公开(公告)号：US08546833B2

公开(公告)日：2013-10-01

申请号：US13585847

申请日：2012-08-15

申请人： Chao-Hsiung Chang ,  Hou-Te Lin

发明人： Chao-Hsiung Chang ,  Hou-Te Lin

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01L2924/00014

摘要： An exemplary LED package includes first and second electrodes, an LED die and an encapsulation. An inner wall of each first and second electrode includes a first oblique plane. The LED die is surrounded by and electrically connected to the first and second electrodes. The LED die includes an outputting surface. The encapsulation is filled between the first electrode ant the second electrode and covers the LED die, and includes opposite first and second outer surfaces, wherein the second outer surface acts as an outputting surface of the LED package. A reflective layer is coated on the first outer surface of the encapsulation. The first oblique plane of the electrode structure is light reflective and extends aslant from the outputting surface of the LED die towards the outputting surface of the LED package along a direction away from the LED die.

摘要翻译： 示例性的LED封装包括第一和第二电极，LED管芯和封装。 每个第一和第二电极的内壁包括第一斜面。 LED管芯被第一和第二电极包围并电连接。 LED管芯包括输出表面。 该封装件填充在第一电极和第二电极之间并覆盖LED管芯，并且包括相对的第一和第二外表面，其中第二外表面用作LED封装的输出表面。 反射层涂覆在封装的第一外表面上。 电极结构的第一倾斜平面是光反射的，并且从LED芯片的输出表面沿着远离LED管芯的方向向LED封装的输出表面倾斜延伸。

公开(公告)号：US08536592B2

公开(公告)日：2013-09-17

申请号：US13366374

申请日：2012-02-06

申请人： Chao-Hsiung Chang ,  Hou-Te Lin

发明人： Chao-Hsiung Chang ,  Hou-Te Lin

IPC分类号： H01L33/40

CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： An LED package device having a dam located on a substrate is provided, by which two regions are defined on the substrate. Two LED dies are respectively disposed on the two regions and separated by the dam; therefore, the LED package device has an enhanced intensity of the lateral-emitting light and a wide light emitting angle. The LED package devices can be used in backlight units to prevent mura and hot spot issues.

摘要翻译： 提供了具有位于基板上的坝的LED封装器件，通过该LED封装器件在衬底上限定两个区域。 两个LED模具分别设置在两个区域上并由坝隔开; 因此，LED封装器件具有增强的侧向发光强度和宽的发光角度。 LED封装器件可用于背光单元，以防止光环和热点问题。

公开(公告)号：USD666353S1

公开(公告)日：2012-08-28

申请号：US29417734

申请日：2012-04-09

申请人： Hou-Te Lin ,  Chao-Hsiung Chang ,  Ming-Ta Tsai

设计人： Hou-Te Lin ,  Chao-Hsiung Chang ,  Ming-Ta Tsai

公开(公告)号：US08729572B2

公开(公告)日：2014-05-20

申请号：US13533981

申请日：2012-06-27

申请人： Hou-Te Lin ,  Chao-Hsiung Chang

发明人： Hou-Te Lin ,  Chao-Hsiung Chang

IPC分类号： H01L29/18 ,  H01L33/00

CPC分类号： H01L27/153 ,  H01L25/167 ,  H01L33/08 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00014

摘要： A light emitting diode package includes an electrically insulated base, first and second electrodes, an LED chip, a voltage stabilizing module, and an encapsulative layer. The base has a first surface and an opposite second surface. The first and second electrodes are formed on the first surface of the base. The LED chip is electrically connected to the first and second electrodes. The voltage stabilizing module is formed on the first surface of the base, positioned between and electrically connected to the first and second electrodes. The voltage stabilizing module connects to the LED chip in reverse parallel and has a polarity arranged opposite to that of the LED chip. The voltage stabilizing module has an annular shape and encircles the first electrode. The encapsulative layer is formed on the base and covers the LED chip.

摘要翻译： 发光二极管封装包括电绝缘基座，第一和第二电极，LED芯片，稳压模块和封装层。 底座具有第一表面和相对的第二表面。 第一和第二电极形成在基座的第一表面上。 LED芯片电连接到第一和第二电极。 电压稳定模块形成在基座的第一表面上，位于第一和第二电极之间并与之电连接。 电压稳定模块反向并联连接到LED芯片，具有与LED芯片相反的极性。 电压稳定模块具有环形形状并且包围第一电极。 封装层形成在基座上并覆盖LED芯片。

公开(公告)号：US08569789B2

公开(公告)日：2013-10-29

申请号：US13288030

申请日：2011-11-03

申请人： Chao-Hsiung Chang ,  Hou-Te Lin

发明人： Chao-Hsiung Chang ,  Hou-Te Lin

IPC分类号： H01L33/00 ,  H01L27/15 ,  H01L21/00

CPC分类号： H01L33/60 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An LED package includes a substrate, a transparent base, an LED chip and a reflective layer. The substrate has an upper surface. The transparent base is arranged on the upper surface of the substrate. The transparent base includes a first surface away from the substrate and a second surface opposite to the first surface. The LED chip is arranged on the first surface of the transparent base. The reflective layer is arranged between the substrate and the second surface of the transparent base.

摘要翻译： LED封装包括基板，透明基板，LED芯片和反射层。 基板具有上表面。 透明基底设置在基板的上表面上。 透明基底包括远离基底的第一表面和与第一表面相对的第二表面。 LED芯片布置在透明基底的第一表面上。 反射层布置在基板和透明基底的第二表面之间。

公开(公告)号：US08545061B2

公开(公告)日：2013-10-01

申请号：US13288031

申请日：2011-11-03

申请人： Chao-Hsiung Chang ,  Hou-Te Lin ,  Ming-Ta Tsai

发明人： Chao-Hsiung Chang ,  Hou-Te Lin ,  Ming-Ta Tsai

IPC分类号： F21V3/00 ,  F21V5/00

CPC分类号： H01L33/58 ,  G02B19/0028 ,  G02B19/0061 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An LED device includes a substrate, an LED chip and a lens module. The substrate has an upper surface. The LED chip is arranged on the upper surface of the substrate. The LED chip has a light emitting surface away from the upper surface of the substrate. The lens module is arranged over the light emitting surface of the LED chip. The lens module includes a first lens. The first lens includes a first light outputting surface away from the light emitting surface of the LED chip. The first light outputting surface of the first lens defines a first cavity at a center thereof.

摘要翻译： LED装置包括基板，LED芯片和透镜模块。 基板具有上表面。 LED芯片布置在基板的上表面上。 LED芯片具有远离基板的上表面的发光表面。 透镜模块布置在LED芯片的发光表面上。 透镜模块包括第一透镜。 第一透镜包括远离LED芯片的发光表面的第一光输出表面。 第一透镜的第一光输出表面在其中心处限定第一空腔。

公开(公告)号：US08840262B2

公开(公告)日：2014-09-23

申请号：US13559614

申请日：2012-07-27

申请人： Chao-Hsiung Chang ,  Hou-Te Lin

发明人： Chao-Hsiung Chang ,  Hou-Te Lin

IPC分类号： H01L33/46

CPC分类号： H01L33/48 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： An LED includes a base, an LED chip, a first electrode, a second electrode, an encapsulating layer, and a reflective layer. The base forms a concave recessed from a top face thereof and a recess above the concave. The reflective layer is attached on the concave. The LED chip is received in the recess and located over the reflective layer. The LED chip has a light output face facing towards the reflective layer. The encapsulating layer is filled in the recess to cover the reflective layer and encapsulate the LED chip. The reflective layer includes a first reflective layer and a second reflective layer. The first reflective layer is located at a center of the concave. The second reflective layer surrounds and connects the first reflective layer. The first reflective layer has a curvature smaller than that of the second reflective layer.

摘要翻译： LED包括基底，LED芯片，第一电极，第二电极，封装层和反射层。 基部从其顶面形成凹入凹部，在凹部上形成凹部。 反射层附着在凹面上。 LED芯片被容纳在凹部中并且位于反射层之上。 LED芯片具有面向反射层的光输出面。 封装层填充在凹部中以覆盖反射层并封装LED芯片。 反射层包括第一反射层和第二反射层。 第一反射层位于凹面的中心。 第二反射层围绕并连接第一反射层。 第一反射层的曲率比第二反射层的曲率小。

公开(公告)号：US08492778B2

公开(公告)日：2013-07-23

申请号：US13424367

申请日：2012-03-19

申请人： Hou-Te Lin ,  Chao-Hsiung Chang

发明人： Hou-Te Lin ,  Chao-Hsiung Chang

IPC分类号： H01L27/15

CPC分类号： H01L25/0753 ,  H01L33/502 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014

摘要： A light emitting diode (LED) device includes a substrate, first and second LED chips arranged on the substrate, and a phosphor layer over the first and second LED chips. The phosphor layer includes a plurality of phosphor units, each including a phosphor particle and a silver halide layer encapsulating the phosphor particle. Light emitted from the second LED chip strikes the phosphor particles to generate a first light, which. combines with the light to generate a resultant light. The silver halide layer is reduced by the light from the first LED chip to produce silver particles around the phosphor particles. The silver particles can block the light emitted from the second LED chip from sticking the phosphor particles. By adjusting the current supplied to the first LED chip, the color temperature of the resultant light generated by the LED device can be changed.

摘要翻译： 发光二极管（LED）器件包括衬底，布置在衬底上的第一和第二LED芯片以及在第一和第二LED芯片上的磷光体层。 磷光体层包括多个荧光体单元，每个荧光体单元包括荧光体颗粒和包围磷光体颗粒的卤化银层。 从第二LED芯片发射的光撞击荧光体颗粒以产生第一光。 与光结合以产生结果光。 通过来自第一LED芯片的光减少卤化银层，以在荧光体颗粒周围产生银颗粒。 银颗粒可以阻挡从第二LED芯片发出的光粘附磷光体颗粒。 通过调整提供给第一LED芯片的电流，可以改变由LED器件产生的合成光的色温。

公开(公告)号：US20130161657A1

公开(公告)日：2013-06-27

申请号：US13527596

申请日：2012-06-20

申请人： Chao-Hsiung Chang ,  Hou-Te Lin

发明人： Chao-Hsiung Chang ,  Hou-Te Lin

IPC分类号： H01L33/36 ,  H01L33/48

CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A light emitting diode package includes a triangular supporting member, a first substrate and a second substrate adhered on first and second inclined sidewalls the supporting member, respectively, a first LED chip and a second LED chip secured on the first substrate and the second substrate, respectively, and a package layer covering the first LED chip and a second LED chip. The first inclined sidewall and a bottom surface of the supporting member cooperatively form a first angle therebetween, and the second inclined sidewall and the bottom surface cooperatively form a second angle therebetween. The first angle and the second angle each range between 0 degree and 90 degrees. A method for making the light emitting diode package is also provided.

摘要翻译： 发光二极管封装包括三角形支撑构件，第一基板和第二基板，分别在第一和第二倾斜侧壁上分别固定在第一基板和第二基板上的第一LED芯片和第二LED芯片， 以及覆盖第一LED芯片和第二LED芯片的封装层。 第一倾斜侧壁和支撑构件的底面在它们之间协同地形成第一角度，并且第二倾斜侧壁和底表面在它们之间协作地形成第二角度。 第一角度和第二角度各自在0度和90度之间的范围内。 还提供了制造发光二极管封装的方法。

公开(公告)号：US08642388B2

公开(公告)日：2014-02-04

申请号：US13332380

申请日：2011-12-21

申请人： Chao-Hsiung Chang

发明人： Chao-Hsiung Chang

IPC分类号： H01L21/00 ,  H01L33/00 ,  H01L23/22 ,  H01L23/24 ,  H01L23/52 ,  H01L23/12

CPC分类号： H01L33/52 ,  H01L24/97 ,  H01L33/62 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2933/0066 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： A method for manufacturing LEDs includes following steps: forming circuit structures on a substrate, each circuit structure having a first metal layer and a second metal layer formed on opposite surfaces of the substrate and a connecting section interconnecting the first and second metal layers; cutting through each circuit structure along a middle of the connecting section to form first and second electrical connecting portions insulated from each other via a gap therebetween; arranging LED chips on the substrate and electrically connecting the LED chips to the first and second electrical connecting portions; forming an encapsulation on the substrate to cover the LED chips; and cutting through the substrate and the encapsulation between the first and second electrical connecting portions of neighboring circuit structures to obtain the LEDs.

摘要翻译： 一种制造LED的方法包括以下步骤：在衬底上形成电路结构，每个电路结构具有形成在衬底的相对表面上的第一金属层和第二金属层以及互连第一和第二金属层的连接部分; 沿着连接部分的中间切割每个电路结构，以形成通过它们之间的间隙彼此绝缘的第一和第二电连接部分; 将LED芯片布置在基板上并将LED芯片电连接到第一和第二电连接部分; 在衬底上形成封装以覆盖LED芯片; 并切割穿过基板和相邻电路结构的第一和第二电连接部分之间的封装以获得LED。