Epoxy, polysulfide and cyanoacrylate composites utilizing activatable
amino-polyamide curatives
    1.
    发明授权
    Epoxy, polysulfide and cyanoacrylate composites utilizing activatable amino-polyamide curatives 失效
    环氧,多硫化物和氰基丙烯酸酯复合材料,使用可活化的氨基 - 聚酰胺固化剂

    公开(公告)号:US6111030A

    公开(公告)日:2000-08-29

    申请号:US184526

    申请日:1994-01-21

    摘要: The present invention relates to cured compositions useful as adhesives and sealants formed by dispersing an amine-terminated polyamide curative into a base to form a composite and activating the composite forming the cured composition. Bases described include epoxies, polysulfides and cyanoacrylates. Curing mechanisms include heat and pressure activation. The amine-terminated polyamide curative has a ratio of equivalents of amine to acid groups of from about 1.05:1.00 equivalents NH.sub.X :COOH to no greater than about 1.95:1.00 when x is 1 or 2.

    摘要翻译: 本发明涉及用作粘合剂和密封剂的固化组合物,其通过将胺封端的聚酰胺固化剂分散到基底中以形成复合材料并活化形成固化的组合物的复合物。 所描述的碱包括环氧化物,多硫化物和氰基丙烯酸酯。 固化机理包括热和压力的激活。 当x为1或2时,胺封端的聚酰胺固化剂的胺与酸基的当量比为约1.05:1.00当量NHX:COOH至不大于​​约1.95:1.00。

    Thermosetting polyurethane structural adhesive compositions and
processes for producing the same
    2.
    发明授权
    Thermosetting polyurethane structural adhesive compositions and processes for producing the same 失效
    热固性聚氨酯结构胶粘剂组合物及其制备方法

    公开(公告)号:US5231147A

    公开(公告)日:1993-07-27

    申请号:US842756

    申请日:1992-02-28

    摘要: The present invention relates to thermosetting polyurethane structural adhesive composites and compositions and processes for producing the same comprising dispersing an amine-terminated solid polyamide resin into a polyurethane base resin to form a nonactivated adhesive composite, and activating the same by heating to form an adhesive composition. Another aspect of the invention relates to dispersing an amine-terminated solid polyamide resin and a water generating compound into the polyurethane base resin and heat-activating the same to form an adhesive composition. The invention also relates to polyurethane base resins suitable for use in the processes of the invention, which may also be moisture cured to form a reactive adhesive composition.

    摘要翻译: 本发明涉及热固性聚氨酯结构粘合剂复合材料及其制备方法,包括将胺封端的固体聚酰胺树脂分散在聚氨酯基础树脂中以形成非活性粘合剂复合材料,并通过加热活化以形成粘合剂组合物 。 本发明的另一方面涉及将胺封端的固体聚酰胺树脂和产水化合物分散到聚氨酯基础树脂中并对其进行热活化以形成粘合剂组合物。 本发明还涉及适用于本发明方法的聚氨酯基础树脂,其也可以湿固化以形成反应性粘合剂组合物。

    High performance polyurethane base resins
    3.
    发明授权
    High performance polyurethane base resins 失效
    高性能聚氨酯基树脂

    公开(公告)号:US5336733A

    公开(公告)日:1994-08-09

    申请号:US111431

    申请日:1993-08-25

    摘要: Disclosed are polyurethane base resins, and polyurethane composites and adhesive compositions formed using the base resins. The polyurethane base resins are formed by reacting a polycarbodiimide-modified 4, 4'-diphenylmethane diisocyanate with a mixture of the following polyols: (a) a hydroxyl-terminated, linear, saturated liquid copolyester diol having a glass transition temperature of at most -10.degree. C. and at least -60.degree. C.; and (b) a homopolyester polyol that is a ring-opened polymer of a cyclic ester. The polyurethane composites include typical active hydrogen-containing species that will react with isocyanates and promote curing, in addition to the polyurethane base resin. The polyurethane adhesive compositions, which are thermosetting, include the cured polyurethane base resin, cured by exposure to moisture or any other applicable curing mechanism. The adhesive compositions have improved performance (e.g., tensile strength and adhesion) at elevated service temperatures, and are suitable for high performance automotive structural bonding applications.

    摘要翻译: 公开了聚氨酯基树脂,以及使用基础树脂形成的聚氨酯复合材料和粘合剂组合物。 聚氨酯基树脂通过使聚碳二亚胺改性的4,4'-二苯基甲烷二异氰酸酯与下列多元醇的混合物反应而形成:(a)玻璃化转变温度至多为 - 的羟基封端的直链饱和液体共聚酯二醇, 10℃,至少-60℃。 和(b)作为环状酯的开环聚合物的均聚酯多元醇。 除了聚氨酯基础树脂之外,聚氨酯复合材料包括将与异氰酸酯反应并促进固化的典型的含活性氢的物质。 热固性聚氨酯粘合剂组合物包括固化的聚氨酯基础树脂,通过暴露于湿气或任何其它适用的固化机理而固化。 粘合剂组合物在升高的使用温度下具有改进的性能(例如拉伸强度和粘合性),并且适用于高性能汽车结构粘结应用。

    Adhesives With Thermal Conductivity Enhanced By Mixed Silver Fillers
    7.
    发明申请
    Adhesives With Thermal Conductivity Enhanced By Mixed Silver Fillers 有权
    具有通过混合银填充剂增强的热导率的粘合剂

    公开(公告)号:US20110111234A1

    公开(公告)日:2011-05-12

    申请号:US12674062

    申请日:2008-08-18

    IPC分类号: C09J163/00 B32B27/38

    摘要: A thermally conductive adhesive comprises a mixture of at least two types of silver particles including a first type having a surface area to mass ratio in the range of 0.59 m2/g to 2.19 m2/g and a tap density in the range of 3.2 to 6.9 g/cm3 and a second type having a surface area to mass ratio of 0.04 to 0.17 m2/g and a tap density in the range of about 4.7 to 8.2 g/cm3. According to certain embodiments of the invention the first type of silver particles includes oblong silver particles. The thermally conductive adhesive further comprises a binder, and optionally a solvent.

    摘要翻译: 导热粘合剂包括至少两种类型的银颗粒的混合物,其包括表面积与质量比在0.59m 2 / g至2.19m 2 / g范围内的第一类型,并且振实密度在3.2至6.9范围内 g / cm 3,第二类型的表面积与质量比为0.04至0.17m2 / g,振实密度在4.7至8.2g / cm3范围内。 根据本发明的某些实施方案,第一类型的银颗粒包括长方形银颗粒。 导热粘合剂还包含粘合剂和任选的溶剂。