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1.发明授权公开(公告)号：US11993692B2
公开(公告)日：2024-05-28
申请号：US18218790
申请日：2023-07-06
申请人： CORNING INCORPORATED
发明人： Andrew Charles Antony , Theresa Chang , Sushmit Sunil Kumar Goyal , Shrisudersan Jayaraman , Rui Qi , Vinalia Tjong , Shu Yuan
IPC分类号： C08K13/02 , A01N25/08 , A01N59/20 , C08J5/18 , C08K3/40 , C08K5/00 , C08K5/315 , C08K5/521 , C08K5/524 , C08K5/5313 , C08K5/5333 , C09D5/14 , C09D7/20 , C09D7/48 , C09D7/61 , C09D7/63 , C09D125/06 , C09D133/12 , C09D179/08
CPC分类号： C08K13/02 , A01N25/08 , A01N59/20 , C08J5/18 , C09D5/14 , C09D7/20 , C09D7/48 , C09D7/61 , C09D7/63 , C09D125/06 , C09D133/12 , C09D179/08 , C08J2325/06 , C08J2333/12 , C08J2379/08 , C08K3/40 , C08K5/0091 , C08K5/315 , C08K5/521 , C08K5/524 , C08K5/5313 , C08K5/5333
摘要： A method of forming an antimicrobial film, including providing a substrate with a polymer coating disposed thereon, the polymer coating including: an antimicrobial material, an inner surface contacting the substrate, and an outer surface opposite the inner surface; and extracting ions from the antimicrobial material toward the outer surface, such that the outer surface interacts with surface microorganisms. A composition, including a polymer; an antimicrobial material; and at least one of an organic solvent and an additive. The antimicrobial material comprises at least one of copper-containing glass particles, copper oxide particles, copper metal particles, copper salts, copper coordination complexes, cuprite crystals, and a combination thereof. Further, the additive can be selected to increase the oxidation resistance of the antimicrobial material.
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公开(公告)号：US10887987B2
公开(公告)日：2021-01-05
申请号：US16245793
申请日：2019-01-11
申请人： Corning Incorporated
IPC分类号： H05K1/09 , H05K1/11 , H01L23/15 , H01L21/48 , H01L23/14 , H01L23/498 , H05K1/03 , H05K3/16 , H05K3/38 , H05K3/42
摘要： An article includes a wafer having a body which defines a first surface and a second surface. The wafer defines a via having a via surface extending between the first and second surfaces through the body. An adhesion layer is positioned on the via surface. At least a portion of the via surface is free of the adhesion layer. A metallic component is positioned within the via and extends from the first surface to the second surface.
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3.发明公开公开(公告)号：US20230357541A1
公开(公告)日：2023-11-09
申请号：US18218790
申请日：2023-07-06
申请人： CORNING INCORPORATED
发明人： Andrew Charles Antony , Theresa Chang , Sushmit Sunil Kumar Goyal , Shrisudersan Jayaraman , Rui Qi , Vinalia Tjong , Shu Yuan
IPC分类号： C08K13/02 , C09D5/14 , C09D7/20 , C09D7/61 , C09D7/48 , C09D7/63 , C09D125/06 , C09D133/12 , C09D179/08 , C08J5/18 , A01N59/20 , A01N25/08
CPC分类号： C08K13/02 , C09D5/14 , C09D7/20 , C09D7/61 , C09D7/48 , C09D7/63 , C09D125/06 , C09D133/12 , C09D179/08 , C08J5/18 , A01N59/20 , A01N25/08 , C08K3/40
摘要： A method of forming an antimicrobial film, including providing a substrate with a polymer coating disposed thereon, the polymer coating including: an antimicrobial material, an inner surface contacting the substrate, and an outer surface opposite the inner surface; and extracting ions from the antimicrobial material toward the outer surface, such that the outer surface interacts with surface microorganisms. A composition, including a polymer; an antimicrobial material; and at least one of an organic solvent and an additive. The antimicrobial material comprises at least one of copper-containing glass particles, copper oxide particles, copper metal particles, copper salts, copper coordination complexes, cuprite crystals, and a combination thereof. Further, the additive can be selected to increase the oxidation resistance of the antimicrobial material.
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公开(公告)号：US10917966B2
公开(公告)日：2021-02-09
申请号：US16245793
申请日：2019-01-11
申请人： Corning Incorporated
IPC分类号： H05K1/09 , H05K1/11 , H01L23/15 , H01L21/48 , H01L23/14 , H01L23/498 , H05K1/03 , H05K3/16 , H05K3/38 , H05K3/42
摘要： An article includes a wafer having a body which defines a first surface and a second surface. The wafer defines a via having a via surface extending between the first and second surfaces through the body. An adhesion layer is positioned on the via surface. At least a portion of the via surface is free of the adhesion layer. A metallic component is positioned within the via and extends from the first surface to the second surface.
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公开(公告)号：US20190239353A1
公开(公告)日：2019-08-01
申请号：US16245793
申请日：2019-01-11
申请人： Corning Incorporated
CPC分类号： H05K1/115 , H01L21/486 , H01L23/145 , H01L23/15 , H01L23/49827 , H05K1/0306 , H05K1/09 , H05K3/16 , H05K3/388 , H05K3/423
摘要： An article includes a wafer having a body which defines a first surface and a second surface. The wafer defines a via having a via surface extending between the first and second surfaces through the body. An adhesion layer is positioned on the via surface. At least a portion of the via surface is free of the adhesion layer. A metallic component is positioned within the via and extends from the first surface to the second surface.
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6.发明公开公开(公告)号：US20240270941A1
公开(公告)日：2024-08-15
申请号：US18643241
申请日：2024-04-23
申请人： CORNING INCORPORATED
发明人： Andrew Charles Antony , Theresa Chang , Sushmit Sunil Kumar Goyal , Shrisudersan Jayaraman , Rui Qi , Vinalia Tjong , Shu Yuan
IPC分类号： C08K13/02 , A01N25/08 , A01N59/20 , C08J5/18 , C08K3/40 , C08K5/00 , C08K5/315 , C08K5/521 , C08K5/524 , C08K5/5313 , C08K5/5333 , C09D5/14 , C09D7/20 , C09D7/48 , C09D7/61 , C09D7/63 , C09D125/06 , C09D133/12 , C09D179/08
CPC分类号： C08K13/02 , A01N25/08 , A01N59/20 , C08J5/18 , C09D5/14 , C09D7/20 , C09D7/48 , C09D7/61 , C09D7/63 , C09D125/06 , C09D133/12 , C09D179/08 , C08J2325/06 , C08J2333/12 , C08J2379/08 , C08K3/40 , C08K5/0091 , C08K5/315 , C08K5/521 , C08K5/524 , C08K5/5313 , C08K5/5333
摘要： A method of forming an antimicrobial film, including providing a substrate with a polymer coating disposed thereon, the polymer coating including: an antimicrobial material, an inner surface contacting the substrate, and an outer surface opposite the inner surface; and extracting ions from the antimicrobial material toward the outer surface, such that the outer surface interacts with surface microorganisms. A composition, including a polymer; an antimicrobial material; and at least one of an organic solvent and an additive. The antimicrobial material comprises at least one of copper-containing glass particles, copper oxide particles, copper metal particles, copper salts, copper coordination complexes, cuprite crystals, and a combination thereof. Further, the additive can be selected to increase the oxidation resistance of the antimicrobial material.
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公开(公告)号：US12004295B2
公开(公告)日：2024-06-04
申请号：US17111144
申请日：2020-12-03
申请人： Corning Incorporated
IPC分类号： H05K1/11 , H01L21/48 , H01L23/14 , H01L23/15 , H01L23/498 , H05K1/03 , H05K1/09 , H05K3/16 , H05K3/38 , H05K3/42
CPC分类号： H05K1/115 , H01L21/486 , H01L23/145 , H01L23/15 , H01L23/49827 , H05K1/0306 , H05K1/09 , H05K3/16 , H05K3/388 , H05K3/423
摘要： An article includes a wafer having a body which defines a first surface and a second surface. The wafer defines a via having a via surface extending between the first and second surfaces through the body. An adhesion layer is positioned on the via surface. At least a portion of the via surface is free of the adhesion layer. A metallic component is positioned within the via and extends from the first surface to the second surface.
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公开(公告)号：US20200333279A1
公开(公告)日：2020-10-22
申请号：US16959236
申请日：2018-12-28
申请人： CORNING INCORPORATED
IPC分类号： G01N27/28 , H01L23/498
摘要： A method of forming a sensor, such as a glass electrochemical sensor, is described. In some examples, the method may include forming a plurality of apertures in a glass substrate; forming a sensor body comprising the glass substrate and at least one glass sensor component, wherein one or more apertures of the glass substrate are aligned with the at least one glass sensor component to form an outer contact aperture; filling the outer contact aperture in the sensor body with a first conducting material to form an outer contact through glass via (TGV); and forming an electrode on the glass substrate adjacent at least one of the apertures of the plurality of apertures.
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公开(公告)号：US20190024237A1
公开(公告)日：2019-01-24
申请号：US16015563
申请日：2018-06-22
申请人： Corning Incorporated
IPC分类号： C23C18/16 , C03C17/10 , C23C18/38 , H01L21/288 , H01L21/768
摘要： Methods of metalizing vias are disclosed. A method of metalizing at least one via includes contacting a substrate with a sacrificial metal sheet. The substrate includes a first surface, a second surface, and the at least one via extending between the first surface and the second surface and the first surface or the second surface of the substrate contacts a surface of the sacrificial metal sheet. The method further includes applying a solution comprising metal ions to the substrate and the sacrificial metal sheet such that a Galvanic displacement reaction occurs between the sacrificial metal sheet and the metal ions in the solution until the metal ions form a metal coating on at least one surface of the at least one via.
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公开(公告)号：US20240085361A1
公开(公告)日：2024-03-14
申请号：US18515508
申请日：2023-11-21
申请人： CORNING INCORPORATED
IPC分类号： G01N27/28 , C03C17/06 , C03C17/10 , G01N27/36 , H01L23/498
CPC分类号： G01N27/283 , C03C17/06 , C03C17/10 , G01N27/36 , H01L23/49827 , C03C2218/34
摘要： A method of forming a sensor, such as a glass electrochemical sensor, is described. In some examples, the method may include forming a plurality of apertures in a glass substrate; forming a sensor body comprising the glass substrate and at least one glass sensor component, wherein one or more apertures of the glass substrate are aligned with the at least one glass sensor component to form an outer contact aperture; filling the outer contact aperture in the sensor body with a first conducting material to form an outer contact through glass via (TGV); and forming an electrode on the glass substrate adjacent at least one of the apertures of the plurality of apertures.
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