公开(公告)号：US20240154277A1

公开(公告)日：2024-05-09

申请号：US18414170

申请日：2024-01-16

Applicant: CelLink Corporation

Inventor： Kevin Michael Coakley ,  Malcolm Brown ,  Paul Tsao

IPC: H01M50/581 ,  H01M10/48 ,  H01M50/503 ,  H01M50/522 ,  H01M50/526 ,  H05K1/11 ,  H05K1/18 ,  H05K3/40

CPC classification number: H01M50/581 ,  H01M10/482 ,  H01M50/503 ,  H01M50/522 ,  H01M50/526 ,  H05K1/118 ,  H05K1/189 ,  H05K3/4092 ,  H01M10/4257 ,  H01M2200/103

Abstract: Provided are interconnects for interconnecting a set of battery cells, assemblies comprising these interconnects, methods of forming such interconnects, and methods of forming such assemblies. An interconnect includes a conductor comprising two portions electrically isolated from each other. At least one portion may include two contacts for connecting to battery cells and a fuse forming an electrical connection between these two contacts. The interconnect may also include an insulator adhered to the conductor and mechanically supporting the two portions of the conductor. The insulator may include an opening such that the fuse overlaps with this opening, and the opening does not interfere with the operation of the fuse. In some embodiments, the fuse may not directly interface with any other structures. Furthermore, the interconnect may include a temporary substrate adhered to the insulator such that the insulator is disposed between the temporary substrate and the conductor.

公开(公告)号：US20210175588A1

公开(公告)日：2021-06-10

申请号：US17180605

申请日：2021-02-19

Applicant: CelLink Corporation

Inventor： KEVIN MICHAEL COAKLEY ,  Malcolm Brown ,  Paul Tsao

IPC: H01M50/581 ,  H01M50/502 ,  H05K3/40 ,  H05K1/11 ,  H05K1/18 ,  H01M10/48 ,  H01M10/42 ,  H05K1/02

Abstract: Provided are interconnects for interconnecting a set of battery cells, assemblies comprising these interconnects, methods of forming such interconnects, and methods of forming such assemblies. An interconnect includes a conductor comprising two portions electrically isolated from each other. At least one portion may include two contacts for connecting to battery cells and a fuse forming an electrical connection between these two contacts. The interconnect may also include an insulator adhered to the conductor and mechanically supporting the two portions of the conductor. The insulator may include an opening such that the fuse overlaps with this opening, and the opening does not interfere with operation of the fuse. In some embodiments, the fuse may not directly interface with any other structures. Furthermore, the interconnect may include a temporary substrate adhered to the insulator such that the insulator is disposed between the temporary substrate and the conductor.

公开(公告)号：US20190051999A1

公开(公告)日：2019-02-14

申请号：US16164722

申请日：2018-10-18

Applicant: CelLink Corporation

Inventor： Kevin Michael Coakley ,  Malcolm Brown ,  Jose Juarez ,  Dongao Yang

IPC: H01R12/59 ,  B60R16/02 ,  H05K1/02 ,  H01R43/20 ,  H01B7/00 ,  B60J5/04 ,  H01B7/08 ,  H01B7/04 ,  H01R12/69 ,  H01B7/42

CPC classification number: H01R12/592 ,  B60J5/0413 ,  B60R16/0215 ,  B60Y2410/115 ,  H01B7/0045 ,  H01B7/04 ,  H01B7/08 ,  H01B7/421 ,  H01B13/01254 ,  H01R12/69 ,  H01R43/205 ,  H01R2201/26 ,  H05K1/0201 ,  H05K1/028 ,  H05K1/118 ,  H05K3/0052 ,  H05K3/28 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/041 ,  H05K2201/052 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2203/0228

Abstract: Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead with a width-to-thickness ratio of at least 2. This ratio provides for a lower thickness profile and enhances heat transfer from the harness to the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The same sheet may be used to form other components of the harness. The conductor trace also comprises a connecting end, monolithic with the conductor lead. The width-to-thickness ratio of the connecting end may be less than that of the conductor trace, allowing for the connecting end to be directly mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width-to-thickness ratio, which may be close to 1.

公开(公告)号：US20190229449A1

公开(公告)日：2019-07-25

申请号：US16371708

申请日：2019-04-01

Applicant: CelLink Corporation

Inventor： Kevin Michael Coakley ,  Malcolm Brown ,  Jose Juarez ,  Dongao Yang

IPC: H01R12/59 ,  H01R12/69 ,  H01B7/08 ,  H05K1/02 ,  B60J5/04 ,  H01B7/04 ,  B60R16/02 ,  H01B7/00 ,  H01R43/20

CPC classification number: H01R12/592 ,  B60J5/0413 ,  B60R16/0215 ,  B60Y2410/115 ,  H01B7/0045 ,  H01B7/04 ,  H01B7/08 ,  H01B7/421 ,  H01B13/01254 ,  H01R12/69 ,  H01R43/205 ,  H01R2201/26 ,  H05K1/0201 ,  H05K1/028 ,  H05K1/118 ,  H05K3/0052 ,  H05K3/28 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/041 ,  H05K2201/052 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2203/0228

Abstract: Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead with a width-to-thickness ratio of at least 2. This ratio provides for a lower thickness profile and enhances heat transfer from the harness to the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The same sheet may be used to form other components of the harness. The conductor trace also comprises a connecting end, monolithic with the conductor lead. The width-to-thickness ratio of the connecting end may be less than that of the conductor trace, allowing for the connecting end to be directly mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width-to-thickness ratio, which may be close to 1.

公开(公告)号：US10348009B2

公开(公告)日：2019-07-09

申请号：US16164722

申请日：2018-10-18

Applicant: CelLink Corporation

Inventor： Kevin Michael Coakley ,  Malcolm Brown ,  Jose Juarez ,  Dongao Yang

IPC: H01R12/59 ,  H05K1/02 ,  B60J5/04 ,  B60R16/02 ,  H01B7/00 ,  H01R43/20 ,  H01B7/04 ,  H01B7/08 ,  H01R12/69 ,  H01B7/42

Abstract: Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead with a width-to-thickness ratio of at least 2. This ratio provides for a lower thickness profile and enhances heat transfer from the harness to the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The same sheet may be used to form other components of the harness. The conductor trace also comprises a connecting end, monolithic with the conductor lead. The width-to-thickness ratio of the connecting end may be less than that of the conductor trace, allowing for the connecting end to be directly mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width-to-thickness ratio, which may be close to 1.

公开(公告)号：US09844148B2

公开(公告)日：2017-12-12

申请号：US15379177

申请日：2016-12-14

Applicant: CelLink Corporation

Inventor： Kevin Coakley ,  Malcolm Brown

IPC: H01L21/00 ,  H01M2/34 ,  H05K3/00 ,  H01L23/538 ,  H05K1/11 ,  H05K1/18 ,  H05K3/40 ,  H01M2/20 ,  H01M10/48 ,  H05K1/02 ,  H01M10/42

CPC classification number: H05K3/0058 ,  H01L23/5386 ,  H01M2/202 ,  H01M2/206 ,  H01M10/4257 ,  H01M10/48 ,  H05K1/0268 ,  H05K1/118 ,  H05K1/189 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/056 ,  H05K2201/09081 ,  H05K2201/10037

Abstract: Provided are interconnect circuits for interconnecting arrays of devices and methods of forming these interconnect circuits as well as connecting these circuits to the devices. An interconnect circuit may include a conductive layer and one or more insulating layers. The conductive layer may be patterned with openings defining contact pads, such that each pad is used for connecting to a different electrical terminal of the interconnected devices. In some embodiments, each contact pad is attached to the rest of the conductive layer by a fusible link formed from the same conductive layer as the contact pad. The fusible link controls the current flow to and from this contact pad. The insulating layer is laminated to the conductive layer and provides support to the contacts pads. The insulating layer may also be patterned with openings, which allow forming electrical connections between the contact pads and cell terminals through the insulating layer.

公开(公告)号：US09832857B2

公开(公告)日：2017-11-28

申请号：US15259518

申请日：2016-09-08

Applicant: CelLink Corporation

Inventor： Kevin Michael Coakley ,  Malcolm Brown

IPC: H01L29/40 ,  H05K1/02 ,  H01L33/64 ,  H05K1/18

CPC classification number: H05K1/0209 ,  H01L33/647 ,  H05K1/18 ,  H05K2201/10106

Abstract: Provided are interconnect circuits for combined electrical and thermal energy transfer to devices connected to these circuits. Also provided are methods of fabricating such interconnect circuits. An interconnect circuit may include an electro-thermal conductor and at least one insulator providing support to different portions of the conductor with respect to each other. The insulator may include one or more openings for electrical connections and/or heat exchange with the electro-thermal conductor. The portions of the conductor may be electrically isolated from each other in the final circuit. Initially, these portions may be formed from the same conductive sheet, such as a metal foil having a thickness of at least about 50 micrometers. This thickness ensures sufficient thermal transfer in addition to providing excellent electrical conductance. In some embodiments, the conductor may include a surface coating to protect its base material from oxidation, enhancing electrical connections, and/or other purposes.

公开(公告)号：US20170094802A1

公开(公告)日：2017-03-30

申请号：US15379177

申请日：2016-12-14

Applicant: CelLink Corporation

Inventor： Kevin Coakley ,  Malcolm Brown

IPC: H05K3/00 ,  H01M10/48 ,  H05K1/02 ,  H01M2/20 ,  H05K3/40 ,  H05K1/11

CPC classification number: H05K3/0058 ,  H01L23/5386 ,  H01M2/202 ,  H01M2/206 ,  H01M10/4257 ,  H01M10/48 ,  H05K1/0268 ,  H05K1/118 ,  H05K1/189 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/056 ,  H05K2201/09081 ,  H05K2201/10037

Abstract: Provided are interconnect circuits for interconnecting arrays of devices and methods of forming these interconnect circuits as well as connecting these circuits to the devices. An interconnect circuit may include a conductive layer and one or more insulating layers. The conductive layer may be patterned with openings defining contact pads, such that each pad is used for connecting to a different electrical terminal of the interconnected devices. In some embodiments, each contact pad is attached to the rest of the conductive layer by a fusible link formed from the same conductive layer as the contact pad. The fusible link controls the current flow to and from this contact pad. The insulating layer is laminated to the conductive layer and provides support to the contacts pads. The insulating layer may also be patterned with openings, which allow forming electrical connections between the contact pads and cell terminals through the insulating layer.

公开(公告)号：US20190148707A1

公开(公告)日：2019-05-16

申请号：US16227472

申请日：2018-12-20

Applicant: CelLink Corporation

Inventor： Kevin Michael Coakley ,  Malcolm Brown ,  Paul Tsao

IPC: H01M2/34 ,  H05K1/11 ,  H05K1/18 ,  H05K3/40 ,  H01M2/20 ,  H01M10/48

Abstract: Provided are interconnects for interconnecting a set of battery cells, assemblies comprising these interconnects, methods of forming such interconnects, and methods of forming such assemblies. An interconnect includes a conductor comprising two portions electrically isolated from each other. At least one portion may include two contacts for connecting to battery cells and a fuse forming an electrical connection between these two contacts. The interconnect may also include an insulator adhered to the conductor and mechanically supporting the two portions of the conductor. The insulator may include an opening such that the fuse overlaps with this opening, and the opening does not interfere with operation of the fuse. In some embodiments, the fuse may not directly interface with any other structures. Furthermore, the interconnect may include a temporary substrate adhered to the insulator such that the insulator is disposed between the temporary substrate and the conductor.

公开(公告)号：US10153570B2

公开(公告)日：2018-12-11

申请号：US15952773

申请日：2018-04-13

Applicant: CelLink Corporation

Inventor： Kevin Michael Coakley ,  Malcolm Brown ,  Jose Juarez ,  Dongao Yang

IPC: H01R12/59 ,  H01R12/69 ,  H01B7/08 ,  H01B7/04 ,  H01R43/20 ,  H01B7/00 ,  H05K1/02 ,  B60R16/02 ,  B60J5/04 ,  H01B7/42

Abstract: Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead with a width-to-thickness ratio of at least 2. This ratio provides for a lower thickness profile and enhances heat transfer from the harness to the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The same sheet may be used to form other components of the harness. The conductor trace also comprises a connecting end, monolithic with the conductor lead. The width-to-thickness ratio of the connecting end may be less than that of the conductor trace, allowing for the connecting end to be directly mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width-to-thickness ratio, which may be close to 1.