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    Integrated circuit devices with ESD protection in scribe line, and methods for fabricating same
    2.
    发明授权
    Integrated circuit devices with ESD protection in scribe line, and methods for fabricating same 有权
    在划线中具有ESD保护的集成电路器件及其制造方法

    公开(公告)号：US08372729B1

    公开(公告)日：2013-02-12

    申请号：US13285928

    申请日：2011-10-31

    申请人： Chuan-Cheng Cheng ,  Choy Hing Li ,  Shuhua Yu

    发明人： Chuan-Cheng Cheng ,  Choy Hing Li ,  Shuhua Yu

    IPC分类号： H01L23/48 ,  H01L23/58 ,  H01L23/485

    CPC分类号： H01L23/60 ,  H01L22/14 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor wafer including an electrostatic discharge (ESD) protective device, and methods for fabricating the same. In one aspect, the method includes forming a first semiconductor device in a first semiconductor die region on the semiconductor wafer; forming a second semiconductor device in a second semiconductor die region on the semiconductor wafer; and forming a protective device in a scribe line region between (i) the first semiconductor die region and (ii) the second semiconductor die region.

    摘要翻译： 包括静电放电（ESD）保护装置的半导体晶片及其制造方法。 一方面，该方法包括在半导体晶片上的第一半导体管芯区域中形成第一半导体器件; 在所述半导体晶片上的第二半导体管芯区域中形成第二半导体器件; 以及在（i）第一半导体管芯区域和（ii）第二半导体管芯区域之间的划线区域中形成保护器件。

    Fuse structures, methods of making and using the same, and integrated circuits including the same
    3.
    发明授权
    Fuse structures, methods of making and using the same, and integrated circuits including the same 失效
    保险丝结构，制造和使用它们的方法以及包括其的集成电路

    公开(公告)号：US07589363B1

    公开(公告)日：2009-09-15

    申请号：US11805290

    申请日：2007-05-22

    申请人： Chuan-Cheng Cheng ,  Shuhua Yu ,  Roawen Chen ,  Albert Wu

    发明人： Chuan-Cheng Cheng ,  Shuhua Yu ,  Roawen Chen ,  Albert Wu

    IPC分类号： H01L27/10 ,  H01L29/00

    CPC分类号： H01L23/5258 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A structure configured to disconnect circuit elements. The structure generally includes a dielectric layer over a light-absorbing structure, and a lens over the dielectric layer and the light-absorbing structure, configured to at least partially focus light onto the light-absorbing structure. The light-absorbing structure absorbs a first wavelength of light with a minimum threshold efficiency, the lens is substantially opaque to the first wavelength of light, and the dielectric layer is substantially transparent to the first wavelength of light. The structure advantageously provides improved reliability and smaller chip area, thereby increasing the yield of the manufacturing process and the numbers of die per wafer (both gross and good).

    摘要翻译： 被配置为断开电路元件的结构。 该结构通常包括在光吸收结构上的电介质层，以及在电介质层和光吸收结构上的透镜，被配置为至少部分地将光聚焦到光吸收结构上。 光吸收结构以最小阈值效率吸收第一波长的光，透镜对于第一波长的光是基本上不透明的，并且电介质层对于第一波长的光是基本透明的。 该结构有利地提供改进的可靠性和更小的芯片面积，从而提高制造工艺的产量和每个晶片的模具数量（总和良好）。

    Fuse structures, methods of making and using the same, and integrated circuits including the same
    5.
    发明授权
    Fuse structures, methods of making and using the same, and integrated circuits including the same 有权
    保险丝结构，制造和使用它们的方法以及包括其的集成电路

    公开(公告)号：US07704805B1

    公开(公告)日：2010-04-27

    申请号：US12012723

    申请日：2008-02-04

    申请人： Chuan-Cheng Cheng ,  Shuhua Yu ,  Roawen Chen ,  Albert Wu

    发明人： Chuan-Cheng Cheng ,  Shuhua Yu ,  Roawen Chen ,  Albert Wu

    IPC分类号： H01L21/82 ,  H01L21/8238 ,  H01L21/336

    CPC分类号： H01L23/5258 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A fuse structure, an integrated circuit including the structure, and methods for making the structure and (re)configuring a circuit using the fuse. The fuse structure generally includes (a) a conductive structure with at least two circuit elements electrically coupled thereto, (b) a dielectric layer over the conductive structure, and (c) a first lens over both the first dielectric layer and the conductive structure configured to at least partially focus light onto the conductive structure. The method of making the structure generally includes the steps of (1) forming a conductive structure electrically coupled to first and second circuit elements, (2) forming a dielectric layer thereover, and (3) forming a lens on or over the dielectric layer and over the conductive structure, the lens being configured to at least partially focus light onto the conductive structure. The method of (re)configuring a circuit generally includes the steps of (i) irradiating at least one lens on or near a surface of the circuit sufficient to electrically disconnect a corresponding first fuse positioned under the lens and disable a first configuration of the circuit, and (ii) irradiating at least one other lens on or near the surface of the circuit sufficient to electrically disconnect a corresponding second fuse positioned under that lens and enable a second configuration of the circuit. The structure and methods advantageously provide fuse structures having improved reliability and smaller chip area, thereby increasing the yield of the manufacturing process and the numbers of die per wafer (both gross and good).

    摘要翻译： 保险丝结构，包括该结构的集成电路，以及使用该保险丝的结构和（重新）配置电路的方法。 熔丝结构通常包括（a）具有至少两个电耦合到其上的电路元件的导电结构，（b）导电结构上的电介质层，和（c）第一介电层和导电结构上的第一透镜， 以至少部分地将光聚焦到导电结构上。 制造该结构的方法通常包括以下步骤：（1）形成电耦合到第一和第二电路元件的导电结构，（2）在其上形成介电层，和（3）在电介质层上或之上形成透镜， 在导电结构之上，透镜被配置为至少部分地将光聚焦到导电结构上。 （重新）配置电路的方法通常包括以下步骤：（i）在电路表面上或附近照射足够的电气断开位于透镜下方的对应的第一保险丝的至少一个透镜，并且禁用电路的第一配置 ，以及（ii）在该电路表面上或其附近照射至少一个其他透镜，足以使位于该透镜下方的对应的第二保险丝电气断开并使电路能够进行第二配置。 该结构和方法有利地提供具有改善的可靠性和更小的芯片面积的熔丝结构，从而提高制造工艺的产量和每个晶片的模具数量（总和良好）。

    Methods of making and using fuse structures, and integrated circuits including the same
    6.
    发明授权
    Methods of making and using fuse structures, and integrated circuits including the same 有权
    制造和使用熔丝结构的方法，以及包括其的集成电路

    公开(公告)号：US07820493B1

    公开(公告)日：2010-10-26

    申请号：US12012724

    申请日：2008-02-04

    申请人： Chuan-Cheng Cheng ,  Shuhua Yu ,  Roawen Chen ,  Albert Wu

    发明人： Chuan-Cheng Cheng ,  Shuhua Yu ,  Roawen Chen ,  Albert Wu

    IPC分类号： H01L27/10 ,  H01L21/8239

    CPC分类号： H01L23/5258 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A fuse structure, an integrated circuit including the structure, and methods for making the structure and (re)configuring a circuit using the fuse. The fuse structure generally includes (a) a conductive structure with at least two circuit elements electrically coupled thereto, (b) a dielectric layer over the conductive structure, and (c) a first lens over both the first dielectric layer and the conductive structure configured to at least partially focus light onto the conductive structure. The method of making the structure generally includes the steps of (1) forming a conductive structure electrically coupled to first and second circuit elements, (2) forming a dielectric layer thereover, and (3) forming a lens on or over the dielectric layer and over the conductive structure, the lens being configured to at least partially focus light onto the conductive structure. The method of (re)configuring a circuit generally includes the steps of (i) irradiating at least one lens on or near a surface of the circuit sufficient to electrically disconnect a corresponding first fuse positioned under the lens and disable a first configuration of the circuit, and (ii) irradiating at least one other lens on or near the surface of the circuit sufficient to electrically disconnect a corresponding second fuse positioned under that lens and enable a second configuration of the circuit. The structure and methods advantageously provide fuse structures having improved reliability and smaller chip area, thereby increasing the yield of the manufacturing process and the numbers of die per wafer (both gross and good).

    摘要翻译： 保险丝结构，包括该结构的集成电路，以及使用该保险丝的结构和（重新）配置电路的方法。 熔丝结构通常包括（a）具有至少两个电耦合到其上的电路元件的导电结构，（b）导电结构上的电介质层，和（c）第一介电层和导电结构上的第一透镜， 以至少部分地将光聚焦到导电结构上。 制造该结构的方法通常包括以下步骤：（1）形成电耦合到第一和第二电路元件的导电结构，（2）在其上形成介电层，和（3）在电介质层上或之上形成透镜， 在导电结构之上，透镜被配置为至少部分地将光聚焦到导电结构上。 （重新）配置电路的方法通常包括以下步骤：（i）在电路表面上或附近照射足够的电气断开位于透镜下方的对应的第一保险丝的至少一个透镜，并且禁用电路的第一配置 ，以及（ii）在该电路表面上或其附近照射至少一个其他透镜，足以使位于该透镜下方的对应的第二保险丝电气断开并使电路能够进行第二配置。 该结构和方法有利地提供具有改善的可靠性和更小的芯片面积的熔丝结构，从而提高制造工艺的产量和每个晶片的模具数量（总和良好）。

    Fuse structures, methods of making and using the same, and integrated circuits including the same
    7.
    发明授权
    Fuse structures, methods of making and using the same, and integrated circuits including the same 有权
    保险丝结构，制造和使用它们的方法以及包括其的集成电路

    公开(公告)号：US07344924B1

    公开(公告)日：2008-03-18

    申请号：US11136925

    申请日：2005-05-24

    申请人： Chuan-Cheng Cheng ,  Shuhua Yu ,  Roawen Chen ,  Albert Wu

    发明人： Chuan-Cheng Cheng ,  Shuhua Yu ,  Roawen Chen ,  Albert Wu

    IPC分类号： H01L21/82

    CPC分类号： H01L23/5258 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A fuse structure, an integrated circuit including the structure, and methods for making the structure and (re)configuring a circuit using the fuse. The fuse structure generally includes (a) a conductive structure with at least two circuit elements electrically coupled thereto, (b) a dielectric layer over the conductive structure, and (c) a first lens over both the first dielectric layer and the conductive structure configured to at least partially focus light onto the conductive structure. The method of making the structure generally includes the steps of (1) forming a conductive structure electrically coupled to first and second circuit elements, (2) forming a dielectric layer thereover, and (3) forming a lens on or over the dielectric layer and over the conductive structure, the lens being configured to at least partially focus light onto the conductive structure. The method of (re)configuring a circuit generally includes the steps of (i) irradiating at least one lens on or near a surface of the circuit sufficient to electrically disconnect a corresponding first fuse positioned under the lens and disable a first configuration of the circuit, and (ii) irradiating at least one other lens on or near the surface of the circuit sufficient to electrically disconnect a corresponding second fuse positioned under that lens and enable a second configuration of the circuit. The structure and methods advantageously provide fuse structures having improved reliability and smaller chip area, thereby increasing the yield of the manufacturing process and the numbers of die per wafer (both gross and good).

    摘要翻译： 保险丝结构，包括该结构的集成电路，以及使用该保险丝的结构和（重新）配置电路的方法。 熔丝结构通常包括（a）具有至少两个电耦合到其上的电路元件的导电结构，（b）导电结构上的电介质层，和（c）第一介电层和导电结构上的第一透镜， 以至少部分地将光聚焦到导电结构上。 制造该结构的方法通常包括以下步骤：（1）形成电耦合到第一和第二电路元件的导电结构，（2）在其上形成介电层，和（3）在电介质层上或之上形成透镜， 在导电结构之上，透镜被配置为至少部分地将光聚焦到导电结构上。 （重新）配置电路的方法通常包括以下步骤：（i）在电路表面上或附近照射足够的电气断开位于透镜下方的对应的第一保险丝的至少一个透镜，并且禁用电路的第一配置 ，以及（ii）在该电路表面上或其附近照射至少一个其他透镜，足以使位于该透镜下方的对应的第二保险丝电气断开并使电路能够进行第二配置。 该结构和方法有利地提供具有改善的可靠性和更小的芯片面积的熔丝结构，从而提高制造工艺的产量和每个晶片的模具数量（总和良好）。

    Fuse structures, methods of making and using the same, and integrated circuits including the same
    9.
    发明授权
    Fuse structures, methods of making and using the same, and integrated circuits including the same 有权
    保险丝结构，制造和使用它们的方法以及包括其的集成电路

    公开(公告)号：US06940107B1

    公开(公告)日：2005-09-06

    申请号：US10734779

    申请日：2003-12-12

    申请人： Chuan-Cheng Cheng ,  Shuhua Yu ,  Roawen Chen ,  Albert Wu

    发明人： Chuan-Cheng Cheng ,  Shuhua Yu ,  Roawen Chen ,  Albert Wu

    IPC分类号： H01L23/525 ,  H01L27/10

    CPC分类号： H01L23/5258 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A fuse structure, an integrated circuit including the structure, and methods for making the structure and (re)configuring a circuit using the fuse. The fuse structure generally includes (a) a conductive structure with at least two circuit elements electrically coupled thereto, (b) a dielectric layer over the conductive structure, and (c) a first lens over both the first dielectric layer and the conductive structure configured to at least partially focus light onto the conductive structure. The method of making the structure generally includes the steps of (1) forming a conductive structure electrically coupled to first and second circuit elements, (2) forming a dielectric layer thereover, and (3) forming a lens on or over the dielectric layer and over the conductive structure, the lens being configured to at least partially focus light onto the conductive structure. The method of (re)configuring a circuit generally includes the steps of (i) irradiating at least one lens on or near a surface of the circuit sufficient to electrically disconnect a corresponding first fuse positioned under the lens and disable a first configuration of the circuit, and (ii) irradiating at least one other lens on or near the surface of the circuit sufficient to electrically disconnect a corresponding second fuse positioned under that lens and enable a second configuration of the circuit. The structure and methods advantageously provide fuse structures having improved reliability and smaller chip area, thereby increasing the yield of the manufacturing process and the numbers of die per wafer (both gross and good).

    摘要翻译： 保险丝结构，包括该结构的集成电路，以及使用该保险丝的结构和（重新）配置电路的方法。 熔丝结构通常包括（a）具有至少两个电耦合到其上的电路元件的导电结构，（b）导电结构上的电介质层，和（c）第一介电层和导电结构上的第一透镜， 以至少部分地将光聚焦到导电结构上。 制造该结构的方法通常包括以下步骤：（1）形成电耦合到第一和第二电路元件的导电结构，（2）在其上形成介电层，和（3）在电介质层上或之上形成透镜， 在导电结构之上，透镜被配置为至少部分地将光聚焦到导电结构上。 （重新）配置电路的方法通常包括以下步骤：（i）在电路表面上或附近照射足够的电气断开位于透镜下方的对应的第一保险丝的至少一个透镜，并且禁用电路的第一配置 ，以及（ii）在该电路表面上或其附近照射至少一个其他透镜，足以使位于该透镜下方的对应的第二保险丝电气断开并使电路能够进行第二配置。 该结构和方法有利地提供具有改善的可靠性和更小的芯片面积的熔丝结构，从而提高制造工艺的产量和每个晶片的模具数量（总和良好）。