Method for fabricating at least one mesa or ridge structure or at least one electrically pumped region in a layer or layer sequence
    1.
    发明授权
    Method for fabricating at least one mesa or ridge structure or at least one electrically pumped region in a layer or layer sequence 有权
    用于在层或层序列中制造至少一个台面或脊结构或至少一个电泵浦区域的方法

    公开(公告)号:US07008810B2

    公开(公告)日:2006-03-07

    申请号:US10804514

    申请日:2004-03-19

    IPC分类号: H01L21/00

    摘要: A method for fabricating at least one mesa or ridge structure in a layer or layer sequence, in which a sacrificial layer (4) is applied and patterned above the layer or layer sequence. A mask layer is applied and patterned above the sacrificial layer for definition of the mesa or ridge dimensions. The sacrificial layer (4) and of the layer or layer sequence are removed so that the mesa or ridge structure is formed in the layer or layer sequence. A part of the sacrificial layer (4) is selectively removed from the side areas thereof which have been uncovered in the previous step, so that a sacrificial layer remains which is narrower in comparison with a layer that has remained above the sacrificial layer as seen from the layer or layer sequence. A coating is applied at least to the sidewalls of the structure produced in the previous steps so that the side areas of the residual sacrificial layer are not completely overformed by the coating material. The sacrificial layer (4) is removed so that the layer that has remained above the sacrificial layer as seen from the layer or layer sequence is lifted off. A method is also disclosed for fabricating at least one gain-controlled laser diode in a layer sequence, in which method steps analogous to those described above are employed.

    摘要翻译: 一种用于在层或层序列中制造至少一个台面或脊状结构的方法,其中牺牲层(4)被施加并在层或层序列上形成图案。 掩模层被施加和图案化在牺牲层上方以定义台面或脊尺寸。 去除牺牲层(4)和层或层序列,使得台层或脊结构以层或层序列形成。 牺牲层(4)的一部分从其前面的步骤中未被覆盖的侧面区域选择性地去除,从而与牺牲层上方的层相比较,牺牲层保持较窄,如从 层或层序列。 至少将涂层施加到在前述步骤中制造的结构的侧壁上,使得残余牺牲层的侧面区域不会被涂层材料完全覆盖。 去除牺牲层(4),使得从层或层序列看到的保留在牺牲层上方的层被提升。 还公开了一种用于在层序列中制造至少一个增益控制的激光二极管的方法,其中采用与上述类似的方法步骤。