公开(公告)号：US20120103413A1

公开(公告)日：2012-05-03

申请号：US13347969

申请日：2012-01-11

申请人： Chin-Yao Tsai ,  Chih-Wei Chang ,  Ching-In Wu ,  Kai-Hsiang Chuang ,  Chih-Hsiung Chang ,  Kun-Chih Lin

发明人： Chin-Yao Tsai ,  Chih-Wei Chang ,  Ching-In Wu ,  Kai-Hsiang Chuang ,  Chih-Hsiung Chang ,  Kun-Chih Lin

IPC分类号： H01L31/02 ,  H01L31/18

CPC分类号： H01L31/03767 ,  C07C211/04 ,  C07C211/05 ,  H01L31/048 ,  H01L31/1864 ,  Y02E10/50 ,  Y02P70/521

摘要： A thin-film solar cell includes a body and a polymer layer. The body includes a first electrode layer, a photoelectric conversion layer, and a second electrode layer, and the polymer layer includes a hardening material and an interface material. The photoelectric conversion layer is disposed between the first electrode layer and the second electrode layer, and the polymer layer surrounds the photoelectric conversion layer, in which the interface material is used for bonding to the hardening material and the photoelectric conversion layer respectively. Therefore, the thin-film solar cell may reduce the Staebler-Wronski Effect generated by the photoelectric conversion layer in the photoelectric conversion procedure. Accordingly, the photoelectric conversion efficiency is improved.

摘要翻译： 薄膜太阳能电池包括主体和聚合物层。 主体包括第一电极层，光电转换层和第二电极层，聚合物层包括硬化材料和界面材料。 光电转换层设置在第一电极层和第二电极层之间，聚合物层围绕光电转换层，其中界面材料分别用于与硬化材料和光电转换层接合。 因此，薄膜太阳能电池可以减少由光电转换层产生的Staebler-Wronski效应。 因此，提高了光电转换效率。

公开(公告)号：US20150173225A1

公开(公告)日：2015-06-18

申请号：US14108339

申请日：2013-12-17

申请人： Cheng-Chao Peng ,  Ke-Sheng Huang ,  Yung-Chih Kuo ,  Chih-Wei Chang ,  Wen-Hua Yu ,  Yu-Yi Wu ,  Yu-Yuan Lin

发明人： Cheng-Chao Peng ,  Ke-Sheng Huang ,  Yung-Chih Kuo ,  Chih-Wei Chang ,  Wen-Hua Yu ,  Yu-Yi Wu ,  Yu-Yuan Lin

IPC分类号： H05K5/03 ,  H05K5/00 ,  H05K13/00 ,  H05K5/02

CPC分类号： G06F1/16 ,  G02F1/133308 ,  G02F2001/133317 ,  G02F2001/133322 ,  G02F2001/133325 ,  G06F1/1616 ,  G06F1/1637 ,  Y10T29/49826

摘要： A display device comprises a cover and a display module. The cover includes a bottom plate and at least one cover limit element. The cover limit element projects inwardly from an inner surface of the bottom of the cover. A space is formed between the bottom plate and the cover limit element. The display module includes a frame with at least one frame limit element disposed at an end of the frame and projecting at a position between the cover limit element and the bottom plate. The frame limit element is configured to be disposed in the space and between the cover limit element and the bottom plate to retain the display module with the cover.

摘要翻译： 显示装置包括盖和显示模块。 盖包括底板和至少一个盖限制元件。 盖限制元件从盖的底部的内表面向内突出。 在底板和盖限位元件之间形成空间。 显示模块包括框架，框架具有至少一个框架限制元件，该框架限定元件设置在框架的端部处，并且在覆盖限制元件和底板之间的位置处突出。 框架限制元件被配置为设置在空间中并且在盖限制元件和底板之间以将盖子保持在显示模块上。

公开(公告)号：US08541697B2

公开(公告)日：2013-09-24

申请号：US13031710

申请日：2011-02-22

申请人： Chih-Wei Chang

发明人： Chih-Wei Chang

IPC分类号： H05K5/06 ,  H04M1/00

CPC分类号： H04M1/0266

摘要： A dustproof structure is used in an electronic device, which includes a housing and a display panel. The dustproof structure includes a dustproof section and a first adhesive section. The dustproof section is located and received in the housing. The first adhesive section is fixed on the one side of the dustproof section, and the display panel is fixed on the dustproof structure by the first adhesive section and is assembled to the housing. The dustproof structure fills gaps between the housing and the display panel.

摘要翻译： 在电子设备中使用防尘结构，其包括壳体和显示面板。 防尘结构包括防尘部和第一粘合部。 防尘部分定位并接收在外壳中。 第一粘合部固定在防尘部的一侧，显示面板通过第一粘合部固定在防尘结构上，并组装到壳体。 防尘结构填充外壳和显示面板之间的间隙。

公开(公告)号：US20120092593A1

公开(公告)日：2012-04-19

申请号：US12970967

申请日：2010-12-17

申请人： Chih-Wei Chang ,  Po-Chun Hsu ,  Kun-Hung Hsieh

发明人： Chih-Wei Chang ,  Po-Chun Hsu ,  Kun-Hung Hsieh

IPC分类号： G02F1/1335 ,  H05K5/02 ,  F21V7/22

CPC分类号： G02B6/0085 ,  G02B6/0088 ,  G02B6/009

摘要： A frame formed by cutting and bending a plate base is provided. The maximum thickness of the frame is T, the thickness of the plate base is t, and 1.5t≦T≦2.5t. The frame includes a first plate element, a second plate element, and a bending portion. The second plate element is directly contacted to the first plate element, and the first plate element is substantially parallel to the second plate element. The bending portion is connected between the first plate element and the second plate element. A backlight module using the above-mentioned frame and a liquid crystal display (LCD) module using the backlight module are also provided.

摘要翻译： 提供了通过切割和弯曲板底座形成的框架。 框架的最大厚度为T，板底的厚度为t，1.5t＆nlE; T＆nlE; 2.5t。 框架包括第一板元件，第二板元件和弯曲部分。 第二板元件直接接触第一板元件，第一板元件基本上平行于第二板元件。 弯曲部分连接在第一板元件和第二板元件之间。 还提供了使用上述框架的背光模块和使用背光模块的液晶显示器（LCD）模块。

公开(公告)号：US20110090141A1

公开(公告)日：2011-04-21

申请号：US12684128

申请日：2010-01-08

申请人： Super Liao ,  Po-Chun Hsu ,  Chih-Wei Chang

发明人： Super Liao ,  Po-Chun Hsu ,  Chih-Wei Chang

IPC分类号： G09G3/36 ,  G02F1/13357

CPC分类号： G09G3/3426 ,  G02B6/0046 ,  G02B6/005 ,  G02B6/0068 ,  G02B6/008 ,  G02B6/0083 ,  G09G2300/0426 ,  G09G2320/0233

摘要： A backlight module including a light guide plate, light source sets, and controlling circuits is provided. The light guide plate has a plurality of regions, and each region of the light guide plate has a light incident surface correspondingly. Each light source set is disposed at the light incident surface of one of the regions of the light guide plate, and each light source set has at least one middle light source and at least one edge light source. The middle light source is disposed in a middle region of the light source set and the edge light source is disposed at an edge of the light source set. Each controlling circuit is electrically connected to the middle light source of one of the light source sets, and the edge light source of each light source set is electrically connected to the controlling circuit of the adjacent light source set.

摘要翻译： 提供了包括导光板，光源组和控制电路的背光模块。 导光板具有多个区域，导光板的各个区域相应地具有光入射面。 每个光源组设置在导光板的一个区域的光入射表面处，并且每个光源组具有至少一个中间光源和至少一个边缘光源。 中间光源设置在光源组的中间区域中，并且边缘光源设置在光源组的边缘。 每个控制电路电连接到一个光源组的中间光源，并且每个光源组的边缘光源电连接到相邻光源组的控制电路。

公开(公告)号：US07405151B2

公开(公告)日：2008-07-29

申请号：US11420900

申请日：2006-05-30

申请人： Gin Jei Wang ,  Chao-Hsien Peng ,  Chii-Ming Wu ,  Chih-Wei Chang ,  Shau-Lin Shue

发明人： Gin Jei Wang ,  Chao-Hsien Peng ,  Chii-Ming Wu ,  Chih-Wei Chang ,  Shau-Lin Shue

IPC分类号： H01L21/4763

CPC分类号： H01L21/76843 ,  H01L21/02129 ,  H01L21/022 ,  H01L21/0228 ,  H01L21/28562 ,  H01L21/31625 ,  H01L23/482 ,  H01L29/78 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for forming a semiconductor device is described. An opening is formed in a first dielectric layer, exposing an active region of the transistor, and an atomic layer deposited (ALD) TaN barrier is conformably formed in the opening, at a thickness less than 20 Å. A copper layer is formed over the atomic layer deposited (ALD) TaN barrier to fill the opening.

摘要翻译： 对半导体装置的形成方法进行说明。 在第一电介质层中形成开口，暴露晶体管的有源区，并且在开口中以厚度小于等于一致地形成原子层沉积（ALD）TaN势垒。 在原子层沉积（ALD）TaN势垒上形成铜层以填充开口。

公开(公告)号：US20080121929A1

公开(公告)日：2008-05-29

申请号：US11523683

申请日：2006-09-19

申请人： Jerry Lai ,  Chii-Ming Wu ,  Chih-Wei Chang ,  Shau-Lin Shue

发明人： Jerry Lai ,  Chii-Ming Wu ,  Chih-Wei Chang ,  Shau-Lin Shue

IPC分类号： H01L29/78

CPC分类号： H01L29/66636 ,  H01L21/26506 ,  H01L21/2652 ,  H01L29/165 ,  H01L29/665 ,  H01L29/6656 ,  H01L29/66621 ,  H01L29/7848 ,  Y10S438/933

摘要： A semiconductor structure includes a first silicon-containing layer comprising an element selected from the group consisting essentially of carbon and germanium wherein the silicon-containing layer has a first atomic percentage of the element to the element and silicon, a second silicon-containing layer comprising the element over the first silicon-containing layer, and a silicide layer on the second silicon-containing layer. The element in the second silicon-containing layer has a second atomic percentage of the element to the element and silicon, wherein the second atomic percentage is substantially lower than the first atomic percentage.

公开(公告)号：US20070284703A1

公开(公告)日：2007-12-13

申请号：US11447989

申请日：2006-06-07

申请人： Kuo-Liang Wu ,  Kuo-Shu Iu ,  Chih-Wei Chang

发明人： Kuo-Liang Wu ,  Kuo-Shu Iu ,  Chih-Wei Chang

IPC分类号： H01L23/495

CPC分类号： H01L23/49524 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L2224/37011 ,  H01L2224/40247 ,  H01L2224/40249 ,  H01L2224/84385 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2224/37099

摘要： A semiconductor package structure includes a substrate, a chip module, a lead frame, and a bridging element. The chip module is electrically connected to the substrate. The lead frame is disposed beside one side of the substrate, and the lead frame has a projecting block unit. The bridging element has one side electrically connected with the chip module, and a first positioning unit formed on the other side thereof for electrically retaining with the projecting block unit. Moreover, the semiconductor package structure of the present invention is applied to a design of multi-chip package, and ensures that a bridging element is connected with a chip via the bridging element being retained by a lead frame. In addition, the junction between the bridging element and the lead frame do not cause displacement between the lead frame and the bridging element during the packaging process.

摘要翻译： 半导体封装结构包括衬底，芯片模块，引线框架和桥接元件。 芯片模块电连接到基板。 引线框架设置在基板的一侧旁边，引线框架具有突出块单元。 桥接元件具有与芯片模块电连接的一侧，以及形成在其另一侧上用于与突出块单元电保持的第一定位单元。 此外，本发明的半导体封装结构应用于多芯片封装的设计，并且确保桥接元件通过由引线框架保持的桥接元件与芯片连接。 此外，在包装过程中，桥接元件和引线框架之间的连接点不会引起引线框架和桥接元件之间的位移。

公开(公告)号：US20070284678A1

公开(公告)日：2007-12-13

申请号：US11838376

申请日：2007-08-14

申请人： Chen-Tung Lin ,  Chih-Wei Chang ,  Chii-Ming Wu ,  Mei-Yun Wang ,  Chiang-Ming Chuang ,  Shau-Lin Shue

发明人： Chen-Tung Lin ,  Chih-Wei Chang ,  Chii-Ming Wu ,  Mei-Yun Wang ,  Chiang-Ming Chuang ,  Shau-Lin Shue

IPC分类号： H01L21/3205 ,  H01L29/45

CPC分类号： H01L29/66545 ,  H01L21/28061 ,  H01L21/28097 ,  H01L21/28525 ,  H01L21/76877 ,  H01L21/76889 ,  H01L23/485 ,  H01L2924/0002 ,  Y10S438/926 ,  H01L2924/00

摘要： A method of manufacturing a microelectronic device including forming a dielectric layer surrounding a dummy feature located over a substrate, removing the dummy feature to form an opening in the dielectric layer, and forming a metal-silicide layer conforming to the opening by a metal deposition process employing a target which includes metal and silicon. The metal-silicide layer may then be annealed.

摘要翻译： 一种制造微电子器件的方法，包括形成围绕位于衬底上的虚拟特征的介电层，去除虚拟特征以在电介质层中形成开口，以及通过金属沉积工艺形成符合开口的金属硅化物层 使用包括金属和硅的靶。 然后可以将金属硅化物层退火。

公开(公告)号：US20070278638A1

公开(公告)日：2007-12-06

申请号：US11445169

申请日：2006-06-02

申请人： Kuo-Liang Wu ,  Kuo-Shu Lu ,  Chih-Wei Chang

发明人： Kuo-Liang Wu ,  Kuo-Shu Lu ,  Chih-Wei Chang

IPC分类号： H01L23/02

CPC分类号： H01L23/49524 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L2224/37011 ,  H01L2224/40095 ,  H01L2224/40247 ,  H01L2224/40249 ,  H01L2224/84385 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2224/37099

摘要： A semiconductor package structure includes a substrate, a chip module, a lead frame, and a bridging element. The chip module is electrically connected to the substrate. The lead frame is disposed beside one side of the substrate, wherein the lead frame has a receiving unit. The bridging element has one side electrically connected with the chip module, and the bridging element has a positioning unit is formed on the other side thereof for electrically retaining in the receiving unit. Moreover, the semiconductor package structure of the present invention is applied to the design of multi-chip package, and ensures that a bridging element is connected with a chip via the bridging element retained with a lead frame. In addition, the junction between the bridging element and the lead frame do not cause displacement between the lead frame and the bridging element during the packaging process.

摘要翻译： 半导体封装结构包括衬底，芯片模块，引线框架和桥接元件。 芯片模块电连接到基板。 引线框架设置在基板的一侧旁边，其中引线框架具有接收单元。 桥接元件具有与芯片模块电连接的一侧，并且桥接元件具有定位单元，其形成在其另一侧上，用于保持在接收单元中。 此外，本发明的半导体封装结构适用于多芯片封装的设计，并且确保桥接元件经由引线框架保持的桥接元件与芯片连接。 此外，在包装过程中，桥接元件和引线框架之间的连接点不会引起引线框架和桥接元件之间的位移。