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公开(公告)号：US20090194308A1
公开(公告)日：2009-08-06
申请号：US12141229
申请日：2008-06-18
IPC分类号： H05K5/00
CPC分类号： B32B15/01 , H05K5/04 , Y10T428/31678
摘要： A metal housing (10) includes a base (110) and an outer layer (120). The base is made of a thin metal plate. The outer layer includes a plurality of first sections (121) and second sections (122). The material of the first sections is different from that of the second sections. The first sections and the second sections are arranged on the base in an interleaving manner.
摘要翻译： 金属外壳（10）包括基座（110）和外层（120）。 基座由薄金属板制成。 外层包括多个第一部分（121）和第二部分（122）。 第一部分的材料与第二部分的材料不同。 第一部分和第二部分以交错方式布置在基部上。
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公开(公告)号：US20090197116A1
公开(公告)日：2009-08-06
申请号：US12141227
申请日：2008-06-18
IPC分类号： B32B15/01
CPC分类号： B32B15/012 , B32B15/01 , B32B15/013 , B32B15/017 , H05K9/0088 , Y10T428/12743 , Y10T428/12806
摘要： A metal housing (10) includes a first metal layer (11) and a second metal layer (12). The material of the first metal layer is selected from the group consisting of stainless steel, titanium and titanium alloy. The material of the second metal layer is selected from the group consisting of aluminum, aluminum alloy and magnesium alloy. The second metal layer is integrally formed with the first metal layer.
摘要翻译： 金属壳体（10）包括第一金属层（11）和第二金属层（12）。 第一金属层的材料选自不锈钢，钛和钛合金。 第二金属层的材料选自铝，铝合金和镁合金。 第二金属层与第一金属层一体形成。
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公开(公告)号：US20110183091A1
公开(公告)日：2011-07-28
申请号：US12908969
申请日：2010-10-21
申请人： YONG-GANG ZHU , DA-WEI DING , GUI-YUN YANG , XIN-WU GUAN , CHAO-HSUN LIN , WU-ZHENG OU
发明人： YONG-GANG ZHU , DA-WEI DING , GUI-YUN YANG , XIN-WU GUAN , CHAO-HSUN LIN , WU-ZHENG OU
CPC分类号： C23C30/00 , C23C4/01 , C23C4/02 , C23C4/18 , Y10T428/1317
摘要： A housing for an electronic device includes a metal substrate and a ceramic coating directly formed on at least portions of the substrate, the coated portions of the substrate having a rough surface. A method for fabricating the housing comprises roughening predetermined portions of the substrate; thermally spraying a ceramic coating on the roughened portions of the substrate, fixing the substrate on a tool having cold water circularly running there within during the thermal spraying; and grinding and polishing the ceramic coating.
摘要翻译： 用于电子设备的外壳包括金属基底和直接形成在基底的至少部分上的陶瓷涂层，所述基底的涂覆部分具有粗糙表面。 一种用于制造壳体的方法包括使基底的预定部分粗糙化; 将陶瓷涂层热喷涂在基材的粗糙部分上，在热喷涂期间将基材固定在其上循环冷却的工具上; 并研磨和抛光陶瓷涂层。
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公开(公告)号：US20100028709A1
公开(公告)日：2010-02-04
申请号：US12275315
申请日：2008-11-21
申请人： BIN LI , CHAO-HSUN LIN , JEN-LUNG HUANG , XIAN-LIANG LIU , GUI-YUN YANG
发明人： BIN LI , CHAO-HSUN LIN , JEN-LUNG HUANG , XIAN-LIANG LIU , GUI-YUN YANG
IPC分类号： B32B7/06
CPC分类号： H04M1/0283 , Y10T428/12444 , Y10T428/12486 , Y10T428/12639 , Y10T428/12993
摘要： An exemplary housing of electronic device includes a metallic main body and a metallic three-dimensional weaving member formed on at least a part of a surface of the metallic main body. An electronic device using the housing is also provided. The housing of the electronic device has a textured touching feeling.
摘要翻译： 电子设备的示例性壳体包括形成在金属主体的表面的至少一部分上的金属主体和金属三维编织构件。 还提供了使用该外壳的电子设备。 电子设备的外壳具有纹理触感。
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公开(公告)号：US20110050055A1
公开(公告)日：2011-03-03
申请号：US12755495
申请日：2010-04-07
申请人： YONG-GANG ZHU , DA-WEI DING , XIN-WU GUAN , CHAO-HSUN LIN
发明人： YONG-GANG ZHU , DA-WEI DING , XIN-WU GUAN , CHAO-HSUN LIN
CPC分类号： H05K5/0243
摘要： A method for making a device housing comprises: providing a metal substrate; etching grooves on a portion of the surface of the metal substrate; forming a metallic coating on the surface of the metal substrate and in the grooves; and removing the metallic coating formed on the surface of the metal substrate not comprising the grooves. A device housing made by the method is also described there.
摘要翻译： 一种用于制造装置壳体的方法包括：提供金属基板; 在所述金属基板的表面的一部分上蚀刻凹槽; 在金属基板的表面和沟槽中形成金属涂层; 并且除去形成在不包括槽的金属基板的表面上的金属涂层。 还描述了通过该方法制造的装置壳体。
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公开(公告)号：US20100020295A1
公开(公告)日：2010-01-28
申请号：US12503922
申请日：2009-07-16
申请人： GUI-YUN YANG , JEN-LUNG HUANG , CHAO-HSUN LIN , BIN LI , RUI LIU
发明人： GUI-YUN YANG , JEN-LUNG HUANG , CHAO-HSUN LIN , BIN LI , RUI LIU
IPC分类号： G03B29/00
CPC分类号： H04M1/0283 , B44C3/025 , G03F7/2014
摘要： A method to fabricate a pattern on a housing, includes following steps: placing a film having a first lightproof area and a first light-transmissible area on a housing having light-sensitive inks formed in surface; radiating light on the film and light passing through the light-transmissible area and solidifying the light-sensitive inks; removing the film from the housing and cleaning the un-solidified light-sensitive inks; wiredrawing first wires in the housing and forming first wires in exposed area correspondingly; covering part of the first wires and wiredrawing second wires, the second wires crosses with part of the first wires.
摘要翻译： 一种在壳体上制造图案的方法，包括以下步骤：将具有第一防光区域和第一透光区域的膜放置在具有形成在表面上的感光油墨的壳体上; 在薄膜上照射光，通过光透射区域并固化感光墨; 从外壳中取出薄膜并清洁未固化的感光油墨; 在外壳中拉丝第一线，并相应地在暴露区域形成第一线; 覆盖部分第一线和拉丝第二线，第二线与第一线的一部分交叉。
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公开(公告)号：US20120324976A1
公开(公告)日：2012-12-27
申请号：US13308660
申请日：2011-12-01
申请人： LI LONG , CHAO-HSUN LIN
发明人： LI LONG , CHAO-HSUN LIN
摘要： A method of forging aluminum/aluminum alloys includes: providing an aluminum/aluminum alloy billet; providing a forging die, the forging die including an upper die and a lower die, the upper die and the lower die being all mounted with heating element and temperature controller; locating the aluminum/aluminum alloy billet in the forging die; heating the upper die and the lower die and making the temperature difference between the upper die and the lower die be about 100° C.-350° C.; forging the aluminum/aluminum alloy billet to get an aluminum/aluminum alloy forged piece, the temperature difference between the upper die and the lower die being kept at about 100° C.-350° C. during the forging process; and opening the upper die and the lower die to remove out the aluminum/aluminum alloy forged piece.
摘要翻译： 铝/铝合金锻造方法包括：提供铝/铝合金坯料; 提供锻模，所述锻模包括上模和下模，所述上模和下模全部安装有加热元件和温度控制器; 将铝/铝合金坯料定位在锻造模具中; 加热上模和下模，使上模与下模之间的温度差约为100℃-350℃。 锻造铝/铝合金坯料得到铝/铝合金锻件，锻模过程中上模和下模之间的温差保持在约100℃-350℃; 并打开上模和下模以除去铝/铝合金锻件。
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公开(公告)号：US20110234063A1
公开(公告)日：2011-09-29
申请号：US12909949
申请日：2010-10-22
申请人： BIN LI , KAI SHI , CHAO-HSUN LIN
发明人： BIN LI , KAI SHI , CHAO-HSUN LIN
CPC分类号： B23K26/244 , B23K2103/05 , B23K2103/10 , B23K2103/14 , B23K2103/15 , B23K2103/18 , B23K2103/20 , B23K2103/24 , B23K2103/42 , Y10T29/49826 , Y10T29/49833
摘要： A housing of electronic device includes a main plate and a metal peripheral wall, the peripheral wall is fabricated by cold drawn and secured to the periphery of the main plate.
摘要翻译： 电子装置的壳体包括主板和金属周壁，周壁通过冷拉制成并固定到主板的周边。
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公开(公告)号：US20100055419A1
公开(公告)日：2010-03-04
申请号：US12486018
申请日：2009-06-17
申请人： FEI WU , XIAN-LIANG LIU , HONG-BING ZHANG , CHAO-HSUN LIN , JEN-LUNG HUANG
发明人： FEI WU , XIAN-LIANG LIU , HONG-BING ZHANG , CHAO-HSUN LIN , JEN-LUNG HUANG
CPC分类号： B44C1/228 , Y10T428/24893
摘要： A housing with a three dimensional pattern coating includes a substrate, a powder coated layer formed on the substrate, the powder coated layer having plural grooves therein; and a pattern coating formed in the grooves. A method for making the housing comprises: providing a substrate; painting a powder coated layer onto the substrate; etching the powder coated layer to form plural grooves; filling the grooves with a colloidal solution.
摘要翻译： 具有三维图案涂层的壳体包括基底，形成在基底上的粉末涂层，其中具有多个凹槽的粉末涂层; 以及形成在凹槽中的图案涂层。 一种用于制造壳体的方法包括：提供基底; 将粉末涂层涂在基材上; 蚀刻粉末涂层以形成多个凹槽; 用胶体溶液填充凹槽。
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公开(公告)号：US20110036967A1
公开(公告)日：2011-02-17
申请号：US12694414
申请日：2010-01-27
申请人： LI LONG , DE-BAO MA , CHAO-HSUN LIN , DA-WEI DING , YONG-GANG ZHU
发明人： LI LONG , DE-BAO MA , CHAO-HSUN LIN , DA-WEI DING , YONG-GANG ZHU
摘要： A mold, comprising: a substrate, the substrate having an inside surface and an outside surface; and a ceramic coating formed on at least substantially the entire inside surface, the ceramic coating comprising chromic oxide, silicon dioxide, and alumina. A method for making the present mold is provided.
摘要翻译： 一种模具，包括：基板，所述基板具有内表面和外表面; 以及在至少基本上整个内表面上形成的陶瓷涂层，所述陶瓷涂层包含氧化铬，二氧化硅和氧化铝。 提供了制造本发明的模具的方法。
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