公开(公告)号：US5825633A

公开(公告)日：1998-10-20

申请号：US740940

申请日：1996-11-05

申请人： C. Gregory Bujalski ,  Jeffrey M. Petsinger ,  Daniel T. Rooney

发明人： C. Gregory Bujalski ,  Jeffrey M. Petsinger ,  Daniel T. Rooney

IPC分类号： H05K3/34 ,  H05K3/36 ,  H05K1/11

CPC分类号： H05K3/368 ,  H01R12/523 ,  H05K2201/09063 ,  H05K2201/10893 ,  H05K3/3442

摘要： A multi-board electronic assembly (10) includes a first substrate (12) and a second substrate (14) electrically connected by a spacer (16). The spacer (16) includes a first end (26) that is received in a first receptacle (18) on the first substrate (12) and a second end (28) that is received in a second receptacle (22) in the second substrate (14). The spacer (16) is formed generally of a nonconductive body (15) and includes ridges (60) and longitudinal channels (30) defined between the ridges (60). The ridges (60) are formed generally of a nonconductive material, and the spacer (16) includes a metallic strip (32) disposed within the channel (30). The metallic strip (32) forms a conductive path to connect the first circuit trace (20) to the second circuit trace (24) to form an electrically connected microelectronic assembly (10).

摘要翻译： 多板电子组件（10）包括通过间隔件（16）电连接的第一基板（12）和第二基板（14）。 间隔件（16）包括容纳在第一基板（12）上的第一容器（18）中的第一端（26）和容纳在第二基板（22）中的第二容器（22）中的第二端 （14）。 间隔物（16）通常由非导电体（15）形成，并且包括限定在脊（60）之间的脊（60）和纵向通道（30）。 脊（60）通常由非导电材料形成，并且间隔件（16）包括设置在通道（30）内的金属条（32）。 金属条（32）形成导电路径以将第一电路迹线（20）连接到第二电路迹线（24）以形成电连接的微电子组件（10）。

公开(公告)号：US07390978B2

公开(公告)日：2008-06-24

申请号：US11021429

申请日：2004-12-23

申请人： Timothy B. Dean ,  Daniel T. Rooney ,  Jeffrey M. Petsinger

发明人： Timothy B. Dean ,  Daniel T. Rooney ,  Jeffrey M. Petsinger

IPC分类号： H01L23/28

CPC分类号： H05K3/284 ,  H01R43/24 ,  H05K1/117 ,  H05K3/0052 ,  H05K2201/09127 ,  H05K2201/10037 ,  H05K2201/10325

摘要： An overmolded electronic assembly (900, 1000, 1200) is fabricated from one or more overmoldable interface components (300, 400, 500, 1220, 1750) that may be electrical contacts or electronic components that have physical interfaces, such as speakers or sensors. The overmoldable interface components have a sacrificial end that is cut off from the remainder of the overmoldable interface components after being overmolded in an electronic assembly, providing a sealed cavity into the overmolded electronic assembly.

摘要翻译： 包覆成型的电子组件（900,1000,1200）由一个或多个包覆模制的接口部件（300,400,500,420,1750）制成，所述接口部件可以是具有诸如扬声器或传感器之类的物理接口的电触点或电子部件。 包覆模制的界面部件具有牺牲端，在电子组件中包覆成型之后，其余的可包覆模制的界面部件被切掉，从而为包覆模制的电子组件提供了一个密封腔。

公开(公告)号：US4971853A

公开(公告)日：1990-11-20

申请号：US190020

申请日：1988-05-04

申请人： Joseph Chaiken ,  Daniel T. Rooney ,  David F. Negrotti ,  Daniel J. Macero

发明人： Joseph Chaiken ,  Daniel T. Rooney ,  David F. Negrotti ,  Daniel J. Macero

IPC分类号： C23C16/04 ,  C23C16/18 ,  C23C16/56 ,  G01N27/30

CPC分类号： G01N27/305 ,  C23C16/047 ,  C23C16/18 ,  C23C16/56 ,  Y10T428/24612 ,  Y10T428/265 ,  Y10T428/31678

摘要： A thin platinum film which is both conductive and transparent is produced by laser chemical vapor deposition of a suitable organometallic compound, such as allyl cyclopentadienyl platinum. After deposition, the film is annealed to increase the relative abundance of platinum with respect to carbon. The film can be further conditioned by electrically cycling the same in a bath of sulfuric acid.

摘要翻译： 导电和透明的薄铂膜通过激光化学气相沉积合成的有机金属化合物如烯丙基环戊二烯基铂制备。 沉积后，将膜退火以提高铂相对于碳的相对丰度。 可以通过将其在硫酸浴中电循环来进一步调节膜。

公开(公告)号：US07434310B2

公开(公告)日：2008-10-14

申请号：US11422233

申请日：2006-06-05

申请人： Timothy B. Dean ,  Bruce C. Deemer ,  Daniel T. Rooney

发明人： Timothy B. Dean ,  Bruce C. Deemer ,  Daniel T. Rooney

IPC分类号： H05K3/02

CPC分类号： H01L23/3128 ,  H01L21/56 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  Y10T29/49149 ,  Y10T29/49156 ,  Y10T29/49716 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A process for reforming a plastic packaged integrated circuit die (100) includes grinding away (305) a bottom side (210) of a plastic package (205) and portions of a set of leads (110) that are in the plane of the grinding until a bottom surface (240) of an inner portion (230) of the set of leads is exposed at a peripheral region (235) of the inner portion, cutting (310) approximately perpendicularly to the top and bottom sides to remove portions of the plastic package and the set of leads that are outside the inner portion of the set of leads, and adapting (320) the bottom surfaces of the inner portion of the set of leads for reliable electrical connections.

摘要翻译： 重塑塑料封装集成电路管芯（100）的方法包括：研磨（305）塑料封装（205）的底侧（210）和位于研磨平面内的一组引线（110）的部分 直到所述一组引线的内部部分（230）的底表面（240）在所述内部部分的周边区域（235）处露出，所述切割（310）大致垂直于所述顶部和底部侧面以去除所述部分 塑料封装和引线组，该组引线位于该组引线的内部部分之外，并适配（320）该组引线的内部部分的底表面以进行可靠的电连接。

公开(公告)号：US20070278676A1

公开(公告)日：2007-12-06

申请号：US11422233

申请日：2006-06-05

申请人： Timothy B. Dean ,  Bruce C. Deemer ,  Daniel T. Rooney

发明人： Timothy B. Dean ,  Bruce C. Deemer ,  Daniel T. Rooney

IPC分类号： H01L23/48 ,  H05K1/16

CPC分类号： H01L23/3128 ,  H01L21/56 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  Y10T29/49149 ,  Y10T29/49156 ,  Y10T29/49716 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A process for reforming a plastic packaged integrated circuit die (100) includes grinding away (305) a bottom side (210) of a plastic package (205) and portions of a set of leads (110) that are in the plane of the grinding until a bottom surface (240) of an inner portion (230) of the set of leads is exposed at a peripheral region (235) of the inner portion, cutting (310) approximately perpendicularly to the top and bottom sides to remove portions of the plastic package and the set of leads that are outside the inner portion of the set of leads, and adapting (320) the bottom surfaces of the inner portion of the set of leads for reliable electrical connections.

摘要翻译： 重塑塑料封装集成电路管芯（100）的方法包括：研磨（305）塑料封装（205）的底侧（210）和位于研磨平面内的一组引线（110）的部分 直到所述一组引线的内部部分（230）的底表面（240）在所述内部部分的周边区域（235）处露出，所述切割（310）大致垂直于所述顶部和底部侧面以去除所述部分 塑料封装和引线组，该组引线位于该组引线的内部部分之外，并适配（320）该组引线的内部部分的底表面以进行可靠的电连接。