公开(公告)号：US06964877B2

公开(公告)日：2005-11-15

申请号：US10832969

申请日：2004-04-27

申请人： Chen-Lun Hsing Chen ,  Stanton Weaver, Jr. ,  Ivan Eliashevich ,  Sebastien Libon ,  Mehmet Arik ,  David Shaddock

发明人： Chen-Lun Hsing Chen ,  Stanton Weaver, Jr. ,  Ivan Eliashevich ,  Sebastien Libon ,  Mehmet Arik ,  David Shaddock

IPC分类号： H01L21/00 ,  H01L31/02 ,  H01L33/48 ,  H01L33/62

CPC分类号： H01L33/486 ,  H01L24/97 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/16 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/3011 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05644 ,  H01L2224/05155 ,  H01L2224/05166

摘要： Surface mount light emitting diode (LED) packages each contain a light emitting diode (LED) die (24). A plurality of arrays of openings are drilled into an electrically insulating sub-mount wafer (10). A metal is applied to the drilled openings to produce a plurality of via arrays (12). The LED dice (24) are flip-chip bonded onto a frontside (16) of the sub-mount wafer (10). The p-type and n-type contacts of each flip-chip bonded LED (24) electrically communicate with a solderable backside (18) of the sub-mount wafer (10) through a via array (12). A thermal conduction path (10, 12) is provided for thermally conducting heat from the flip-chip bonded LED dice (24) to the solderable backside (18) of the sub-mount wafer (10). Subsequent to the flip-chip bonding, the sub-mount wafer (10) is separated to produce the surface mount LED packages.

摘要翻译： 表面贴装发光二极管（LED）封装各自包含发光二极管（LED）裸片（24）。 将多个开口阵列钻入电绝缘子安装晶片（10）中。 金属被施加到钻孔以产生多个通孔阵列（12）。 LED芯片（24）被倒装芯片接合到子安装晶片（10）的前侧（16）上。 每个倒装芯片接合的LED（24）的p型和n型触点通过通孔阵列（12）与辅助安装晶片（10）的可焊接背面（18）电连通。 提供了一种导热路径（10,12），用于将来自倒装芯片接合的LED骰子（24）的热量传导到子安装晶片（10）的可焊接背面（18）。 在倒装芯片接合之后，子安装晶片（10）被分离以产生表面贴装LED封装。

公开(公告)号：US07479662B2

公开(公告)日：2009-01-20

申请号：US10525697

申请日：2003-08-29

申请人： Thomas F. Soules ,  Stanton Weaver, Jr. ,  Chen-Lun Hsing Chen ,  Mathew Sommers ,  Boris Kolodin ,  Anan Achyut Setlur ,  Thomas Elliot Stecher

发明人： Thomas F. Soules ,  Stanton Weaver, Jr. ,  Chen-Lun Hsing Chen ,  Mathew Sommers ,  Boris Kolodin ,  Anan Achyut Setlur ,  Thomas Elliot Stecher

IPC分类号： H01L29/22 ,  H01L29/24 ,  H01L33/00 ,  H01L21/00 ,  H01J63/04

CPC分类号： H01L33/58 ,  F21K9/64 ,  H01L33/44 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An LED device including an LED chip and a lens positioned apart from the chip and coated with a uniform thickness layer of fluorescent phosphor for converting at least some of the radiation emitted by the chip into visible light. Positioning the phosphor layer away from the LED improves the efficiency of the device and produces more consistent color rendition. The surface area of the lens is preferably at least ten times the surface area of the LED chip. For increased efficiency, the reflector and submount can also be coated with phosphor to further reduce internal absorption.

摘要翻译： 一种LED装置，包括LED芯片和与芯片分离并且涂覆有均匀厚度的荧光荧光粉层的透镜，用于将由芯片发射的至少一些辐射转换成可见光。 将荧光体层定位在远离LED的位置，提高了器件的效率，并产生更一致的色彩再现。 透镜的表面积优选为LED芯片的表面积的至少十倍。 为了提高效率，反射器和底座也可以涂覆磷光体，以进一步减少内部吸收。