Methods and compositions for increasing longevity and protein yield from a cell culture
    4.
    发明申请
    Methods and compositions for increasing longevity and protein yield from a cell culture 审中-公开
    用于增加细胞培养物的寿命和蛋白质产量的方法和组合物

    公开(公告)号:US20070092947A1

    公开(公告)日:2007-04-26

    申请号:US11253666

    申请日:2005-10-20

    CPC分类号: C12P21/02 C12N2510/02

    摘要: Disclosed herein are compositions and methods for increasing the longevity of a cell culture and permitting the increased production of proteins, preferably recombinant proteins, such as antibodies, peptides, enzymes, growth factors, interleukins, interferons, hormones, and vaccines. By transfecting cells in culture with an apoptosis-inhibiting gene or vector, cells in culture can survive longer, resulting in extension of the state and yield of protein biosynthesis. Expression of the apoptosis-inhibitor within the cells, because it does not kill the cells, allows the cells, or an increased fraction thereof, to be maintained in culture for longer periods. This invention then allows for controlled, enhanced protein production of cell lines for commercial and research uses, particularly the enhanced production of growth factors, interferons, interleukins, hormones, enzymes, and monoclonal antibodies, and the like. The method preferentially involves eukaryotic cells in culture, and more advantageously mammalian cells in culture.

    摘要翻译: 本文公开了用于增加细胞培养物的寿命并允许增加蛋白质生产的组合物和方法,优选重组蛋白,例如抗体,肽,酶,生长因子,白细胞介素,干扰素,激素和疫苗。 通过用细胞凋亡抑制基因或载体转染培养细胞,培养中的细胞可以长时间存活,导致蛋白质生物合成的状态和产量的延长。 凋亡抑制剂在细胞内的表达,因为它不杀死细胞,允许细胞或其增加的部分在培养物中保持较长时间。 本发明然后允许用于商业和研究用途的细胞系的受控增强的蛋白质生产,特别是生长因子,干扰素,白细胞介素,激素,酶和单克隆抗体的增强生产等。 该方法优先涉及培养中的真核细胞,更有利于培养中的哺乳动物细胞。

    Polyvalent protein complex
    7.
    发明申请
    Polyvalent protein complex 审中-公开
    多价蛋白复合物

    公开(公告)号:US20050003403A1

    公开(公告)日:2005-01-06

    申请号:US10829388

    申请日:2004-04-22

    摘要: The invention provides for a polyvalent protein complex (PPC) comprising two polypeptide chains generally arranged laterally to one another. Each polypeptide chain typically comprises 3 or 4 “v-regions”, which comprise amino acid sequences capable of forming an antigen binding site when matched with a corresponding v-region on the opposite polypeptide chain. Up to about 6 “v-regions” can be used on each polypeptide chain. The v-regions of each polypeptide chain are connected linearly to one another and may be connected by interspersed linking regions. When arranged in the form of the PPC, the v-regions on each polypeptide chain form individual antigen binding sites.

    摘要翻译: 本发明提供了包含两条多肽链的多价蛋白质复合物(PPC),其通常彼此横向排列。 每个多肽链通常包含3或4个“v区”,其包含当与相对的多肽链上的相应v-区域匹配时能够形成抗原结合位点的氨基酸序列。 每个多肽链可以使用多达约6个“v区”。 每个多肽链的v-区域彼此线性连接并且可以通过散在的连接区域连接。 当以PPC的形式排列时,每个多肽链上的v-区域形成单独的抗原结合位点。

    Inhibition of placenta growth factor (PLGF) mediated metastasis and/or angiogenesis
    8.
    发明申请
    Inhibition of placenta growth factor (PLGF) mediated metastasis and/or angiogenesis 有权
    抑制胎盘生长因子(PLGF)介导的转移和/或血管发生

    公开(公告)号:US20070087001A1

    公开(公告)日:2007-04-19

    申请号:US11581287

    申请日:2006-10-16

    IPC分类号: A61K39/395 A61K38/18

    摘要: The present invention concerns methods and compositions for inhibiting angiogenesis and/or tumor growth, survival and/or metastasis. In particular embodiments, the methods and compositions may concern ligands against placenta growth factor (PlGF), such as BP-1, BP-2, BP-3 or BP-4. Some methods may comprise administering one or more PlGF ligands, alone or in combination with one or more other agents, such as chemotherapeutic agents, other anti-angiogenic agents, immunotherapeutic agents or radioimmunotherapeutic agents to a subject. The PlGF ligands are effective to inhibit angiogenesis, tumor cell motility, tumor metastasis, tumor growth and/or tumor survival. In certain embodiments, PlGF ligands may be administered to subjects to ameliorate other angiogenesis related conditions, such as macular degeneration. In some embodiments, PlGF expression levels may be determined by any known method to select those patients most likely to respond to PlGF targeted therapies.

    摘要翻译: 本发明涉及用于抑制血管发生和/或肿瘤生长,存活和/或转移的方法和组合物。 在具体实施方案中,所述方法和组合物可涉及针对胎盘生长因子(PlGF)的配体,例如BP-1,BP-2,BP-3或BP-4。 一些方法可以包括单独或与一种或多种其它试剂(例如化学治疗剂,其它抗血管生成剂,免疫治疗剂或放射免疫治疗剂)组合施用一种或多种PlGF配体。 PlGF配体有效抑制血管生成,肿瘤细胞运动,肿瘤转移,肿瘤生长和/或肿瘤存活。 在某些实施方案中,可将PlGF配体施用于受试者以改善其它血管生成相关病症,例如黄斑变性。 在一些实施方案中,PlGF表达水平可以通过任何已知方法来确定,以选择那些最有可能对PlGF靶向治疗作出反应的患者。

    Hard mask structure for deep trenched super-junction device
    9.
    发明申请
    Hard mask structure for deep trenched super-junction device 有权
    深沟槽超连接器件的硬掩模结构

    公开(公告)号:US20060276045A1

    公开(公告)日:2006-12-07

    申请号:US11372106

    申请日:2006-03-10

    摘要: A hard mask structure is disclosed. The hard mask structure is used for manufacturing a deep trench of a super-junction device having a substrate and an epitaxial layer formed on the substrate. The hard mask structure comprises an ion barrier layer formed on the epitaxial layer for blocking ions from diffusing into the epitaxial layer, and a deposition layer formed on the ion barrier layer. Thereby, the deep trench of the super-junction device is formed by performing an etch process on the epitaxial layer via the hard mask structure. The hard mask structure can effectively prevent ions from diffusing into the epitaxial layer, so as to avoid unusual electrical property.

    摘要翻译: 公开了一种硬掩模结构。 硬掩模结构用于制造具有衬底和形成在衬底上的外延层的超接合器件的深沟槽。 硬掩模结构包括形成在外延层上用于阻挡离子扩散到外延层中的离子阻挡层和形成在离子阻挡层上的沉积层。 因此,通过经由硬掩模结构对外延层进行蚀刻工艺来形成超接合器件的深沟槽。 硬掩模结构可以有效地防止离子扩散到外延层中,从而避免异常的电性能。

    Method for fabricating high-density IC board by selectively electroplating without electrical conductive route
    10.
    发明申请
    Method for fabricating high-density IC board by selectively electroplating without electrical conductive route 审中-公开
    通过选择性电镀而不用导电路径制造高密度IC板的方法

    公开(公告)号:US20070158203A1

    公开(公告)日:2007-07-12

    申请号:US11330986

    申请日:2006-01-12

    申请人: Chien Chang Jen Fang

    发明人: Chien Chang Jen Fang

    IPC分类号: C25D5/02

    摘要: A method for fabricating the high-density IC substrate by selectively electroplating without the electrically conductive route is provided. In this method, the specific resin layer with thickness of 1-5 μm is coated on the matte side of the copper clad, and then the compound layer of the copper clad and the resin is attached to the build up material layer, such as glass-fiber reinforced resin layer by hot pressing technique. The specific resin layer has good adhesion to the electrically conductive layer so that the subsequent process can be performed well. In such a way, a very thin electrically conductive plating layer can be applied on the IC substrate to form high density lines, and another selectively plating can be performed on the IC substrate without the electrically conductive route by applying another electrically conductive layer on the IC substrate.

    摘要翻译: 提供了一种通过在没有导电路线的情况下选择性地电镀制造高密度IC基板的方法。 在该方法中,将厚度为1-5μm的特定树脂层涂覆在铜包层的无光泽面上,然后将铜包层和树脂的化合物层附着到诸如玻璃之类的堆积材料层上 - 热压技术的纤维增强树脂层。 特定的树脂层对导电层具有良好的粘合性,从而能够良好地进行后续的处理。 以这种方式,可以在IC基板上施加非常薄的导电镀层以形成高密度线,并且可以通过在IC上施加另一个导电层来在IC基板上进行另一个选择性镀覆而不进行导电路线 基质。