摘要:
Semiconductor dies are stacked offset from one another so that terminals located along two edges of each die are exposed. The two edges of the dies having terminals may be oriented in the same direction. Electrical connections may connect terminals on one die with terminals on another die, and the stack may be disposed on a wiring substrate to which the terminals of the dies may be electrically connected.
摘要:
A fault detection and protection circuit can include a comparing circuit (e.g., a comparator or a detector) that can be connected to a power line supplying power to an electronic device being tested. The comparing circuit can be configured to detect a fault in which the power line is shorted to ground. For example, the electronic device being tested may have a fault in which its power terminals are shorted to ground. Upon detection of such a fault, the comparing circuit activates one or more switches that shunt capacitors or other energy storage devices on the power line to ground. The comparing circuit may alternatively or in addition activate one or more switches that disconnect the power supply supplying power to the electronic device under test from probes contacting the electronic device.
摘要:
A fault detection and protection circuit can include a comparing circuit (e.g., a comparator or a detector) that can be connected to a power line supplying power to an electronic device being tested. The comparing circuit can be configured to detect a fault in which the power line is shorted to ground. For example, the electronic device being tested may have a fault in which its power terminals are shorted to ground. Upon detection of such a fault, the comparing circuit activates one or more switches that shunt capacitors or other energy storage devices on the power line to ground. The comparing circuit may alternatively or in addition activate one or more switches that disconnect the power supply supplying power to the electronic device under test from probes contacting the electronic device.
摘要:
A probe card cooling assembly for use in a test system includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic components and at least one coolant port that allows a coolant to enter the high-density package and directly cool the active electronic components of the dies during a testing operation.
摘要:
A system is provided to enable leakage current measurement or parametric tests to be performed with an isolation buffer provided in a channel line. Multiple such isolation buffers are used to connect a single signal channel to multiple lines. Leakage current measurement is provided by providing a buffer bypass element, such as a resistor or transmission gate, between the input and output of each buffer. The buffer bypass element can be used to calibrate buffer delay out of the test system by using TDR measurements to determine the buffer delay based on reflected pulses through the buffer bypass element. Buffer delay can likewise be calibrated out by comparing measurements of a buffered and non-buffered channel line, or by measuring a device having a known delay.
摘要:
A series of pulses may be driven down each drive channel, which creates a series of composite pulses at the output of the buffer. Each composite pulse is a composition of the individual pulses driven down the drive channels. Timing offsets associated with the drive channels may be adjusted until the individual pulses of the composite pulse align or closely align. Those timing offsets calibrate and/or deskew the drive channels, compensating for differences in the propagation delays through the drive channels. The composite pulse may be feed back to the tester through compare channels, and offsets associated with compare signals for each compare channel may be aligned to the composite pulse, which calibrates and/or deskews the compare channels.
摘要:
A base controller disposed in a test cassette receives test data for testing a plurality of electronic devices. The base controller wirelessly transmits the test data to a plurality of wireless test control chips, which write the test data to each of the electronic devices. The wireless test control chips then read response data generated by the electronic devices, and the wireless test control chips wirelessly transmit the response data to the base controller.
摘要:
A probe card cooling assembly for use in a test system includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic components and at least one coolant port that allows a coolant to enter the high-density package and directly cool the active electronic components of the dies during a testing operation.
摘要:
A probe system for providing signal paths between an integrated circuit (IC) tester and input/output, power and ground pads on the surfaces of ICs to be tested includes a probe board assembly, a flex cable and a set of probes arranged to contact the IC's I/O pads. The probe board assembly includes one or more rigid substrate layers with traces and vias formed on or within the substrate layers providing relatively low bandwidth signal paths linking the tester to probes accessing some of the IC's pads. The flex cable provides relatively high bandwidth signal paths linking the tester to probes accessing others of the IC's pads.