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    LED light-emitting element
    1.
    发明授权
    LED light-emitting element 有权

    公开(公告)号：US09786826B2

    公开(公告)日：2017-10-10

    申请号：US15226312

    申请日：2016-08-02

    申请人： CITIZEN ELECTRONICS CO., LTD. ,  CITIZEN HOLDINGS CO., LTD.

    发明人： Makoto Yasuhara ,  Yusuke Watanabe

    IPC分类号： H01L21/00 ,  H01L33/60 ,  H01L33/50

    CPC分类号： H01L33/60 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： An LED light-emitting element having reduced the occurrence of illuminance unevenness is provided. A light-emitting element comprising a substrate, an LED element mounted on the substrate, a phosphor resin arranged on the substrate so as to seal the LED element and having an emission surface from which light based on light emitted from the LED element is emitted, a reflective resin arranged around the phosphor resin; and a reflecting frame having an opening and at least part of which is arranged on the reflective resin, wherein the reflective resin is arranged directly under the reflecting frame and on the side surface of the phosphor resin, the ratio of the area of the emission surface to the area of an inside area of the reflecting frame is set to 80% or higher, and in the inside area of the reflecting frame, the reflective resin is exposed around the emission surface.

    LED LIGHT-EMITTING ELEMENT
    3.
    发明申请
    LED LIGHT-EMITTING ELEMENT 有权
    LED发光元件

    公开(公告)号：US20170040514A1

    公开(公告)日：2017-02-09

    申请号：US15226312

    申请日：2016-08-02

    申请人： CITIZEN ELECTRONICS CO., LTD. ,  CITIZEN HOLDINGS CO., LTD.

    发明人： Makoto Yasuhara ,  Yusuke Watanabe

    IPC分类号： H01L33/60 ,  H01L33/50 ,  F21V23/02

    CPC分类号： H01L33/60 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： An LED light-emitting element having reduced the occurrence of illuminance unevenness is provided. A light-emitting element comprising a substrate, an LED element mounted on the substrate, a phosphor resin arranged on the substrate so as to seal the LED element and having an emission surface from which light based on light emitted from the LED element is emitted, a reflective resin arranged around the phosphor resin; and a reflecting frame having an opening and at least part of which is arranged on the reflective resin, wherein the reflective resin is arranged directly under the reflecting frame and on the side surface of the phosphor resin, the ratio of the area of the emission surface to the area of an inside area of the reflecting frame is set to 80% or higher, and in the inside area of the reflecting frame, the reflective resin is exposed around the emission surface.

    摘要翻译： 提供了减少照度不均匀的发生的LED发光元件。 一种发光元件，包括基板，安装在所述基板上的LED元件，设置在所述基板上以便密封所述LED元件并具有基于从所述LED元件发出的光的光的发射面的荧光体树脂， 布置在荧光体树脂周围的反射树脂; 以及具有开口部的反射框架，其至少一部分设置在反射树脂上，其中反射树脂直接配置在反射框架的正下方，在荧光体树脂的侧面上，发光面的面积 到反射框架的内部区域的区域设定为80％以上，在反射框架的内部区域中，反射树脂暴露在发射面附近。

    LIGHT EMITTING DEVICE
    4.
    发明申请
    LIGHT EMITTING DEVICE 有权
    发光装置

    公开(公告)号：US20170025586A1

    公开(公告)日：2017-01-26

    申请号：US15064868

    申请日：2016-03-09

    申请人： CITIZEN ELECTRONICS CO., LTD. ,  CITIZEN HOLDINGS CO., LTD.

    发明人： Yusuke Watanabe

    IPC分类号： H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/48

    CPC分类号： H01L33/505 ,  H01L33/486 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

    摘要： A light emitting device includes a substrate, a light emitting element mounted on the substrate, a phosphor plate for covering an upper surface of the light emitting element, a white reflecting resin placed on the substrate to surround side surfaces of the light emitting element and the phosphor plate, and a reflecting frame, including a reflecting film formed by plating and a bonding portion, and placed on the substrate to surround the light emitting element, the phosphor plate, and the white reflecting resin. The reflecting frame is directly bonded to the substrate by the bonding portion in a portion where the white reflecting resin is not located.

    摘要翻译： 发光装置包括基板，安装在基板上的发光元件，用于覆盖发光元件的上表面的荧光体板，设置在基板上以包围发光元件的侧表面的白色反射树脂和 磷光体板和反射框架，其包括通过电镀形成的反射膜和接合部分，并且放置在基板上以围绕发光元件，荧光体板和白色反射树脂。 反射框架在白色反射树脂未被定位的部分中通过接合部分直接结合到基板上。

    Light-emitting device including transparent resin with curved surface arranged at side facing light-emitting diode element
    5.
    发明授权
    Light-emitting device including transparent resin with curved surface arranged at side facing light-emitting diode element 有权
    发光装置，其包括具有布置在面向发光二极管元件的侧面的弯曲表面的透明树脂

    公开(公告)号：US09117982B2

    公开(公告)日：2015-08-25

    申请号：US14326641

    申请日：2014-07-09

    申请人： CITIZEN ELECTRONICS CO., LTD. ,  CITIZEN HOLDINGS CO., LTD.

    发明人： Kazuya Ishihara ,  Yuki Suto ,  Yusuke Watanabe

    IPC分类号： H01J1/62 ,  H01J9/00 ,  H01L33/50 ,  H01L33/56 ,  H01L33/52 ,  H01L33/54

    CPC分类号： H01L33/505 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/16

    摘要： A light-emitting device includes a substrate that includes at least a pair of electrodes, an LED element electrically mounted on the substrate, a phosphor plate adhered to an upper surface of the LED element and including an upper surface and a lower surface each having an area larger than that of the upper surface of the LED element, a white resin provided on an upper surface of the substrate and seamlessly covering a peripheral side surface of the LED element and a peripheral side surface of the phosphor plate. A lower surface of the phosphor plate is adhered to the upper surface of the LED element through a transparent adhesive.

    摘要翻译： 发光装置包括至少包括一对电极的基板，电气安装在基板上的LED元件，粘附到LED元件的上表面的荧光体板，并且包括上表面和下表面，每个具有 面积大于LED元件的上表面的面积，设置在基板的上表面上的白色树脂，并且无缝地覆盖LED元件的周边表面和荧光体板的周边侧表面。 荧光体板的下表面通过透明粘合剂粘合到LED元件的上表面。