摘要:
The invention discloses a testing circuit board for placing a device under test and further testing the device under test according to a plurality of testing signals generated by a tester. The testing circuit board includes a circuit board and a plurality of sets of sockets. The circuit board includes a plurality of connecting holes. The plurality of sets of sockets are located on a plurality of connecting holes and electrically connects to the device under test via a plurality of connecting interfaces for transferring the plurality of testing signals to test the device under test.
摘要:
The present invention discloses a circuit testing apparatus for testing a device under test. The circuit testing apparatus includes a signal transformation module, a meter, and a logic tester. The signal transformation module is coupled to the device under test and transforms an analog output signal generated by the device under test into a DC signal. The meter is coupled to the signal transformation module and measures the DC signal so as to generate a digital measuring result. The logic tester is coupled to the meter and determines a test result for the device under test according to the digital measuring result.
摘要:
The invention discloses a circuit testing apparatus for testing a device under testing. The circuit testing apparatus includes a logic tester and a signal-measuring module. The logic tester is coupled to the device under testing for providing a testing signal and a trigger signal, and then determining a testing result for the device under testing according to a digital measuring result. The signal-measuring module coupled to the device under testing and the logic tester, is utilized for measuring a DC signal generated by the device under testing according to the testing signal after receiving the trigger signal, and generating the digital measuring result.
摘要:
The invention discloses a circuit testing apparatus for testing a device under testing. The circuit testing apparatus includes a logic tester and a signal-measuring module. The logic tester is coupled to the device under testing for providing a testing signal and a trigger signal, and then determining a testing result for the device under testing according to a digital measuring result. The signal-measuring module coupled to the device under testing and the logic tester, is utilized for measuring a DC signal generated by the device under testing according to the testing signal after receiving the trigger signal, and generating the digital measuring result.
摘要:
A circuit testing apparatus for testing a device under test is disclosed. The circuit testing apparatus includes a function generator, a signal measuring module and a determining module. The function generator is coupled to the device under test for providing a plurality of testing signals according to a predetermined manner. The signal measuring module is coupled to the device under test and the function module for measuring a plurality of measuring signals generated by the device under test according to the plurality of testing signals and generating a plurality of measuring results according to the predetermined manner. The determining module is coupled to the signal measuring module for determining a testing result for the device under test according to the plurality of measuring results.
摘要:
A circuit testing apparatus for testing a device under test is disclosed. The circuit testing apparatus includes a function generator, a signal measuring module and a determining module. The function generator is coupled to the device under test for providing a plurality of testing signals according to a predetermined manner. The signal measuring module is coupled to the device under test and the function module for measuring a plurality of measuring signals generated by the device under test according to the plurality of testing signals and generating a plurality of measuring results according to the predetermined manner. The determining module is coupled to the signal measuring module for determining a testing result for the device under test according to the plurality of measuring results.
摘要:
A semiconductor structure with stress regions includes a substrate defining a first and a second device zone; a first and a second stress region formed in each of the first and second device zones to yield stress different in level; and a barrier plug separating the two device zones from each other. Due to the stress yielded at the stress regions, increased carrier mobility and accordingly, increased reading current can be obtained, and a relatively lower reading voltage is needed to obtain initially required reading current. As a result, the probability of stress-induced leakage current (SILC) is reduced and the semiconductor memory structure may have enhanced data retention ability.
摘要:
A method for forming a semiconductor device includes providing a semiconductor substrate; forming a gate dielectric over the semiconductor substrate; forming a gate electrode over the gate dielectric; forming a slim spacer on sidewalls of the gate dielectric and the gate electrode; forming a silicon carbon (SiC) region adjacent the slim spacer; forming a deep source/drain region comprising at least a portion of the silicon carbon region; blanket forming a metal layer, wherein a first interface between the metal layer and the deep source/drain is higher than a second interface between the gate dielectric and the semiconductor substrate; and annealing the semiconductor device to form a silicide region. Preferably, a horizontal spacing between an inner edge of the silicide region and a respective edge of the gate electrode is preferably less than about 150 Å.
摘要:
A semiconductor device and method for forming the same including improved electrostatic discharge protection for advanced semiconductor devices, the semiconductor device including providing semiconductor substrate having a pre-selected surface orientation and crystal direction; an insulator layer overlying the semiconductor substrate; a first semiconductor active region overlying the insulator layer having a first surface orientation selected from the group consisting of and ; a second semiconductor active region extending through a thickness portion of the insulator layer having a second surface orientation selected from the group consisting of and different from the first surface orientation; wherein MOS devices including a first MOS device of a first conduction type is disposed on the first semiconductor active region and a second MOS device of a second conduction type is disposed on the second semiconductor active region.
摘要:
A BiCMOS device with enhanced performance by mechanical uniaxial strain is provided. A first embodiment of the present invention includes an NMOS transistor, a PMOS transistor, and a bipolar transistor formed on different areas of the substrate. A first contact etch stop layer with tensile stress is formed over the NMOS transistor, and a second contact etch stop layer with compressive stress is formed over the PMOS transistor and the bipolar transistor, allowing for an enhancement of each device. Another embodiment has, in addition to the stressed contact etch stop layers, strained channel regions in the PMOS transistor and the NMOS transistor, and a strained base in the BJT.