公开(公告)号：US20130049563A1

公开(公告)日：2013-02-28

申请号：US13590832

申请日：2012-08-21

申请人： Byung Mok Kim ,  Young Jun Cho ,  Yon Tae Moon ,  Su Jung Jung ,  Seo Yeon Kwon ,  Son Kyo Hwang

发明人： Byung Mok Kim ,  Young Jun Cho ,  Yon Tae Moon ,  Su Jung Jung ,  Seo Yeon Kwon ,  Son Kyo Hwang

IPC分类号： F21V29/00

CPC分类号： H01L33/62 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/642 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/12032 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： Disclosed is a light emitting device package. The light emitting device includes a package body having a cavity defined by a sidewall and a bottom surface, a light emitting device disposed in the cavity, a radiator inserted into the package body and disposed below the light emitting device, and a second electrode pattern disposed around the radiator and electrically connected to the light emitting device via wire bonding. The second electrode pattern includes a first region to which a wire is bonded, and a second region connected to the first region, and a width of the first region differs from a width of the second region.

摘要翻译： 公开了一种发光器件封装。 发光器件包括具有由侧壁和底表面限定的空腔的封装主体，设置在空腔中的发光器件，插入到封装主体中并设置在发光器件下方的散热器和设置在第二电极图案 围绕散热器并通过引线接合电连接到发光器件。 第二电极图案包括接合线的第一区域和连接到第一区域的第二区域，第一区域的宽度与第二区域的宽度不同。

公开(公告)号：US08773006B2

公开(公告)日：2014-07-08

申请号：US13590832

申请日：2012-08-21

申请人： Byung Mok Kim ,  Young Jun Cho ,  Yon Tae Moon ,  Su Jung Jung ,  Seo Yeon Kwon ,  Son Kyo Hwang

发明人： Byung Mok Kim ,  Young Jun Cho ,  Yon Tae Moon ,  Su Jung Jung ,  Seo Yeon Kwon ,  Son Kyo Hwang

IPC分类号： H01J1/02

CPC分类号： H01L33/62 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/642 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/12032 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： Disclosed is a light emitting device package. The light emitting device includes a package body having a cavity defined by a sidewall and a bottom surface, a light emitting device disposed in the cavity, a radiator inserted into the package body and disposed below the light emitting device, and a second electrode pattern disposed around the radiator and electrically connected to the light emitting device via wire bonding. The second electrode pattern includes a first region to which a wire is bonded, and a second region connected to the first region, and a width of the first region differs from a width of the second region.

摘要翻译： 公开了一种发光器件封装。 发光器件包括具有由侧壁和底表面限定的空腔的封装主体，设置在空腔中的发光器件，插入到封装主体中并设置在发光器件下方的散热器和设置在第二电极图案 围绕散热器并通过引线接合电连接到发光器件。 第二电极图案包括接合线的第一区域和连接到第一区域的第二区域，第一区域的宽度与第二区域的宽度不同。

公开(公告)号：US08704433B2

公开(公告)日：2014-04-22

申请号：US13591626

申请日：2012-08-22

申请人： Su Jung Jung ,  Yon Tae Moon ,  Young Jun Cho ,  Son Kyo Hwang ,  Byung Mok Kim ,  Seo Yeon Kwon

发明人： Su Jung Jung ,  Yon Tae Moon ,  Young Jun Cho ,  Son Kyo Hwang ,  Byung Mok Kim ,  Seo Yeon Kwon

IPC分类号： H01J1/02

CPC分类号： H01L33/641 ,  C09K11/67 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/32013 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/12032 ,  H01S5/02469 ,  H01L2924/00014 ,  H01L2924/00

摘要： Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.

摘要翻译： 实施例提供一种包括具有通孔的封装主体的发光器件封装; 布置在所述通孔中并包括具有Cu的合金层的散热器; 以及设置在散热器上的发光器件，其中所述合金层包括W或Mo中的至少一个，并且其中所述封装体包括包括侧壁和底表面的腔，并且其中所述通孔形成在所述底表面中 。

公开(公告)号：US09207389B2

公开(公告)日：2015-12-08

申请号：US13543015

申请日：2012-07-06

申请人： Yon Tae Moon ,  Hiroshi Kodaira

发明人： Yon Tae Moon ,  Hiroshi Kodaira

IPC分类号： F21V7/04 ,  F21V8/00 ,  F21V29/83 ,  H01L33/60

CPC分类号： G02B6/0073 ,  F21K9/62 ,  F21V29/70 ,  F21V29/83 ,  F21V31/005 ,  G02B6/003 ,  G02B6/0031 ,  G02B6/0068 ,  G02B6/0083 ,  G02B6/0085 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light emitting module is disclosed. The light emitting module includes a circuit board, a plurality of light emitting devices mounted on the circuit board and spaced apart from each other, molding parts wrapping the respective light emitting devices, and a reflective member disposed on the circuit board to surround the light emitting devices. The reflective member has a height greater than that of each of the molding parts. The reflective member has a plurality of openings exposing the light emitting devices, and each of the openings has a reflective side wall extending upward from the circuit board.

摘要翻译： 公开了一种发光模块。 发光模块包括电路板，安装在电路板上并彼此间隔开的多个发光器件，包封各个发光器件的成型部件和布置在电路板上的反射部件，以围绕发光 设备。 反射构件的高度大于每个成型部件的高度。 反射构件具有暴露发光器件的多个开口，并且每个开口具有从电路板向上延伸的反射侧壁。