公开(公告)号：US20110260192A1

公开(公告)日：2011-10-27

申请号：US13122323

申请日：2009-10-01

申请人： Chang Hoon Kwak ,  II Woo Park ,  Jong Rak Sohn ,  Hyo Jin Lee ,  Na Na Park ,  Seong Ah Joo

发明人： Chang Hoon Kwak ,  II Woo Park ,  Jong Rak Sohn ,  Hyo Jin Lee ,  Na Na Park ,  Seong Ah Joo

IPC分类号： H01L33/60 ,  H01L33/38

CPC分类号： H01L33/56 ,  H01L24/48 ,  H01L33/02 ,  H01L33/382 ,  H01L33/44 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01065 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01084 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A light emitting diode (LED) package using a liquid crystal polymer, includes: a package main body formed by using a liquid crystal polymer; a lead frame formed on the package main body; an LED chip mounted on the lead frame; and a resin packaging unit encapsulating the LED chip, the resin packaging unit including phosphors. The LED package is highly reliable.

摘要翻译： 使用液晶聚合物的发光二极管（LED）封装包括：通过使用液晶聚合物形成的封装主体; 形成在所述包装主体上的引线框架; 安装在引线框架上的LED芯片; 以及封装LED芯片的树脂封装单元，所述树脂封装单元包括荧光体。 LED封装非常可靠。

公开(公告)号：US20100127290A1

公开(公告)日：2010-05-27

申请号：US12360250

申请日：2009-01-27

申请人： Seong Ah Joo ,  Chang Hoon Kwak ,  Na Na Park ,  II Woo Park

发明人： Seong Ah Joo ,  Chang Hoon Kwak ,  Na Na Park ,  II Woo Park

IPC分类号： H01L21/50 ,  H01L33/00

CPC分类号： H01L33/62 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L33/486 ,  H01L33/56 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： The present invention relates to a light emitting diode package and a manufacturing method thereof.The light emitting diode package includes a substrate, an LED chip mounted on an upper part of a substrate, a molding material coated at the upper part of the substrate including an external surface of the LED chip, and an encapsulant coated at a lower part of the substrate and can improve luminous efficiency, minimize a package failure, and reduce a manufacture cost by facilitating the manufacturing process.

摘要翻译： 本发明涉及发光二极管封装及其制造方法。 发光二极管封装包括基板，安装在基板的上部的LED芯片，涂覆在基板上部的模塑材料，其包括LED芯片的外表面，以及涂覆在基板的下部的密封剂 并且可以提高发光效率，最小化封装故障，并且通过促进制造工艺来降低制造成本。

公开(公告)号：US20120181571A1

公开(公告)日：2012-07-19

申请号：US13350516

申请日：2012-01-13

申请人： Na Na Park ,  II Woo Park ,  Kyu Jin Lee

发明人： Na Na Park ,  II Woo Park ,  Kyu Jin Lee

IPC分类号： H01L33/48 ,  H01L33/40 ,  B82Y99/00

CPC分类号： H01L33/62 ,  F21V21/0808 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L25/0753 ,  H01L33/0095 ,  H01L2224/27436 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32245 ,  H01L2224/83191 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/0543 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： Provided is an adhesive film for an LED chip, including: a double-sided adhesive layer having the LED chip adhered to an upper surface thereof and a lead frame adhered to a lower surface thereof; an ultraviolet (UV) cured layer adhered to one surface of the double-sided adhesive layer; and upper and lower cover layers respectively adhered to faces exposed to the exterior of the double-sided adhesive layer and the UV cured layer.

摘要翻译： 本发明提供一种LED芯片用粘合膜，其特征在于，包括：具有附着在其上表面的LED芯片的双面粘合剂层和粘附于其下表面的引线框架; 附着在双面粘合剂层的一个表面上的紫外线（UV）固化层; 以及分别粘附到暴露于双面粘合剂层和UV固化层的外部的表面的上和下覆盖层。

公开(公告)号：US08795817B2

公开(公告)日：2014-08-05

申请号：US13818373

申请日：2011-08-24

申请人： Chang Hoon Kwak ,  II Woo Park ,  Kyu Jin Lee ,  Cheol Jun Yoo ,  Seong Jae Hong

发明人： Chang Hoon Kwak ,  II Woo Park ,  Kyu Jin Lee ,  Cheol Jun Yoo ,  Seong Jae Hong

IPC分类号： B32B3/10 ,  B32B5/16 ,  H01L33/50 ,  C09K11/06

CPC分类号： H01L33/50 ,  B32B3/08 ,  B32B3/10 ,  B32B3/14 ,  B32B3/16 ,  B32B3/18 ,  B32B5/16 ,  B32B7/12 ,  B32B9/04 ,  B32B9/045 ,  B32B27/06 ,  B32B27/08 ,  B32B27/32 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2250/44 ,  B32B2266/025 ,  B32B2307/40 ,  B32B2307/422 ,  B32B2457/00 ,  C09K11/06 ,  H01L24/97 ,  H01L33/505 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/181 ,  H01L2933/0041 ,  H05B33/22 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/24893 ,  Y10T428/24942 ,  Y10T428/31855 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01005 ,  H01L2924/00012

摘要： There are provided a phosphor film, a method of manufacturing the same, and a method of coating an LED chip with a phosphor layer. The phosphor film includes: a base film; a phosphor layer formed on the base film and obtained by mixing phosphor particles in a partially cured resin material; and a cover film formed on the phosphor layer to protect the phosphor layer.

摘要翻译： 提供了荧光体膜，其制造方法以及涂覆荧光体层的LED芯片的方法。 荧光体膜包括：基膜; 通过将部分固化的树脂材料中的荧光体粒子混合而形成在基底膜上的荧光体层; 以及形成在荧光体层上以保护荧光体层的覆盖膜。