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    Method of achieving improved STI gap fill with reduced stress
    2.
    发明申请
    Method of achieving improved STI gap fill with reduced stress 有权
    实现改善STI间隙填充减少应力的方法

    公开(公告)号：US20050170606A1

    公开(公告)日：2005-08-04

    申请号：US10767657

    申请日：2004-01-29

    申请人： Chu-Yun Fu ,  Jhi-Cherng Lu ,  Syun-Ming Jang

    发明人： Chu-Yun Fu ,  Jhi-Cherng Lu ,  Syun-Ming Jang

    IPC分类号： A61F2/00 ,  A61F2/84 ,  A61M25/00 ,  A61M25/10 ,  H01L21/762 ,  H01L21/76

    CPC分类号： H01L21/76235 ,  A61F2/958 ,  A61F2002/9583 ,  A61F2250/0098 ,  A61M25/001 ,  A61M25/005 ,  A61M25/0054 ,  A61M25/0068 ,  A61M25/0069 ,  A61M25/008 ,  A61M25/0108 ,  A61M25/0127 ,  A61M25/1027 ,  A61M2025/1079 ,  A61M2025/1093 ,  A61M2205/32

    摘要： A shallow trench isolation (STI) structure and method of forming the same with reduced stress to improve charge mobility the method including providing a semiconductor substrate comprising at least one patterned hardmask layer overlying the semiconductor substrate; dry etching a trench in the semiconductor substrate according to the at least one patterned hardmask layer; forming one or more liner layers to line the trench selected from the group consisting of silicon dioxide, silicon nitride, and silicon oxynitride; forming one or more layers of trench filling material comprising silicon dioxide to backfill the trench; carrying out at least one thermal annealing step to relax accumulated stress in the trench filling material; carrying out at least one of a CMP and dry etch process to remove excess trench filling material above the trench level; and, removing the at least one patterned hardmask layer.

    摘要翻译： 一种浅沟槽隔离（STI）结构及其形成方法，其具有减小的应力以改善电荷迁移率，该方法包括提供包括覆盖在半导体衬底上的至少一个图案化硬掩模层的半导体衬底; 根据所述至少一个图案化硬掩模层干蚀刻所述半导体衬底中的沟槽; 形成一个或多个衬垫层以使选自二氧化硅，氮化硅和氮氧化硅的沟槽的沟槽; 形成包含二氧化硅的一层或多层沟槽填充材料以回填沟槽; 进行至少一个热退火步骤以缓和沟槽填充材料中的累积应力; 执行CMP和干蚀刻工艺中的至少一个以去除沟槽高度上的多余沟槽填充材料; 以及去除所述至少一个图案化的硬掩模层。

    Method of forming field effect transistor and structure formed thereby
    3.
    发明申请
    Method of forming field effect transistor and structure formed thereby 失效
    形成场效应晶体管的方法及由此形成的结构

    公开(公告)号：US20050110086A1

    公开(公告)日：2005-05-26

    申请号：US10720775

    申请日：2003-11-24

    申请人： Chuan-Ping Hou ,  Jhi-Cherng Lu ,  Kuang-Hsin Chen ,  Hsun-Chih Tsao

    发明人： Chuan-Ping Hou ,  Jhi-Cherng Lu ,  Kuang-Hsin Chen ,  Hsun-Chih Tsao

    IPC分类号： H01L21/336 ,  H01L21/84 ,  H01L27/01 ,  H01L27/12 ,  H01L29/772

    CPC分类号： H01L29/7853 ,  H01L21/84 ,  H01L27/1203 ,  H01L29/66795

    摘要： A method for forming a field effect transistor includes: forming a conductive region on an isolation layer formed on a substrate, and a cap dielectric layer on the conductive region; forming a sacrificial dielectric layer over the isolation layer and the cap dielectric layer, and on sidewalls of the conductive region; removing a portion of the sacrificial dielectric layer on the cap dielectric layer; removing the cap dielectric layer; removing remaining portions of the sacrificial dielectric layer; forming a gate on the conductive region; and forming source/drain (S/D) regions within the conductive region and adjacent to the gate. A field effect transistor includes a conductive region over an isolation layer formed on a substrate, the conductive region being substantially without undercut at the region within the isolation layer beneath the conductive region; a gate on the conductive region; and S/D regions within the conductive region and adjacent to the gate.

    摘要翻译： 一种用于形成场效应晶体管的方法，包括：在形成于基板上的隔离层上形成导电区域，在导电区域上形成盖电介质层; 在所述隔离层和所述盖电介质层上以及所述导电区域的侧壁上形成牺牲介电层; 去除所述帽介电层上的牺牲介电层的一部分; 去除所述盖电介质层; 去除牺牲介电层的剩余部分; 在导电区上形成栅极; 以及在所述导电区域内并且邻近所述栅极形成源极/漏极（S / D）区域。 场效应晶体管包括在衬底上形成的隔离层上的导电区域，该导电区域在导电区域下面的隔离层内的区域基本上没有底切; 导电区域上的栅极; 和导电区域内的S / D区域并且与栅极相邻。

    STI liner for SOI structure
    4.
    发明申请
    STI liner for SOI structure 有权
    STI衬垫为SOI结构

    公开(公告)号：US20060012004A1

    公开(公告)日：2006-01-19

    申请号：US11221200

    申请日：2005-09-07

    申请人： Kuang-Hsin Chen ,  Hsun-Chih Tsao ,  Hung-Wei Chen ,  Di-Hong Lee ,  Chuan-Ping Hou ,  Jhi-Cherng Lu

    发明人： Kuang-Hsin Chen ,  Hsun-Chih Tsao ,  Hung-Wei Chen ,  Di-Hong Lee ,  Chuan-Ping Hou ,  Jhi-Cherng Lu

    IPC分类号： H01L29/00 ,  H01L21/20

    CPC分类号： H01L21/76224 ,  H01L21/84

    摘要： In a method of manufacturing a semiconductor device, an initial structure is provided. The initial structure includes a substrate, a patterned silicon layer, and a covering layer. The substrate has a buried insulator layer formed thereon. The patterned silicon layer is formed on the buried insulator layer. The covering layer is formed on the patterned silicon layer. A first layer is formed on the initial structure. Part of the first layer is removed with an etching process, such that a sidewall portion of the patterned silicon layer is exposed and such that a remaining portion of the first layer remains at a corner where the patterned silicon layer interfaces with the buried insulator layer. An oxide liner is formed on the exposed sidewall portion. A recess may be formed in the buried insulator layer (prior to forming the first layer) and may extend partially beneath the patterned silicon layer.

    摘要翻译： 在制造半导体器件的方法中，提供初始结构。 初始结构包括衬底，图案化硅层和覆盖层。 基板上形成有埋置的绝缘体层。 图案化的硅层形成在掩埋绝缘体层上。 覆盖层形成在图案化硅层上。 在初始结构上形成第一层。 通过蚀刻工艺去除第一层的一部分，使得图案化硅层的侧壁部分被暴露，并且使得第一层的剩余部分保留在图案化硅层与掩埋绝缘体层接合的拐角处。 在暴露的侧壁部分上形成氧化物衬垫。 可以在掩埋绝缘体层（在形成第一层之前）形成凹部，并且可以在图案化的硅层的部分下方延伸。

    STI liner for SOI structure
    5.
    发明授权
    STI liner for SOI structure 有权
    STI衬垫为SOI结构

    公开(公告)号：US06955955B2

    公开(公告)日：2005-10-18

    申请号：US10747494

    申请日：2003-12-29

    申请人： Kuang-Hsin Chen ,  Hsun-Chih Tsao ,  Hung-Wei Chen ,  Di-Hong Lee ,  Chuan-Ping Hou ,  Jhi-Cherng Lu

    发明人： Kuang-Hsin Chen ,  Hsun-Chih Tsao ,  Hung-Wei Chen ,  Di-Hong Lee ,  Chuan-Ping Hou ,  Jhi-Cherng Lu

    IPC分类号： H01L21/00 ,  H01L21/20 ,  H01L21/762 ,  H01L21/84 ,  H01L27/01

    CPC分类号： H01L21/76224 ,  H01L21/84

    摘要： In a method of manufacturing a semiconductor device, an initial structure is provided. The initial structure includes a substrate, a patterned silicon layer, and a covering layer. The substrate has a buried insulator layer formed thereon. The patterned silicon layer is formed on the buried insulator layer. The covering layer is formed on the patterned silicon layer. A first layer is formed on the initial structure. Part of the first layer is removed with an etching process, such that a sidewall portion of the patterned silicon layer is exposed and such that a remaining portion of the first layer remains at a corner where the patterned silicon layer interfaces with the buried insulator layer. An oxide liner is formed on the exposed sidewall portion. A recess may be formed in the buried insulator layer (prior to forming the first layer) and may extend partially beneath the patterned silicon layer.

    摘要翻译： 在制造半导体器件的方法中，提供了初始结构。 初始结构包括衬底，图案化硅层和覆盖层。 基板上形成有埋置的绝缘体层。 图案化的硅层形成在掩埋绝缘体层上。 覆盖层形成在图案化硅层上。 在初始结构上形成第一层。 通过蚀刻工艺去除第一层的一部分，使得图案化硅层的侧壁部分被暴露，并且使得第一层的剩余部分保留在图案化硅层与掩埋绝缘体层接合的拐角处。 在暴露的侧壁部分上形成氧化物衬垫。 可以在掩埋绝缘体层（在形成第一层之前）形成凹部，并且可以在图案化的硅层的部分下方延伸。

    STI liner for SOI structure
    8.
    发明授权
    STI liner for SOI structure 有权
    STI衬垫为SOI结构

    公开(公告)号：US07332777B2

    公开(公告)日：2008-02-19

    申请号：US11221200

    申请日：2005-09-07

    申请人： Kuang-Hsin Chen ,  Hsun-Chih Tsao ,  Hung-Wei Chen ,  Di-Hong Lee ,  Chuan-Ping Hou ,  Jhi-Cherng Lu

    发明人： Kuang-Hsin Chen ,  Hsun-Chih Tsao ,  Hung-Wei Chen ,  Di-Hong Lee ,  Chuan-Ping Hou ,  Jhi-Cherng Lu

    IPC分类号： H01L31/0392

    CPC分类号： H01L21/76224 ,  H01L21/84

    摘要： In a method of manufacturing a semiconductor device, an initial structure is provided. The initial structure includes a substrate, a patterned silicon layer, and a covering layer. The substrate has a buried insulator layer formed thereon. The patterned silicon layer is formed on the buried insulator layer. The covering layer is formed on the patterned silicon layer. A first layer is formed on the initial structure. Part of the first layer is removed with an etching process, such that a sidewall portion of the patterned silicon layer is exposed and such that a remaining portion of the first layer remains at a corner where the patterned silicon layer interfaces with the buried insulator layer. An oxide liner is formed on the exposed sidewall portion. A recess may be formed in the buried insulator layer (prior to forming the first layer) and may extend partially beneath the patterned silicon layer.

    摘要翻译： 在制造半导体器件的方法中，提供了初始结构。 初始结构包括衬底，图案化硅层和覆盖层。 基板上形成有埋置的绝缘体层。 图案化的硅层形成在掩埋绝缘体层上。 覆盖层形成在图案化硅层上。 在初始结构上形成第一层。 通过蚀刻工艺去除第一层的一部分，使得图案化硅层的侧壁部分被暴露，并且使得第一层的剩余部分保留在图案化硅层与掩埋绝缘体层接合的拐角处。 在暴露的侧壁部分上形成氧化物衬垫。 可以在掩埋绝缘体层（在形成第一层之前）形成凹部，并且可以在图案化的硅层的部分下方延伸。

    Method of forming field effect transistor and structure formed thereby
    9.
    发明授权
    Method of forming field effect transistor and structure formed thereby 失效
    形成场效应晶体管的方法及由此形成的结构

    公开(公告)号：US07026196B2

    公开(公告)日：2006-04-11

    申请号：US10720775

    申请日：2003-11-24

    申请人： Chuan-Ping Hou ,  Jhi-Cherng Lu ,  Kuang-Hsin Chen ,  Hsun-Chih Tsao

    发明人： Chuan-Ping Hou ,  Jhi-Cherng Lu ,  Kuang-Hsin Chen ,  Hsun-Chih Tsao

    IPC分类号： H01L21/84

    CPC分类号： H01L29/7853 ,  H01L21/84 ,  H01L27/1203 ,  H01L29/66795

    摘要： A method for forming a field effect transistor includes: forming a conductive region on an isolation layer formed on a substrate, and a cap dielectric layer on the conductive region; forming a sacrificial dielectric layer over the isolation layer and the cap dielectric layer, and on sidewalls of the conductive region; removing a portion of the sacrificial dielectric layer on the cap dielectric layer; removing the cap dielectric layer; removing remaining portions of the sacrificial dielectric layer; forming a gate on the conductive region; and forming source/drain (S/D) regions within the conductive region and adjacent to the gate. A field effect transistor includes a conductive region over an isolation layer formed on a substrate, the conductive region being substantially without undercut at the region within the isolation layer beneath the conductive region; a gate on the conductive region; and S/D regions within the conductive region and adjacent to the gate.

    摘要翻译： 一种用于形成场效应晶体管的方法，包括：在形成于基板上的隔离层上形成导电区域，在导电区域上形成盖电介质层; 在所述隔离层和所述盖电介质层上以及所述导电区域的侧壁上形成牺牲介电层; 去除所述帽介电层上的牺牲介电层的一部分; 去除所述盖电介质层; 去除牺牲介电层的剩余部分; 在导电区上形成栅极; 以及在所述导电区域内并且邻近所述栅极形成源极/漏极（S / D）区域。 场效应晶体管包括在衬底上形成的隔离层上的导电区域，该导电区域在导电区域下面的隔离层内的区域基本上没有底切; 导电区域上的栅极; 和导电区域内的S / D区域并且与栅极相邻。