münzer , Michael Ott
发明人： Allister William James , Jan Münzer , Michael Ott
CPC分类号： B23P6/007 , B23K2101/001 , B23P6/00 , B23P6/005 , F01D5/005 , F05D2220/31 , F05D2240/80 , Y10T29/49734 , Y10T29/53013
摘要： In a method for repairing a machinery component, one or more defects are detected on the machinery component. At least one portion of the component is removed, wherein the at least one portion includes at least one of the one or more defects. One or more data points are determined for at least one slot, wherein the at least one slot is created by removing the at least one portion of the component. At least one repair coupon is generated from the one or more data points. The at least one repair coupon is attached with the at least one slot.
摘要翻译： 在修理机械部件的方法中，在机械部件上检测到一个以上的缺陷。 部件的至少一部分被去除，其中至少一个部分包括一个或多个缺陷中的至少一个。 确定至少一个时隙的一个或多个数据点，其中通过去除组件的至少一个部分来创建所述至少一个时隙。 从一个或多个数据点生成至少一个修复券。 所述至少一个修复券与所述至少一个槽连接。
-
10.发明授权Process for repairing a component comprising a directional microstructure by setting a temperature gradient during the laser heat action, and a component produced by such a process 失效通过在激光加热动作期间设定温度梯度来修复包括定向微结构的部件的工艺，以及通过这种工艺制造的部件公开(公告)号：US08141769B2
公开(公告)日：2012-03-27
申请号：US11989214
申请日：2005-07-22
申请人： Michael Ott , Uwe Paul , Robert Singer , Andreas Volek
发明人： Michael Ott , Uwe Paul , Robert Singer , Andreas Volek
CPC分类号： B23P6/007 , B23K1/0018 , B23K1/002 , B23K1/0056 , B23K2101/001
摘要： In one aspect, a repair method for repairing components comprising a base material with a directed microstructure is provided. The repair is performed in such a way that the repaired location correspondingly has a directed microstructure like the surrounding base material. A solder is applied in the region of a location to be repaired and is soldered to the component via heat exposure, a temperature gradient, i.e., for instance a temperature variation from a higher temperature to a lower temperature, is thereby produced in the region of the location to be repaired.
摘要翻译： 在一个方面，提供了一种用于修复包括具有定向微结构的基材的部件的修复方法。 以这样的方式进行修复，即修理的位置相应地具有像周围的基材的定向微观结构。 在要修复的位置的区域中施加焊料，并且通过热暴露将其焊接到部件，从而在以下区域中产生温度梯度，即例如从较高温度到较低温度的温度变化 要修理的位置。
-
-
-
-
-
-
-
-
-
搜索结果
96 条记录 (耗时 0.024 秒)
