摘要:
A FinFET device and method for fabricating a FinFET device is disclosed. An exemplary method includes providing a semiconductor substrate; forming a first fin structure and a second fin structure over the semiconductor substrate; forming a gate structure over a portion of the first and second fin structures, such that the gate structure traverses the first and second fin structures; epitaxially growing a first semiconductor material on exposed portions of the first and second fin structures, such that the exposed portions of the first and second fin structures are merged together; and epitaxially growing a second semiconductor material over the first semiconductor material.
摘要:
A method for producing a SiGe stressor with high Ge concentration is provided. The method includes providing a semiconductor substrate with a source area, a drain area, and a channel in between; depositing the first SiGe film layer on the source area and/or the drain area; performing a low temperature thermal oxidation, e.g., a high water vapor pressure wet oxidation, to form an oxide layer at the top of the first SiGe layer and to form the second SiGe film layer with high Ge percentage at the bottom of the first SiGe film layer without Ge diffusion into the semiconductor substrate; performing a thermal diffusion to form the SiGe stressor from the second SiGe film layer, wherein the SiGe stressor provides uniaxial compressive strain on the channel; and removing the oxide layer. A Si cap layer can be deposited on the first SiGe film layer prior to performing oxidation.
摘要:
A structure for a field effect transistor on a substrate that includes a gate stack, an isolation structure and a source/drain (S/D) recess cavity below the top surface of the substrate disposed between the gate stack and the isolation structure. The recess cavity having a lower portion and an upper portion. The lower portion having a first strained layer and a first dielectric film. The first strained layer disposed between the isolation structure and the first dielectric film. A thickness of the first dielectric film less than a thickness of the first strained layer. The upper portion having a second strained layer overlying the first strained layer and first dielectric film.
摘要:
A FinFET device and method for fabricating a FinFET device is disclosed. An exemplary method includes providing a semiconductor substrate; forming a fin structure over the semiconductor substrate, the fin structure including a first material portion over the semiconductor substrate and a second material portion over the first material portion; forming a gate structure over a portion of the fin structure, such that the gate structure traverses the fin structure, thereby separating a source region and a drain region of the fin structure, wherein the source and drain regions of the fin structure define a channel therebetween; removing the second material portion from the source and drain regions of the fin structure; and after removing the second material portion, forming a third material portion in the source and drain regions of the fin structure.
摘要:
A FinFET device and method for fabricating a FinFET device is disclosed. An exemplary method includes providing a semiconductor substrate; forming a first fin structure and a second fin structure over the semiconductor substrate; forming a gate structure over a portion of the first and second fin structures, such that the gate structure traverses the first and second fin structures; epitaxially growing a first semiconductor material on exposed portions of the first and second fin structures, such that the exposed portions of the first and second fin structures are merged together; and epitaxially growing a second semiconductor material over the first semiconductor material.
摘要:
A FinFET device and method for fabricating a FinFET device is disclosed. An exemplary method includes providing a semiconductor substrate; forming a fin structure over the semiconductor substrate, the fin structure including a first material portion over the semiconductor substrate and a second material portion over the first material portion; forming a gate structure over a portion of the fin structure, such that the gate structure traverses the fin structure, thereby separating a source region and a drain region of the fin structure, wherein the source and drain regions of the fin structure define a channel therebetween; removing the second material portion from the source and drain regions of the fin structure; and after removing the second material portion, forming a third material portion in the source and drain regions of the fin structure.
摘要:
A connector assembly for connecting a peripheral device to a computer includes a male connector having a plurality of first connecting pins and a female connector having a plurality of second connecting pins. The plurality of first connecting pins is configured to connect to the peripheral device. The plurality of second connecting pins is configured to connect to the computer. The plurality of second connecting pins is defined on the first circuit board in a second row and a third row. The plurality of second connecting pins comprises a plurality of differential pairs, and each differential pair comprises two differential transmission lines. The two differential transmission lines of each of the plurality of differential pairs are defined on a single row of the second and third rows.
摘要:
A flexible liquid crystal display and a flexible fluid display are provided. The flexible liquid crystal display includes a first module, a second module, at least two supporting structures and a liquid crystal layer. The second module is disposed correspondingly to the first module. The supporting structures are separately disposed between the first module and the second module and used for abutting the first module and the second module, so that a space between the first module and the second module is divided into a flexible area and two non-flexible areas. The flexible area is located between the two non-flexible areas. The liquid crystal layer is disposed in the flexible area and the two non-flexible areas.
摘要:
A semiconductor device and method for fabricating a semiconductor device is disclosed. An exemplary semiconductor device includes a semiconductor substrate including an active region including a plurality of device regions. The semiconductor device further includes a first device disposed in a first device region of the plurality of device regions, the first device including a first gate structure, first gate spacers disposed on sidewalls of the first gate structure, and first source and drain features. The semiconductor device further includes a second device disposed in a second device region of the plurality of device regions, the second device including a second gate structure, second gate spacers disposed on sidewalls of the second gate structure, and second source and drain features. The second and first source and drain features having a source and drain feature and a contact feature in common. The common contact feature being a self-aligned contact.
摘要:
A display includes a flexible display panel having a back face, two backlight modules disposed on the back face of the display panel and each including a contact end, and an outer casing having two casing panels respectively connected to and supporting the backlight modules oppositely of the display panel. The casing panels are pivotal to move the backlight modules and the display panel between collapsed and non-collapsed positions. In the collapsed position, the display panel is folded, and the backlight modules are parallelly spaced apart. In the non-collapsed position, the display panel is laid flat, the backlight modules coplanarly cover the back face of the display panel, and the contact ends of the backlight modules abut against each other.